格隆汇9月10日丨澄天伟业(300689.SZ)公布，实际控制人、持股5%以上股东、董事长兼总经理冯学裕先 生及其一致行动人冯澄天女士计划自本公告披露之日起十五个交易日后的三个月内（2025年10月10日至 2026年1月9日，根据中国证监会及深圳证券交易所相关规定禁止减持的期间除外）以集中竞价或大宗交 易方式减持公司股份不超过3,418,674股，占公司已发行股份的2.96%（占剔除公司回购股份后总股本的 2.98%）。 ...

智通财经APP讯，澄天伟业(300689.SZ)发布公告，公司实际控制人、持股5%以上股东、董事长兼总经 理冯学裕先生及其一致行动人冯澄天女士计划自公告披露之日起十五个交易日后的三个月内(2025年10 月10日至2026年1月9日，根据中国证监会及深圳证券交易所相关规定禁止减持的期间除外)以集中竞价 或大宗交易方式减持公司股份不超过341.87万股，占公司已发行股份的2.96%(占剔除公司回购股份后总 股本的2.98%)。 ...

澄天伟业公告，公司实际控制人冯学裕及一致行动人冯澄天计划自公告披露之日起十五个交易日后的三 个月内，即2025年10月10日至2026年1月9日，通过集中竞价或大宗交易方式合计减持不超过341.87万 股，占公司已发行股份的2.96%（占剔除公司回购股份后总股本的2.98%）。其中，冯学裕减持上限 213.08万股，占1.84%；冯澄天减持上限128.79万股，占1.11%。 ...

澄天伟业(300689.SZ)公告称，公司实际控制人、持股5%以上股东、董事长兼总经理冯学裕及其一致行 动人冯澄天计划自公告披露之日起十五个交易日后的三个月内，以集中竞价或大宗交易方式减持公司股 份不超过3,418,674股，占公司已发行股份的2.96%。减持原因为个人资金需求，减持价格将根据市场情 况及二级市场价格确定。 ...

证券代码：300689 证券简称：澄天伟业 公告编号：2025-031 深圳市澄天伟业科技股份有限公司 关于股东减持股份的预披露公告 公司实际控制人冯学裕先生及其一致行动人冯澄天女士保证向本公司提供的信息内 容真实、准确、完整、没有虚假记载、误导性陈述或重大遗漏。 公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 特别提示： 深圳市澄天伟业科技股份有限公司（以下简称"公司"）实际控制人、持股 5%以上股东、董事长兼总经理冯学裕先生及其一致行动人冯澄天女士计划自本公 告披露之日起十五个交易日后的三个月内（2025 年 10 月 10 日至 2026 年 1 月 9 日，根据中国证监会及深圳证券交易所相关规定禁止减持的期间除外）以集中竞 价或大宗交易方式减持公司股份不超过 3,418,674 股，占公司已发行股份的 2.96%（占剔除公司回购股份后总股本的 2.98%）。 公司近日收到公司实际控制人、持股 5%以上股东、董事长兼总经理冯学裕 先生及其一致行动人冯澄天女士出具的《关于股份减持计划的告知函》，根据《上 市公司股东减持股份管理暂行办法》《深圳证券交易所上市公司自律监管指引第 18 号—— ...

澄天伟业（300689.SZ）9月9日在投资者互动平台表示，目前公司液冷板产品已完成初步研发验证，并 进入多个客户的样品测试环节，涵盖国内头部服务器厂商、AI算力平台建设单位，以及部分外资品牌 在华ODM/整机集成商。相关测试工作主要聚焦于散热性能、机械兼容性、可靠性验证等维度，部分客 户已完成首轮测试并反馈积极，客户信息受限于商业保密原则与协议约定无法披露，望您理解。公司将 持续推动产品优化与客户认证进程，力争尽快实现批量交付。公司新产品新技术如有重大进展，相关内 容将于定期报告或临时公告中及时披露。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：贵公司的液冷板套件采用自研纳米注塑工艺，宣称在 结构一体化、导热效率上具备'无同质化竞争'，请问当前测试客户是否包含浪潮、曙光、华为等一线服 务器品牌？从样品测试到批量订单的转化周期预计多久？是否有意向签订相关订单？ ...

Group 1 - The core viewpoint of the articles highlights the strong performance and strategic expansion of Cheng Tian Wei Ye Technology Co., Ltd. in the smart card and semiconductor packaging materials sectors, showcasing its innovative capabilities and market positioning [2][3] - In the first half of 2025, the company reported a revenue of 210 million yuan, representing a year-on-year increase of 32.91%, and a net profit attributable to shareholders of 10.8764 million yuan, which saw a significant growth of 562.05% [2] - The company has achieved full industry chain coverage in the smart card sector, becoming the first one-stop service provider in the industry, with a higher proportion of high-margin smart card service orders [2] Group 2 - The global smart card market is experiencing structural growth opportunities, particularly in regions like Southeast Asia, the Middle East, and Africa, where there is significant growth potential [3] - Cheng Tian Wei Ye has implemented a strategy to extend its industrial chain and explore new fields, with semiconductor packaging materials and digital energy thermal management becoming new growth drivers, showing a 145.28% year-on-year increase in orders for semiconductor packaging materials [3] - The company's financial fundamentals remain robust, with a cash balance of 127 million yuan at the end of the period, reflecting a 3.57% increase from the previous year, and a net cash flow from operating activities growing by 2.88% [3]

Group 1 - The company reported a revenue of 210 million yuan for the first half of 2025, representing a year-on-year growth of 32.91% [1] - Net profit reached 10.8764 million yuan, showing a significant increase of 562.05% year-on-year [1] - The company's smart card business is experiencing steady growth, with emerging fields such as semiconductor packaging materials and digital energy thermal management demonstrating strong innovation and strategic advancement [1] Group 2 - The company has achieved full industry chain coverage from chip application research and development, module packaging, smart card production and sales research to terminal applications [1] - The proportion of high-margin smart card one-stop service orders has increased during the reporting period [1] - The global smart card market is undergoing structural growth opportunities, with significant growth potential in regions such as Southeast Asia, the Middle East, and Africa [1] Group 3 - The company is implementing a development strategy of "extending the industrial chain and expanding new fields," with semiconductor packaging materials and digital energy thermal management becoming new growth drivers [2] - Orders for semiconductor packaging materials increased by 145.28% year-on-year in the first half of the year [2] - The company has completed the technical research and production line construction for copper pin heat dissipation base plates, upgrading product structure to meet high-demand applications such as IGBT and SiC power module packaging [2] Group 4 - The company's self-developed liquid cooling plates have competitive advantages in structural integration, thermal conductivity, and pressure resistance [2] - Related products are primarily aimed at high heat dissipation scenarios such as AI servers and high-performance computing [2] - The products have passed multiple rounds of technical validation and have received sample testing certification from some customers [2]

Core Insights - The company reported a total revenue of 210 million yuan for the first half of 2025, an increase of 51.89 million yuan, representing a year-on-year growth of 32.91% [1] - The net profit attributable to shareholders reached 10.87 million yuan, up by 9.23 million yuan, reflecting a significant year-on-year increase of 562.05% [1] - The net cash inflow from operating activities was 22.25 million yuan, ranking 21st among disclosed peers, with a year-on-year increase of 623,500 yuan, or 2.88% [1] Financial Ratios - The latest debt-to-asset ratio stands at 12.41%, ranking 6th among disclosed peers [3] - The gross profit margin is 18.14%, an increase of 1.97 percentage points compared to the same period last year [3] - The return on equity (ROE) is 1.58%, up by 1.33 percentage points year-on-year [3] Earnings Per Share and Turnover Ratios - The diluted earnings per share is 0.10 yuan, an increase of 0.08 yuan, representing a year-on-year growth of 562.50% [3] - The total asset turnover ratio is 0.27 times, ranking 28th among disclosed peers, with a year-on-year increase of 0.06 times, or 29.02% [3] - The inventory turnover ratio is 3.90 times, ranking 1st among disclosed peers, with a year-on-year increase of 0.37 times, or 10.52% [3] Shareholder Information - The number of shareholders is 8,133, with the top ten shareholders holding 78 million shares, accounting for 67.47% of the total share capital [3] - The largest shareholder is Shenzhen Chengtian Shengye Investment Co., Ltd., holding 41.2 million shares [3]

Core Viewpoint - Cheng Tian Wei Ye (300689.SZ) reported impressive performance in its 2025 semi-annual report, showcasing robust growth in its smart card business while actively expanding into emerging fields such as semiconductor packaging materials and digital energy thermal management, reflecting strong innovation and strategic execution capabilities [2][3]. Financial Performance - The company's revenue reached 210 million yuan, a year-on-year increase of 32.91% [3] - Net profit attributable to shareholders was 10.8764 million yuan, a significant rise of 562.05% year-on-year [3] - The net profit after deducting non-recurring gains and losses turned from loss to profit, increasing by 387.93% year-on-year, indicating substantial growth across multiple metrics [3]. Smart Card Business - As a leading player in the domestic smart card industry, Cheng Tian Wei Ye has achieved full industry chain coverage from chip application research and development to terminal applications, becoming the first one-stop service provider in the industry [4] - The proportion of high-margin one-stop service orders for smart cards increased during the reporting period, supported by deepening strategic cooperation with major telecom operators [4] - The global smart card market is experiencing structural growth opportunities, particularly in Southeast Asia, the Middle East, and Africa, where significant growth potential exists [4]. Emerging Business Growth - The semiconductor packaging materials and digital energy thermal management sectors are emerging as new growth drivers, with semiconductor packaging materials orders increasing by 145.28% year-on-year [5] - The company has completed the technical development and production line construction for copper pin heat dissipation substrates, upgrading its product structure to meet high-demand applications in new energy vehicles and AI [5]. - The self-developed liquid cooling plates in the digital and energy thermal management sector demonstrate competitive advantages in efficiency and cost, targeting high-heat-demand scenarios such as AI servers and high-performance computing [5]. Financial Health - The company maintains a healthy financial structure, with cash and cash equivalents at 127 million yuan, a 3.57% increase from the previous year, primarily due to increased sales collections [7] - The net cash flow from operating activities grew by 2.88% year-on-year, indicating good cash flow management capabilities [7]. R&D and Innovation - Cheng Tian Wei Ye emphasizes technology research and development, with R&D investment increasing by 9.59% year-on-year [8] - The company is implementing a new employee stock ownership plan to enhance long-term incentive mechanisms, boosting team motivation and creativity [8] - The global semiconductor market is expanding, with AI driving explosive demand for computing power, and the liquid cooling server market is expected to grow at a compound annual growth rate of 46.8% [8].