根据《中华人民共和国公司法》（以下简称"《公司法》"）、《深圳证券交易所 创业板股票上市规则》《上市公司独立董事管理办法》《深圳证券交易所上市公司 自律监管指引第 2 号——创业板上市公司规范运作》等法律法规、规范性文件及 《公司章程》《董事会提名委员会工作细则》等有关规定，深圳市澄天伟业科技 股份有限公司（以下简称"公司"）第五届董事会提名委员会召开会议，对拟提 交公司第五届董事会第七次会议审议的《关于增选第五届董事会独立董事候选人 的议案》进行了认真审阅，对独立董事候选人的任职资格进行了审查并发表意见 如下： 经审查，提名委员会认为：公司第五届董事会独立董事候选人周红女士具备 《公司法》《上市公司独立董事管理办法》《深圳证券交易所上市公司自律监管指 引第 2 号——创业板上市公司规范运作》等法律法规所规定的担任上市公司董事、 独立董事的任职条件、专业背景和工作经验，符合相关法律法规所规定的任职资 格和独立性等要求。上述候选人不存在相关法律法规和《公司章程》中规定的不 得担任董事、独立董事的情形，不存在被中国证监会确定为市场禁入者且尚未解 除的情况，未被中国证监会在证券期货市场违法失信信息公开查询平台公示， ...

证券代码：300689 证券简称：澄天伟业 公告编号：2025-043 深圳市澄天伟业科技股份有限公司 关于召开 2025 年第二次临时股东会的通知 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误导性陈述或重 大遗漏。 一、召开会议的基本情况 1、股东会届次：2025 年第二次临时股东会 3、本次会议的召集、召开符合《中华人民共和国公司法》《深圳证券交易所创业板 股票上市规则》《深圳证券交易所上市公司自律监管指引第 2 号—创业板上市公司规范运 作》等法律、行政法规、部门规章、规范性文件及《公司章程》的有关规定。 4、会议时间： （1）现场会议时间：2025 年 12 月 19 日 15:00 （2）网络投票时间：通过深圳证券交易所系统进行网络投票的具体时间为 2025 年 12 月 19 日 9:15-9:25，9:30-11:30，13:00-15:00；通过深圳证券交易所互联网投票系统投 票的具体时间为 2025 年 12 月 19 日 9:15 至 15:00 的任意时间。 5、会议的召开方式：现场表决与网络投票相结合。 6、会议的股权登记日：2025 年 12 月 12 ...

证券代码：300689 证券简称：澄天伟业 公告编号：2025-041 深圳市澄天伟业科技股份有限公司 第五届董事会第七次会议决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 一、董事会会议召开情况 深圳市澄天伟业科技股份有限公司（以下简称"公司"）第五届董事会第七 次会议通知于 2025 年 11 月 30 日以邮件的形式发出，会议于 2025 年 12 月 3 日 上午 10:00 在公司会议室以现场和通讯方式召开。本次会议应出席董事 5 名，亲 自出席董事 5 名（其中，董事冯学裕现场出席会议，其他董事以视频方式参加会 议）。本次会议由董事长冯学裕主持，公司监事及高级管理人员列席了会议。本 次董事会会议的召集、召开符合有关法律、行政法规、部门规章、规范性文件和 《公司章程》的规定。 二、董事会会议审议情况 1、审议通过了《关于修订〈公司章程〉的议案》 根据《公司法》《证券法》《上市公司章程指引》《深圳证券交易所创业板股 票上市规则》《深圳证券交易所上市公司自律监管指引第 2 号——创业板上市公 司规范运作》等相关法律法规、规范性文件的规定，结合公 ...

权益变动触及 1%整数倍的公告 股东冯学裕、冯澄天保证向本公司提供的信息内容真实、准确、完整、没有虚假记 载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 证券代码：300689 证券简称：澄天伟业 公告编号：2025-040 深圳市澄天伟业科技股份有限公司 关于控股股东、实际控制人及一致行动人 深圳市澄天伟业科技股份有限公司（以下简称"公司"）于 2025 年 9 月 10 日披露了《关于股东减持股份的预披露公告》（公告编号：2025-031），因个人 资金需求，公司实际控制人、持股 5%以上股东、董事长兼总经理冯学裕先生及 其一致行动人冯澄天女士计划自该公告披露之日起十五个交易日后的三个月内 （2025 年 10 月 10 日至 2026 年 1 月 9 日，根据中国证监会及深圳证券交易所相 关规定禁止减持的期间除外）以集中竞价或大宗交易方式减持公司股份不超过 3,418,674 股，占公司已发行股份的 2.96%（占剔除公司回购股份后总股本的 2.98%）。 公司近日收到公司实际控制人、持股 5%以上股东、董事长兼总经理冯学裕 先生及其一致行动人冯澄天女士出 ...

进一步统计，近3个月内该股累计发生2笔大宗交易，合计成交金额为1933.72万元。该股近5个交易日累 计上涨4.43%，主力资金合计净流入284.16万元。 责任编辑：小浪快报 第1笔成交价格为43.26元，成交40.00万股，成交金额1,730.40万元，溢价率为-12.23%，买方营业部为机 构专用，卖方营业部为兴业证券股份有限公司上海自由贸易试验区分公司。 第2笔成交价格为43.26元，成交4.70万股，成交金额203.32万元，溢价率为-12.23%，买方营业部为招商 证券股份有限公司深圳科技园高新南一道证券营业部，卖方营业部为兴业证券股份有限公司上海自由贸 易试验区分公司。 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 12月1日，澄天伟业收涨3.68%，收盘价为49.29元，发生2笔大宗交易，合计成交量44.7万股，成交金额 1933.72万元。 ...

Core Viewpoint - The company is actively expanding its liquid cooling business and accelerating the mass production process for core customers [1] Group 1: Business Development - The company is currently in a proactive market expansion phase for its liquid cooling solutions [1] - The company has achieved small batch delivery of liquid cooling product orders [1] Group 2: Target Customers - The primary target customer groups include leading domestic server manufacturers, AI computing platform builders, and certain foreign brands' ODM/integrators operating in China [1]

Group 1: Business Development and Market Strategy - The company is actively expanding its liquid cooling business, focusing on core customer mass production processes and has achieved small batch liquid cooling product orders [1][2] - The semiconductor packaging materials business is targeting major clients in the power semiconductor packaging sector, with a focus on applications in new energy vehicles and photovoltaic inverters [2][3] - The company aims to leverage its expertise in high thermal conductivity materials and semiconductor packaging to enter the thermal management market, with a comprehensive product range including liquid cooling plates and next-generation microchannel cooling solutions [3][4] Group 2: Financial Performance - In the first three quarters of 2025, the company reported revenue of CNY 310 million, a year-on-year increase of 24.48%, and a net profit attributable to shareholders of CNY 12.42 million, up 2,925.45% [2][3] - The growth in performance is attributed to increased sales of smart card products and the rapid expansion of the power electronics application market, which has enhanced the market penetration of semiconductor packaging materials [3][4] Group 3: Research and Development - The company holds 185 patents, including 5 invention patents and 126 utility model patents, with R&D investment increasing by 9.59% year-on-year [2][3] - Future R&D efforts will focus on semiconductor packaging materials and the newly developed liquid cooling business [3][4] Group 4: Future Outlook and Risks - The company is optimistic about the future growth of its liquid cooling business, despite its current revenue contribution being low, as it anticipates rapid growth with increased customer acceptance and mass production plans [3][4] - The company emphasizes the importance of adhering to legal disclosure requirements and encourages investors to be rational in their investment decisions, highlighting potential risks associated with new business developments [4][5]

Core Viewpoint - The company has developed a comprehensive capability chain in liquid cooling solutions, leveraging its expertise in semiconductor packaging materials to provide end-to-end services from material design to system-level solutions [1] Group 1: Business Development - The liquid cooling business has naturally extended from packaging materials to liquid cooling components and system-level solutions [1] - The company has established a complete product matrix for secondary side liquid cooling, including MLCP, cold plates, quick connectors, CDU modules, and liquid cooling cabinets [1] Group 2: Service Offering - The business model allows the company to offer a full range of services to clients, including thermal simulation, structural design, prototype validation, and mass production [1] - The company utilizes a self-controlled manufacturing system to achieve cost optimization and high reliability in delivery [1]

Core Viewpoint - The company has established a strong competitive advantage in the smart card business through long-term strategic partnerships with major global players and a significant overseas revenue contribution [1] Group 1: Business Performance - The overseas revenue share of the company's smart card business has consistently exceeded 60% [1] - The revenue concentration from the top five customers has decreased from 87.92% in 2023 to 77.75% in 2024, indicating an improvement in customer diversification [1] Group 2: Strategic Initiatives - The company has formed long-term strategic partnerships with leading smart card system companies such as THALES and IDEMIA [1] - The company is expanding into new business areas such as semiconductor packaging and liquid cooling, which helps reduce reliance on the single smart card business and enhances overall operational stability [1]

Group 1: Company Overview and Business Segments - The company focuses on three main business segments: smart cards, semiconductors, and digital & energy thermal management, with smart cards being the traditional stronghold [1][2] - The Ningbo Cheng Tian dedicated chip project was completed in 2019, contributing to both internal use and external sales, and the semiconductor packaging materials business achieved large-scale production in 2023 [1][2] Group 2: Liquid Cooling Business Development - The liquid cooling business is a significant growth point, leveraging the company's expertise in high thermal conductivity materials and core processes to expand from packaging materials to system-level solutions [2][3] - The company has established a complete capability chain from semiconductor packaging materials to liquid cooling components and overall solutions, differentiating itself from competitors [3][4] Group 3: Financial Performance and Market Dynamics - Revenue from semiconductor packaging materials is projected to account for nearly 10% of total revenue in 2024, with strong growth expected [6] - The company's revenue fluctuated in 2022-2023 due to macroeconomic downturns, with smart card business being the main revenue source during this period [8][9] Group 4: Strategic Partnerships and Customer Base - The company maintains long-term strategic partnerships with major clients like THALES and IDEMIA, with overseas business accounting for over 60% of revenue [9][12] - The customer base for semiconductor packaging and liquid cooling businesses is currently independent, but there is potential for future collaboration as technology evolves [11] Group 5: Research and Development Focus - Future R&D investments will prioritize semiconductor packaging materials and the newly developed liquid cooling business, focusing on system-level testing and integration [10][12] - The company aims to enhance its competitive edge through continuous innovation and cost-effectiveness analysis in R&D [10] Group 6: Market Trends and Risks - The rise of eSIM technology is expected to boost product margins and transition the smart card business towards service-oriented models [12] - The company is aware of potential risks associated with new product development, including technological and market uncertainties [12]