Core Viewpoint - The company has established a strong competitive advantage in the smart card business through long-term strategic partnerships with major global players and a significant overseas revenue contribution [1] Group 1: Business Performance - The overseas revenue share of the company's smart card business has consistently exceeded 60% [1] - The revenue concentration from the top five customers has decreased from 87.92% in 2023 to 77.75% in 2024, indicating an improvement in customer diversification [1] Group 2: Strategic Initiatives - The company has formed long-term strategic partnerships with leading smart card system companies such as THALES and IDEMIA [1] - The company is expanding into new business areas such as semiconductor packaging and liquid cooling, which helps reduce reliance on the single smart card business and enhances overall operational stability [1]

Group 1: Company Overview and Business Segments - The company focuses on three main business segments: smart cards, semiconductors, and digital & energy thermal management, with smart cards being the traditional stronghold [1][2] - The Ningbo Cheng Tian dedicated chip project was completed in 2019, contributing to both internal use and external sales, and the semiconductor packaging materials business achieved large-scale production in 2023 [1][2] Group 2: Liquid Cooling Business Development - The liquid cooling business is a significant growth point, leveraging the company's expertise in high thermal conductivity materials and core processes to expand from packaging materials to system-level solutions [2][3] - The company has established a complete capability chain from semiconductor packaging materials to liquid cooling components and overall solutions, differentiating itself from competitors [3][4] Group 3: Financial Performance and Market Dynamics - Revenue from semiconductor packaging materials is projected to account for nearly 10% of total revenue in 2024, with strong growth expected [6] - The company's revenue fluctuated in 2022-2023 due to macroeconomic downturns, with smart card business being the main revenue source during this period [8][9] Group 4: Strategic Partnerships and Customer Base - The company maintains long-term strategic partnerships with major clients like THALES and IDEMIA, with overseas business accounting for over 60% of revenue [9][12] - The customer base for semiconductor packaging and liquid cooling businesses is currently independent, but there is potential for future collaboration as technology evolves [11] Group 5: Research and Development Focus - Future R&D investments will prioritize semiconductor packaging materials and the newly developed liquid cooling business, focusing on system-level testing and integration [10][12] - The company aims to enhance its competitive edge through continuous innovation and cost-effectiveness analysis in R&D [10] Group 6: Market Trends and Risks - The rise of eSIM technology is expected to boost product margins and transition the smart card business towards service-oriented models [12] - The company is aware of potential risks associated with new product development, including technological and market uncertainties [12]

证券代码：300689 证券简称：澄天伟业 公告编号：2025-039 深圳市澄天伟业科技股份有限公司 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 为进一步加强与投资者的互动交流工作，深圳市澄天伟业科技股份有限公司 （以下简称"公司"）将参加由深圳证监局和中证中小投资者服务中心指导、深 圳上市公司协会与深圳市全景网络有限公司联合举办的"2025 年度深圳辖区上 市公司集体接待日"活动，现将相关事项公告如下： 本次活动将采用网络远程的方式举行，投资者可登录"全景路演"网站 （http://rs.p5w.net），或关注微信公众号：全景财经，或下载全景路演 APP, 参与本次互动交流，活动时间为 2025 年 11 月 20 日（周四）14：30-17：00。届 时公司高管将在线就公司业绩、公司治理、发展战略、经营状况、融资计划、股 权激励和可持续发展等投资者关心的问题，与投资者进行沟通与交流，欢迎广大 投资者踊跃参与！ 特此公告。 深圳市澄天伟业科技股份有限公司董事会 2025 年 11 月 14 日 关于参加 2025 年度深圳辖区上市公司 集体接待日活动 ...

Core Viewpoint - The stock of Cheng Tian Wei Ye has experienced a decline of 2.02% on November 12, with a current price of 51.90 CNY per share, despite a year-to-date increase of 103.37% [1] Financial Performance - For the period from January to September 2025, Cheng Tian Wei Ye achieved a revenue of 310 million CNY, representing a year-on-year growth of 24.48%. The net profit attributable to shareholders reached 12.42 million CNY, showing a significant increase of 2925.45% [2] Stock Market Activity - The stock has seen a net outflow of 3.07 million CNY from main funds, with large orders showing a buy of 7.43 million CNY and a sell of 7.36 million CNY, indicating active trading [1] - The stock has appeared on the "Dragon and Tiger List" twice this year, with the most recent occurrence on August 7 [1] Company Overview - Cheng Tian Wei Ye Technology Co., Ltd. is located in Shenzhen, Guangdong Province, and was established on August 1, 2006. It was listed on August 9, 2017. The company specializes in the production, sales, and services of smart cards and dedicated chips [1] - The main business revenue composition includes smart card products (66.12%), other (supplementary) products (15.45%), semiconductor products (13.77%), leasing business (2.55%), and comprehensive card-making services (2.11%) [1] Shareholder Information - As of September 30, the number of shareholders for Cheng Tian Wei Ye is 10,100, an increase of 24.74% from the previous period. The average number of circulating shares per person is 9,973, a decrease of 19.83% [2] Dividend Information - Since its A-share listing, Cheng Tian Wei Ye has distributed a total of 46.30 million CNY in dividends, with 8.25 million CNY distributed over the last three years [3]

Core Viewpoint - The stock of Cheng Tian Wei Ye has experienced fluctuations, with a year-to-date increase of 113.52%, but a recent decline in the last 60 days by 12.34% [1][2]. Company Overview - Cheng Tian Wei Ye Technology Co., Ltd. is located in Shenzhen, Guangdong Province, and was established on August 1, 2006, with its IPO on August 9, 2017 [1]. - The company specializes in the production, sales, and services of smart cards and dedicated chips, with revenue composition as follows: smart card products 66.12%, others 15.45%, semiconductor products 13.77%, leasing business 2.55%, and comprehensive card-making services 2.11% [1]. Financial Performance - For the period from January to September 2025, Cheng Tian Wei Ye achieved a revenue of 310 million yuan, representing a year-on-year growth of 24.48%, and a net profit attributable to shareholders of 12.42 million yuan, reflecting a significant increase of 2925.45% [2]. - The company has distributed a total of 46.30 million yuan in dividends since its A-share listing, with 8.25 million yuan distributed over the past three years [3]. Stock Market Activity - As of November 7, the stock price was 54.49 yuan per share, with a trading volume of 1.03 billion yuan and a turnover rate of 1.83%, resulting in a total market capitalization of 6.299 billion yuan [1]. - The stock has appeared on the "Dragon and Tiger List" twice this year, with the most recent occurrence on August 7 [1]. Shareholder Information - As of September 30, the number of shareholders increased to 10,100, a rise of 24.74%, while the average circulating shares per person decreased by 19.83% to 9,973 shares [2]. Industry Classification - Cheng Tian Wei Ye is classified under the Shenwan industry as part of the communication sector, specifically in communication equipment, terminal, and accessories [2]. - The company is associated with several concept sectors, including small-cap, 5G, liquid cooling, specialized and innovative, and overseas expansion concepts [2].

Core Viewpoint - The semiconductor packaging materials industry is experiencing steady growth driven by the rapid expansion of downstream power electronics applications, particularly in photovoltaic inverters, energy storage systems, and the three electric systems of new energy vehicles [1] Industry Summary - The current growth in the semiconductor packaging materials sector is primarily attributed to the increasing demands for high-frequency, high-voltage, and high-temperature performance in power devices [1] - The acceleration of artificial intelligence data center (AIDC) infrastructure is significantly increasing the demand for high-efficiency power conversion devices in the power supply and energy storage segments, which will serve as a new growth driver for the semiconductor packaging materials industry [1] Company Summary - The company has established a multi-dimensional competitive advantage in the semiconductor packaging materials field, including vertical integration manufacturing capabilities from materials to structural components [1] - The company specializes in the development of high thermal conductivity and high reliability packaging material systems, evolving from a single packaging material supplier to a comprehensive service provider offering "packaging materials + thermal management structural components + liquid cooling module system solutions" [1] - The company provides full-process support for clients, including material selection, thermal simulation design, process validation, and system assembly [1]

Core Viewpoint - The company has announced the development of MLCP technology, which integrates traditional packaging heat dissipation structures with liquid cooling channels to enhance cooling efficiency and reduce thermal resistance [1] Group 1: Technology Overview - MLCP is a cold plate technology that features micron-level channels within packaging materials, allowing coolant to be positioned closer to chip heat sources [1] - The integrated design of MLCP eliminates the need for traditional external cold plate models, enabling direct structural coupling with high-power and multi-chip modules [1] Group 2: Company Capabilities - The company possesses strong expertise in high thermal conductivity metal packaging materials, precision etching, and electroplating processes, which align well with the MLCP technology route [1] Group 3: Market Strategy - The company is actively advancing the sample testing and production line preparation for MLCP, with samples already delivered to key customers [1] - Future production capacity planning will be strictly based on market feedback and customer orders, aiming to seize opportunities in high heat flux density areas such as AI servers and power modules [1]

Group 1 - The core viewpoint of the article is that Chengtian Weiye announced its semiconductor business products, which include packaging materials and specialized chip products [2] - The main products of the semiconductor business include carrier tapes, lead frames, and copper heat sink substrates, which are essential for semiconductor packaging applications [2] - The products primarily cater to packaging applications for MOSFET, SiC, and IGBT power modules [2]

Core Viewpoint - The company, Cheng Tian Wei Ye, announced a joint investment with superX to establish a joint venture focused on the global AIDC cabinet liquid cooling product market, aiming to enhance overseas sales channels [2] Group 1: Joint Venture and Strategy - The joint venture will integrate various advantages to jointly explore the global market for AIDC cabinet liquid cooling products [2] - The focus will be on designing customized cabinet-level liquid cooling solutions, with profit retention expected [2] - Liquid cooling component orders will be handled through an ODM model by the company's controlling subsidiary, promoting internal business synergy [2] Group 2: Financial and Ownership Structure - The company will invest through its wholly-owned subsidiary, Hong Kong Cheng Tian, using its own funds to hold a 25% stake in the joint venture [2] - This initiative is anticipated to accelerate the scaling of the company's liquid cooling products in overseas markets [2]

Core Insights - The company, Cheng Tian Wei Ye, is one of the earliest entrants in the smart card industry in China, establishing a comprehensive end-to-end process that includes chip application R&D, module packaging, smart card development, production, sales, and terminal application development [1] - The company has achieved a breakthrough in one-stop delivery capability in the smart card sector, enhancing product consistency and delivery efficiency, which strengthens technical barriers and customer loyalty, creating a differentiated competitive advantage and higher value-added space [1] - Cheng Tian Wei Ye has established long-term stable partnerships with international leading smart card system manufacturers such as THALES and IDEMIA, with over 60% of its products exported, making it one of the first smart card companies in China to achieve a global layout [1] - The company's communication smart card products have formed a certain sales scale in the global market, with the smart card business accounting for approximately 60%-70% of total revenue [1] - It is expected that the revenue scale of the smart card business will remain relatively stable, while the proportion of this business in total revenue will gradually decrease as the company expands its semiconductor and thermal management businesses [1]