格隆汇2月27日丨隆扬电子(301389.SZ)在投资者互动平台表示，公司产品目前暂无涉及变压器。公司控 股股东亦未有变更。 ...

每经AI快讯，隆扬电子（301389.SZ）2月27日在投资者互动平台表示，公司产品目前暂无涉及变压器。 公司控股股东亦未有变更。 （文章来源：每日经济新闻） ...

（记者 曾健辉） 每经头条（nbdtoutiao）——2月井喷！中国AI调用量首超美国，四款大模型霸榜全球前五，国产算力需 求正经历指数级增长 每经AI快讯，隆扬电子发布公告称，2026年2月26日，隆扬电子接受天弘基金等投资者调研，公司董事 长傅青炫，董事会秘书金卫勤，证券事务代表施翌参与接待，并回答了投资者提出的问题。 ...

隆扬电子（昆山）股份有限公司 投资者关系活动记录表 说明 息泄露等情况。 编号：2026-001 | 活动类别 | 特定对象调研 □分析师会议 | | --- | --- | | | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 _ | | 参与单位名称 | 天弘基金申宗航、哲云私募吴雅婷、东吴自营程颙、相聚资 | | | 本李慧丰、华宝信托张卿隆、长信基金陈宇哲、凯恩投资兰 | | | 云池、国泰海通陈思靖、趣时资产冯珺、阳光天泓资产林永 | | | 祥、信泰保险刘跃、东吴证券刘玥娇、解承堯 | | | （以上排名不分先后） | | 时间 2026 | 年 2 月 26 日 | | 地点 | 公司会议室 | | 上市公司接待人员姓 | 董事长 傅青炫 | | 名 | 董事会秘书 金卫勤 | | | 证券事务代表 施翌 | | | 第一部分：公司介绍 | | | 上市公司介绍了基本情况、发展历程、核心业务、发展 | | | 战略等。公司主要产品为电磁屏蔽材料及部分绝缘材料、散 | | | 热材料，产品主要应用于 3C 消费电子行业及新能源汽车行业 ...

证券代码：301389 证券简称：隆扬电子 公告编号：2026-011 隆扬电子（昆山）股份有限公司 董事会薪酬与考核委员会 关于2026年限制性股票激励计划激励对象 名单的公示情况说明及核查意见 本公司及董事会全体成员保证信息披露内容真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 隆扬电子（昆山）股份有限公司（以下简称"公司"）于2026年2月9日召开第二 届董事会第二十一次会议，审议通过了《关于2026年限制性股票激励计划（草案）及 其摘要的议案》等议案，具体内容详见公司于2026年2月10日在巨潮资讯网 （www.cninfo.com.cn）披露的相关公告。 根据《上市公司股权激励管理办法》（以下简称"《管理办法》"）、《深圳证 券交易所创业板股票上市规则》（以下简称"《上市规则》"）、《深圳证券交易所 创业板上市公司自律监管指南第1号——业务办理》（以下简称"《监管指南第1 号》"）和《公司章程》等相关规定，公司对《2026年限制性股票激励计划（草案）》 （以下简称"《激励计划》"或"本次激励计划"）拟授予激励对象的姓名和职务在 公司内部进行了公示，公司董事会薪酬与考核委员会结合公示情况对激 ...

Investment Rating - The industry is rated as "Buy" with expectations of an increase exceeding 15% in the next 3-6 months [57]. Core Insights - The report emphasizes that upstream materials are a key inflationary component in the PCB upgrade iteration process, with three main conclusions: the number of PCBs is increasing, the value of PCBs per cabinet/GPU is rising, and upstream materials are undergoing continuous upgrades [2][8]. - The market is focusing on materials that are close to "ultimate" technology or "upgrade" directions, indicating a potential profit release in 2026 [3][18]. - The report highlights the significant price inflation in electronic fabrics, particularly Low-CTE and Q fabrics, driven by supply constraints and increasing demand from high-end applications [4][15][24]. Summary by Sections Upstream Materials - The report identifies that the PCB board count is increasing, and the corresponding value per cabinet/GPU is also on the rise, particularly with the introduction of new PCB designs like the Vera Rubin NVL144 CPX [2][8]. - Continuous upgrades in PCB upstream materials are necessary to meet the higher demands for transmission speed and signal integrity from AI applications [11][12]. - Upstream materials are prone to inflation, with significant price differences observed in various generations of electronic fabrics [15][18]. Electronic Fabrics - The report predicts a continued price increase for Low-CTE fabrics in 2026 due to supply shortages and rising demand from high-end applications [4][36]. - The second-generation Low-Dk fabrics are expected to face a clear supply-demand gap in 2026, driven by the large-scale deployment of Google's TPU V7 and above [36][37]. - Q fabrics are highlighted for their superior performance and scarcity, with a gradual increase in production expected in 2027 [26][34]. Copper Foil - The report notes a clear upgrade trend in HVLP copper foil, with significant price increase potential due to rising demand from AI applications and planned expansions by leading manufacturers [5][41]. - The market for carrier copper foil is identified as a second growth pole, with a current global market size of approximately 5 billion, primarily dominated by Japanese companies [49][50]. Resins - The report discusses the importance of resin types, particularly carbon-hydrogen resins, in high-frequency and high-speed applications, with domestic companies accelerating production to meet demand [51][54].

Investment Rating - The industry is rated as "Buy" with an expected increase of over 15% in the next 3-6 months [57]. Core Insights - The report emphasizes that upstream materials are a key inflationary component in the PCB upgrade iteration process, with three main conclusions: the number of PCBs is increasing, the value of PCBs per cabinet/GPU is rising, and upstream materials are undergoing continuous upgrades [2][8]. - The market is focusing on materials that are close to "ultimate" technology or "upgrade" directions, indicating a potential profit release in 2026 [3][18]. - The report highlights the significant price inflation in electronic fabrics, particularly Low-CTE and Q fabrics, driven by supply constraints and increasing demand from AI applications [4][15][26]. Summary by Sections Upstream Materials - The report identifies that the PCB upgrade process is characterized by increasing PCB quantities and value, with a focus on the evolving requirements for materials such as electronic fabrics, copper foil, and resins [2][8]. - It notes that the industry trends for upstream materials lag behind PCB developments by 0.5-1 year, suggesting a delayed but strong profit release potential in 2026 [3][21]. - The sensitivity of material prices to market trends is highlighted, indicating that cost structures and supply dynamics are favorable for upstream materials [3][22]. Electronic Fabrics - The report predicts a continued price increase for Low-CTE fabrics due to supply shortages and rising demand, particularly from high-end applications [4][38]. - Q fabrics are expected to see significant adoption starting in 2027, with a strong short-term outlook due to supply constraints [26][34]. - The second-generation Low-Dk fabrics are anticipated to face a clear supply-demand gap in 2026, driven by the large-scale rollout of Google's TPU V7 and above [36][37]. Copper Foil - The report discusses the clear upgrade path for HVLP copper foil, with major producers expanding capacity and confirming strong demand trends [5][41]. - The market for carrier copper foil is identified as a second growth area, with a current global market size of approximately 5 billion, primarily dominated by Japanese firms [49]. - Price increases for HVLP copper foil are expected, supported by strong demand from AI and high-performance computing applications [46][45]. Resins - The report highlights the importance of resin types in high-frequency and high-speed applications, with carbon-hydrogen resins being the mainstream choice for advanced PCBs [51][54]. - Domestic companies are accelerating production to meet the growing demand for high-performance resins, indicating a shift towards local supply chains [54].

证券日报网讯2月11日，隆扬电子（301389）在互动平台回答投资者提问时表示，公司HVLP5铜箔产品 目前尚配合下游客户验证中；基于商业保密原则和客户协议约定，相关信息不便披露，敬请谅解。 ...

证券日报网讯2月11日，隆扬电子（301389）在互动平台回答投资者提问时表示，截至2026年1月30日， 公司的股东户数为26782户。 ...

证券日报网讯 2月11日，隆扬电子在互动平台回答投资者提问时表示，二级市场股价受多种因素影响， 公司会努力经营，持续布局新材料，努力以更好的业绩回报广大投资者的支持。 （文章来源：证券日报） ...