Wolfspeed (NYSE:WOLF) Q2 2026 Earnings call February 04, 2026 05:00 PM ET Speaker5Thank you for standing by, and welcome to the Wolfspeed Inc. Second Quarter Fiscal Year 2026 earnings call. At this time, all participants are in a listen-only mode. All lines have been placed on mute to prevent any background noise. After the speaker's remarks, there will be a question-and-answer session. If you would like to ask a question during this time, simply press star followed by the number one on your telephone keypa ...

Core Viewpoint - Wolfspeed, Inc. reported disappointing second-quarter earnings following its emergence from Chapter 11 bankruptcy, with significant losses and revenue that fell short of analyst expectations [1][2]. Financial Performance - The company reported a quarterly loss of $5.78 per share, which may not align with estimates due to the application of fresh start accounting after bankruptcy [2]. - Quarterly revenue was $168.5 million, missing the analyst consensus estimate of $170 million [2]. Segment Performance - AI data center revenue experienced a notable growth of approximately 50% quarter-over-quarter, indicating expansion in this segment [2]. Management Commentary - CEO Robert Feurle emphasized the company's commitment to maintaining balance sheet strength and pursuing disruptive innovation following financial restructuring [3]. Stock Performance - Following the earnings report, Wolfspeed's stock fell by 8.98%, closing at $15.72 in extended trading [3].

Wolfspeed FY26 Q2 Earnings February 2026 © 2026 Wolfspeed, Inc. All rights reserved. Wolfspeed® and the Wolfstreak logo are registered trademarks and the Wolfspeed logo is a trademark of Wolfspeed, Inc. NON-GAAP MEASURES & FORWARD LOOKING STATEMENTS Non-GAAP Financial Measures: This presentation highlights the Company's financial results on both a GAAP and a non-GAAP basis. The GAAP results include certain costs, charges and expenses that are excluded from non-GAAP results. By publishing the non-GAAP measur ...

Exhibit 99.1 Wolfspeed Reports Financial Results for the Second Quarter of Fiscal 2026 AI Datacenter Revenue up 50% QoQ $200 Million Annualized Operating Expense Reduction Compared to Q2 FY 2025 Capital Expenditures Down by 90% Year over Year Strong Balance Sheet Ending with $1.3 Billion in Cash, Cash Equivalents and Short-term Investments DURHAM, N.C. February 04, 2026 -- Wolfspeed, Inc. (NYSE: WOLF) today announced its results for the second quarter of fiscal 2026. Business Highlights Quarterly Financial ...

Core Insights - The global semiconductor industry is facing significant challenges, with several major wafer fabs halting operations, delaying construction, or closing production lines, leading to a substantial impact on the entire sector [1] Group 1: GlobalFoundries and STMicroelectronics - The joint wafer fab project between GlobalFoundries and STMicroelectronics in Crolles, France, has been stalled after 18 months of slow progress, with a total investment of €7.5 billion expected from the European Chips Act [2] - The new 12-inch semiconductor wafer fab was initially planned to be fully operational by 2026, with an annual capacity of 620,000 wafers [2] Group 2: Sumitomo Electric - Sumitomo Electric has decided to cancel its new silicon carbide (SiC) wafer fab project due to weak demand in the electric vehicle market and uncertainty regarding the recovery timeline, which was announced in 2023 with an investment plan of ¥30 billion [3] - The project aimed to produce 180,000 SiC wafers annually by 2027, but this plan has been completely scrapped [3] - Industry insiders suggest that Sumitomo Electric may redirect resources to other growth areas, such as automotive wiring harnesses and optical components for data centers, to offset losses in the SiC wafer business [3] Group 3: Wolfspeed - Wolfspeed announced plans to close its 6-inch SiC wafer fab in Durham, North Carolina, due to higher manufacturing costs compared to its 8-inch fab in Mohawk Valley, with the CEO indicating an evaluation of the closure timeline [4] - The construction of a 200mm SiC wafer fab in Ernsdorf, Germany, has been postponed from summer 2024 to 2025 [4] Group 4: Intel - Intel has delayed the construction of its Fab 29.1 and Fab 29.2 facilities near Magdeburg, Germany, due to pending EU subsidy approvals and the need to clear and reuse topsoil, with the start date pushed from summer 2024 to May 2025 [5] - The advanced manufacturing facilities using Intel's 14A (1.4nm) and 10A (1nm) processes, originally expected to begin operations by the end of 2027, are now estimated to start production between 2029 and 2030 [5] - Intel's chip project in Ohio, announced in January 2022 with an initial investment of over $20 billion, has also faced delays, with construction now pushed to 2026-2027 and expected operations starting in 2027-2028 due to weak market demand and delayed government subsidies [6]

Core Viewpoint - The global semiconductor industry is facing significant challenges, with several well-known wafer fabs halting operations, delaying construction, or closing production lines, leading to a major impact on the entire industry [2]. Group 1: GlobalFoundries and STMicroelectronics - The joint wafer fab project between GlobalFoundries and STMicroelectronics in Crolles, France, has been halted after 18 months of slow progress. The project, initially planned with a total investment of €7.5 billion, aimed for full production by 2026 with an annual capacity of 620,000 wafers [3]. Group 2: Sumitomo Electric - Sumitomo Electric has decided to cancel its new silicon carbide (SiC) wafer fab project due to weak demand in the electric vehicle market and uncertainty regarding the recovery timeline. The project, announced in 2023 with an investment of ¥30 billion, was expected to start production in 2027 [4]. - The company plans to redirect resources to other growth areas, such as automotive wiring harnesses, environmentally friendly power cables, and optical components for data centers, to offset losses from the SiC wafer business [4]. Group 3: Wolfspeed - Wolfspeed announced the closure of its 6-inch SiC wafer fab in Durham, North Carolina, due to higher manufacturing costs compared to its 8-inch fab in Mohawk Valley. The timeline for this closure is currently under evaluation [5]. - Additionally, the construction of a 200mm SiC wafer fab in Ernsdorf, Germany, has been postponed from summer 2024 to 2025 [5]. Group 4: Intel - Intel has delayed the construction of its Fab 29.1 and Fab 29.2 facilities near Magdeburg, Germany, due to pending EU subsidy approvals and the need to clear and reuse topsoil. The projects, originally set to start in summer 2024, are now pushed to May 2025 [6]. - The start of production at Intel's advanced fabs using 14A (1.4nm) and 10A (1nm) processes, initially planned for late 2027, is now estimated to begin between 2029 and 2030 [6]. - Intel's chip project in Ohio, announced in January 2022 with an initial investment of over $20 billion, has also faced delays, with construction now pushed to 2026-2027 and production expected to start in 2027-2028 [6].

DURHAM, N.C.--(BUSINESS WIRE)--Please replace the photo with the accompanying corrected photo. The release reads: WOLFSPEED UNVEILS NEXT-GEN TOLT PORTFOLIO TO ADDRESS SURGING AI DATACENTER DEMAND New TOLT (TO-Leaded, Top-Side Cooled) package, built on Wolfspeed's Gen 4 MOSFET technology, enables higher power density and thermal performance for next-generation AI datacenters. Purpose-designed to meet the rapidly increasing power and cooling demands for AI and hyperscale datacenters, TOLT unlocks. ...

Core Viewpoint - Wolfspeed has undergone significant changes following its Chapter 11 bankruptcy protection, leading to a corporate restructuring that has reduced its debt but left it facing ongoing challenges in the market [1][3][8] Financial Restructuring - The company has successfully wiped much of its previous debt by transferring asset ownership to major creditors and reshaping its equity structure [3] - Despite the restructuring, many shareholders who invested prior to the bankruptcy have seen their positions decline significantly [2] Market Position and Challenges - Wolfspeed's growth potential is tied to the increasing demand for silicon carbide (SiC) power chips, particularly in the electric vehicle (EV) market and potentially in artificial intelligence (AI) data centers [4] - However, the company has experienced a slowdown in EV sales growth and increased competition from Chinese manufacturers, which has dampened sales expectations [5][6] - The geopolitical significance of sourcing SiC and GaN chips domestically may provide Wolfspeed with governmental support, but many pre-bankruptcy challenges remain unresolved [7]

Group 1: Market Overview - U.S. stocks experienced an upward trend, with the Dow Jones index increasing by over 100 points on Tuesday [1] - Microchip Technology Inc's shares rose significantly after the company revised its fiscal third-quarter revenue expectations upward [1] Group 2: Microchip Technology Inc - Microchip now anticipates third-quarter fiscal 2026 net sales of approximately $1.185 billion, surpassing its previous guidance range of $1.109 billion to $1.149 billion [2] - The stock price of Microchip Technology increased by 8.1%, reaching $72.47 on Tuesday following the announcement [2] Group 3: Other Notable Stock Movements - Alumis Inc saw a remarkable 129% increase in its stock price to $19.04 after positive trial results for envudeucitinib [3] - Aeva Technologies Inc's stock rose by 31.5% to $17.21 due to its technology being selected for NVIDIA's autonomous vehicle platform [3] - Terrestrial Energy Inc's shares increased by 26.9% to $8.87 after securing an agreement with the U.S. Department of Energy [3] - Bright Minds Biosciences Inc gained 25% to $100.00 following successful Phase 2 trial results [3] - OneStream Inc's stock rose by 25.1% to $23.00 amid reports of a potential buyout [3] - Other companies such as SanDisk Corp, Beam Therapeutics Inc, and Albemarle Corp also recorded significant stock price increases [3]

Group 1: Core Insights - The article discusses the growing importance of wide bandgap semiconductors, specifically Silicon Carbide (SiC) and Gallium Nitride (GaN), in the automotive electrification and AI data center sectors [1] - The SiC market is primarily driven by automotive applications, particularly in battery electric vehicle (BEV) inverters, with a projected market size of $10 billion within the next five years [3][4] - Recent trends include the emergence of 800V fast charging technology for electric vehicles, which is expected to enhance competitive advantages for automakers [3] Group 2: SiC Market Developments - The transition from 150mm (6-inch) to 200mm (8-inch) wafers is currently underway in the global SiC industry, with companies like Wolfspeed and Infineon leading the charge [4][5] - New entrants in the SiC market include Indian companies like LTSCT and SiCSem, as well as initiatives in Singapore and South Korea to develop SiC manufacturing capabilities [6][19] - Geopolitical concerns and supply chain disruptions are prompting countries to invest in SiC technology, with India being particularly active in this space [6][19] Group 3: GaN Market Developments - The GaN market is driven by consumer applications such as mobile chargers, with a projected market size exceeding $2.5 billion by 2030 [10][12] - Major players in the GaN market include Innoscience, Navitas, and Infineon, with Innoscience expected to lead with a 29.9% market share [12] - The GaN industry is shifting towards an Integrated Device Manufacturer (IDM) model, contrasting with the previous dominance of fabless companies [12][13] Group 4: Technological Advancements - Both SiC and GaN technologies are evolving, with advancements in device architecture such as Bosch's dual-channel trench gate technology and Navitas's trench-assisted planar SiC MOSFET technology [8][22] - The GaN market is also seeing a shift towards larger wafer sizes, with 300mm (12-inch) wafers being developed, which is expected to enhance manufacturing efficiency [15][16] - Vertical GaN architectures are emerging, offering advantages over traditional planar structures, with companies like Onsemi leading this innovation [22]