Core Viewpoint - The establishment of the micro-nano platform at the Yongjiang Laboratory marks a significant advancement in the field of heterogeneous integration, providing a comprehensive open and shared platform for semiconductor research and development [1][5][11]. Group 1: Platform Overview - The micro-nano platform has a total construction area of 12,000 square meters, including a cleanroom area of 6,000 square meters, equipped with 165 high-end precision devices and a team of over 60 personnel [3]. - It focuses on "heterogeneous integration" and aims to provide a full-chain R&D verification service for the semiconductor industry, supporting scientific discovery, technology validation, and engineering realization [5][14]. Group 2: Significance and Impact - The platform is seen as a "hardcore support" for collaborative efforts between industry, academia, and research, breaking down barriers between scientific discovery and engineering transformation, thus driving the high-quality development of the integrated circuit industry in Ningbo and nationwide [7][9]. - The opening of the 8-inch verification line is expected to enhance Ningbo's engineering verification capabilities in micro-nano manufacturing, providing higher-level public services and innovation support for the next generation of semiconductor industry [9][11]. Group 3: Future Directions - The Yongjiang Laboratory aims to create an open and shared infrastructure that serves as a neutral and credible enabling platform, linking industry, academia, and research to provide critical support for innovation and commercialization [20]. - The laboratory is committed to accumulating key verification data and exploring feasible paths from pilot testing to mass production in collaboration with academia and industry [20].

Core Viewpoint - The article discusses the recent "2025 Heterogeneous Integration Frontier Forum" held in Ningbo, focusing on advancements in heterogeneous integration technology and its implications for various industries, particularly in optical interconnects and chiplet technologies [3]. Group 1: Forum Highlights - The forum attracted leading companies and research institutions from both domestic and international backgrounds, facilitating in-depth discussions on cutting-edge achievements, technological trends, and key challenges in the field [3]. - Key topics included the challenges in high-speed optical interconnect chip manufacturing, where domestic capabilities are strong in design and demonstration but face issues in mass production and reliability [8]. Group 2: Technological Challenges - The new technical challenges in heterogeneous integration chiplet technology primarily revolve around signal integrity, power integrity, multi-physical field issues, and electromagnetic interference [9]. - The development of optical interconnect solutions is seen as essential for overcoming AI computing power bottlenecks, emphasizing the need for collaborative innovation in devices and advanced packaging technologies [16]. Group 3: Industry Trends - The integration of heterogeneous and optoelectronic technologies is identified as a significant future direction, with AI technology being a major driver for the growth in advanced packaging demands [18]. - The transition from 2G to 5G has significantly increased the value of RF components in mobile devices, with the value of RF devices per smartphone rising from $0.5 to over $12 [22].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17-19, 2025, in Ningbo, organized by the Yongjiang Laboratory and TrendBank, with support from the Ningbo Electronic Industry Association [2][50]. - The forum aims to discuss advancements in heterogeneous integration technologies and their applications in various fields, including semiconductor manufacturing and optical technologies [26][30]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300-500 participants [50]. - The event will feature a series of keynote speeches, panel discussions, and networking opportunities, focusing on topics such as advanced packaging technologies, optical chip innovations, and the future of semiconductor integration [26][30][50]. Registration and Fees - Registration for the forum is available, with ticket prices set at RMB 2500 per person, which includes access to conference materials, lunch, and a gala dinner [50]. - Early bird registration before October 31 offers a discounted price of RMB 2000, and students can obtain tickets for RMB 1500 by contacting the organizers [50]. Agenda Highlights - The agenda includes a variety of topics such as the launch of the 8-inch verification line at the Yongjiang Laboratory, government speeches, and discussions on the latest trends in heterogeneous integration and advanced packaging technologies [6][26][30]. - Notable speakers include experts from leading semiconductor companies and research institutions, discussing innovations in chip design, manufacturing processes, and market trends [26][30][50].

Core Insights - The article discusses the growing demand for AI computing power and the continuous upgrade of optical communication networks, highlighting silicon photonics technology as a mainstream solution for 1.6T high-speed optical modules. The global silicon photonics semiconductor market is projected to reach $7.86 billion by 2030, with a compound annual growth rate (CAGR) of 25.7% [2][3]. Group 1: Industry Trends - Silicon photonic chips, which are essential components of optical modules, consist of four key elements: light sources, waveguides, modulators, and detectors. Their high integration, low cost, and high transmission bandwidth make them favored in core applications such as 5G communication, AI data centers, and autonomous driving [2][3]. - Major chip manufacturers like Intel and NVIDIA are actively investing in silicon photonics technology, driving technological breakthroughs and practical applications [2][3]. Group 2: Technical Challenges - The performance of silicon photonic devices is highly sensitive to manufacturing precision. Any minor processing errors can severely degrade device performance, necessitating targeted optimization of silicon photonics manufacturing processes to enhance signal transmission quality and device reliability [3]. Group 3: Upcoming Events - TrendBank plans to host the "Frontier Forum on Heterogeneous Integration" on November 18-19, 2025, in Ningbo, focusing on advanced packaging and heterogeneous integration technologies [3][30]. - The forum will feature discussions on optical chip technology, with confirmed speakers from leading companies and research institutions [4][30].

Core Viewpoint - The 2025 Heterogeneous Integration Frontier Forum will be held in Ningbo from November 17 to 19, 2025, focusing on advancements in heterogeneous integration technology and its applications in the semiconductor industry [2][53]. Event Details - The forum is organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, with support from various local organizations [2][53]. - The event will take place at the Pan Pacific Hotel in Ningbo, with the main conference scheduled for November 18-19, and a tour of the Yongjiang Laboratory's 8-inch verification line on November 17 [9][53]. Agenda Highlights - The agenda includes keynote speeches from government leaders and industry experts, discussions on various topics related to heterogeneous integration, and a verification line commissioning ceremony [10][31][33]. - Specific topics will cover advancements in semiconductor technology, including 2.5D/3D integration, optical chip development, and innovative packaging techniques [33][35][40]. Registration and Fees - Registration for the forum is available through a QR code, with ticket prices set at RMB 2500 per person, offering early bird discounts and student rates [54]. - The registration includes access to conference materials, lunch, and a gala dinner on November 18 [54]. Accommodation Information - The Pan Pacific Hotel offers special rates for attendees, with prices ranging from RMB 350 to 600 per night depending on room type [15][17]. - Additional nearby hotels are listed for convenience, providing various options for attendees [18][22].

Group 1 - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, at the Ningbo Pan Pacific Hotel, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][32]. - The forum aims to discuss advancements in heterogeneous integration technologies and will feature various keynote speeches and parallel sessions focusing on micro-nano manufacturing and advanced packaging technologies [14][18][21]. - The event is expected to attract 300-500 participants, with ticket prices starting at RMB 2500, offering early bird discounts and student rates [32]. Group 2 - The forum will include a ribbon-cutting ceremony for the 8-inch verification line of the Yongjiang Laboratory's information materials and micro-nano device preparation platform [2]. - Keynote speakers include industry leaders and experts from various organizations, discussing topics such as MEMS manufacturing, advanced packaging trends, and the future of silicon photonics [17][20][21]. - The event will also feature networking opportunities and a gala dinner on November 18, fostering collaboration among industry professionals [32].

Group 1 - The core viewpoint of the article highlights the recovery of the global IC packaging substrate market, with a forecasted revenue of $15 billion in 2025, representing a 12% year-on-year growth, driven by surging demand in downstream technology products such as data centers and AI servers [2][3]. - The Chinese domestic market is expected to maintain a high growth rate, with projected revenue reaching $1.64 billion, and local companies achieving a global market share exceeding 10% for the first time [3]. - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17-19, 2025, in Ningbo, focusing on advanced packaging and integration technologies [5][29]. Group 2 - The forum will feature a report by a senior analyst from TrendBank on the development trends of advanced packaging technologies such as 2.5D/3D/FOPLP and IC substrates [6]. - The event will include various keynote speeches and parallel forums discussing critical technologies and challenges in heterogeneous integration and advanced packaging [11][15][22]. - The forum is organized by TrendBank and the Yongjiang Laboratory, with support from various industry associations, and is expected to attract 300-500 participants [29].

Core Viewpoint - The global display industry is experiencing complex and diverse development trends, with the new display industry expected to exceed $200 billion in value by 2024, with China accounting for half of this market [2]. Industry Overview - The advancement of new display technologies and increasing user demand are driving the popularity of high-end and large-size display products, leading to a rise in demand for high-value products with superior image quality and aesthetics [2]. - The rapid iteration of downstream display technologies such as Mini-LED, Micro-LED/OLED, quantum dot displays, and AR/VR is contributing to the evolution of the display industry, transitioning from scale leadership to technological leadership in China [2]. MicroLED Technology - MicroLED chip manufacturing typically involves etching and epitaxy processes, including substrate preparation, intermediate layer preparation, step etching, conductive layer preparation, and electrode preparation [3]. - MicroLED features miniaturization (pixel size and spacing reduced from millimeters to micrometers) and integration (device structures include LED display driving circuits and LED matrix arrays) [3]. Manufacturing Challenges - The incompatibility of epitaxial growth processes for different colors (e.g., red MicroLED with AlGaInP materials and blue/green with GaN materials) complicates the integration of RGB colors on a single substrate [4]. - As chip sizes shrink to the micrometer level, sidewall defects during the etching process can affect internal quantum efficiency (IQE), leading to a decrease in external quantum efficiency (EQE) [4]. - Existing full-color solutions face challenges such as brightness loss, oversized modules, or high costs, making them unsuitable for micro-display applications like AR/VR [4]. Detection and Repair Technologies - The difficulty in defect detection and repair for micro-sized chips necessitates the development of high-precision non-destructive testing and repair technologies [5]. Upcoming Forum - TrendBank plans to host the "2025 Heterogeneous Integration Frontier Forum" from November 17-19, 2025, focusing on MicroLED and new display technologies, with participation from several related companies [5].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][38] - The forum aims to discuss advancements in heterogeneous integration technology and its applications in micro-nano manufacturing and semiconductor packaging [20][24] Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300 to 500 participants [38] - An 8-inch verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2] Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][9] - Additional nearby hotels are suggested for accommodation, including the Ningbo Radisson Hotel and the Ningbo Yidong Howard Johnson Hotel [8][11] Agenda Highlights - The forum will feature keynote speeches, panel discussions, and specialized forums focusing on topics such as advanced packaging, micro LED technology, and heterogeneous integration processes [20][28] - Notable speakers include experts from Huazhong University of Science and Technology, Zhejiang University, and various semiconductor companies [21][24][30] Ticketing Information - Tickets for the forum are priced at 2500 RMB per person, with early bird discounts available for those who register before October 31 [39]

Core Points - The article discusses the "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, scheduled for November 17-19, 2025, in Ningbo, Zhejiang [2][23]. - The forum aims to address challenges and breakthroughs in heterogeneous integration technology in chip applications, promoting industry collaboration and innovation [2][23]. Event Details - The forum will feature keynotes from industry experts, academic institutions, and emerging companies, focusing on advanced packaging industry trends and the current state of technology [2][23]. - The event will include a series of thematic forums, including discussions on micro-nano manufacturing technologies, advanced packaging, and optical chip innovations [10][21]. Agenda Highlights - The opening ceremony will include speeches from government leaders and representatives from the organizing bodies, followed by a series of thematic reports and discussions on various topics related to heterogeneous integration and advanced packaging technologies [6][10]. - Notable speakers include experts from major companies and academic institutions, discussing topics such as silicon photonic integration and advanced packaging trends [10][11][21]. Registration Information - The forum is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [24][23]. - Participants will receive conference materials, lunch, and access to the evening banquet [24]. Participant List - A partial list of registered participants includes professionals from leading companies such as Huawei, Longxin Storage, and various semiconductor technology firms, indicating strong industry interest [25][26].