Core Viewpoint - Shenzhen Dongfang Fuhai Investment Management Co., Ltd. has received approval to issue technology innovation bonds in the interbank market, marking the first issuance by a private venture capital institution since the launch of the "Technology Board" in the bond market [1] Group 1: Market Overview - A total of 20 private equity investment institutions have announced the issuance of technology innovation bonds, with a combined scale of 20.57 billion yuan; 12 institutions are in the registration process for an additional 15.31 billion yuan [1][2] - The People's Bank of China has introduced the "Technology Board" to support experienced private equity and venture capital institutions in issuing long-term technology innovation bonds, aiming to attract more funds for early-stage and hard technology investments [1][2] Group 2: Use of Proceeds - The technology innovation bonds issued by private equity institutions are primarily intended for fund contributions and replacements, focusing on strategic emerging industries such as artificial intelligence, new energy, semiconductors, and biomedicine [2] Group 3: Challenges and Opportunities - The private equity investment sector faces challenges in fundraising, particularly for smaller private institutions due to limited brand influence and risk-bearing capacity; however, the new policy provides a potential new funding channel [2] - The issuance of technology innovation bonds can facilitate the establishment and expansion of private equity funds, which can then invest in technology innovation enterprises [2] Group 4: Specific Case of Dongfang Fuhai - Dongfang Fuhai plans to issue a total of 1.5 billion yuan in technology innovation bonds with a 15-year term, setting new records for similar projects in terms of scale and duration [3] - The company manages over 60 venture capital funds with a total scale of approximately 35 billion yuan, having invested in over 630 technology innovation enterprises [3] Group 5: Risk Mitigation Strategies - A dual credit enhancement model has been proposed, involving collaboration with local governments and market-based credit enhancement institutions to share the risk of bond defaults, thereby supporting the issuance of low-cost, long-term technology innovation bonds [4][5] - This risk-sharing model aims to lower financing costs, boost market confidence, and optimize risk control mechanisms within the bond market [5]

6月17日，君联资本科技创新债券发行。君联资本科创债券注册规模为5亿元，发行规模为3亿元，期限 不超过5年，票面利率2.05%。 同日，东方富海成功发行"2025年度第一期定向科技创新债券——25东方富海PPN001（科创债）"，注 册总规模为15亿元，本期债券为首期发行，募集资金人民币4亿元、债券期限10年（5+3+2）。毅达资 本成功发行"2025年度第一期科技创新债券——25毅达资本MTN001（科创债）"。本期债券发行规模1.5 亿元，期限3+2年，最终票面利率为2.33%。 6月18日，金雨茂物也成功发行2025年度第一期科技创新债券，发行金额1亿元，期限3+2年，票面利率 2.69%，募集资金全部用于科技创新领域出资。 中国银行间市场交易商协会近期披露，首批运用科技创新债券风险分担工具支持的项目已成功落地。5 家民营股权投资机构获分担工具增信和投资支持，并完成发行，规模合计13.5亿元。 这5家民营股权投资机构分别是君联资本管理股份有限公司、深圳市东方富海投资管理股份有限公司、 中科创星科技投资有限公司（以下简称"中科创星"）、江苏毅达股权投资基金管理有限公司、金雨茂物 投资管理股份有限公司。 清 ...

Core Viewpoint - The first batch of private equity venture capital technology innovation bonds has been successfully issued, with a total scale of 1.35 billion yuan, featuring significantly extended maturities and lower interest rates compared to state-owned enterprise bonds [1] Group 1: Bond Characteristics - The bonds have a significantly extended maturity period, with the longest term reaching up to 10 years, compared to the typical 3 to 5 years for medium-term notes [1] - The issuance interest rates are notably lower than the coupon rates of similar state-owned enterprise bonds [1] Group 2: Market Impact - This issuance marks the first financing subject to the risk-sharing tools created by the central bank since the establishment of the "technology board" in the bond market [1] - The introduction of risk-sharing mechanisms and optimization of the funding transmission chain has initially achieved a linkage between equity, bonds, and loans [1] - The further expansion of issuing entities is expected to attract more participants to the bond market's "technology board," enriching the market ecosystem [1]

首批规模合计13.5亿元，利率最低1.8%。 首批民营创投机构发行科技创新债券（下称"科创债"）受到市场高度关注。 中国银行间市场交易商协会（下称"交易商协会"）近日披露，首批运用科技创新债券风险分担工具支持 的项目已成功落地。五家民营股权投资机构获分担工具增信和投资支持，并完成发行，规模合计13.5亿 元。 此次发行的民营创投机构科创债具有以下两大特点：其一，债券期限大幅延长，最长可达10年，远高于 一般3至5年期的中期票据；其二，发行利率明显降低，低于同期同类型国有企业债券的票面利率。 值得关注的是，这是债券市场"科技板"成立后，首批借助央行创设的风险分担工具获得融资的主体。 业内人士分析指出，债市"科技板"通过引入风险分担机制和优化资金传导链条，已经初步实现了"股债 贷"联动。随着发行主体的进一步拓展，有望为债市"科技板"吸引更多参与者，进一步丰富市场生态。 为进一步推动民营创投机构加入发行队伍，业内人士建议，未来要进一步完善风险分担机制，推广"央 地协同"增信模式，降低中小创投发债门槛；建立差异化准入标准，针对专注"硬科技"投资的创投优质 机构，放宽评级要求。 发行主体进一步拓宽 5月7日，中国人民银 ...

"种子贷"产品的落地，破解了一些"两有两无"企业因无国家高新、专精特新等资质，也缺少相关抵质押 物，常常被传统金融服务拒之门外的难题。 预期效应显著，赋能"种子企业"释放增长潜力 6月18日，在市财政局统筹指导下，由市融担基金、深圳征信、龙岗金控公司辖属兴业担保公司、微众 银行通力合作打造的全市首批"种子贷"产品正式落地龙岗，上线当日即有5家种子期企业获得170万元资 金支持，充分展现了政策创新与金融服务的高效协同。 据兴业担保公司相关业务人员介绍，"种子贷"业务在企业筛选阶段，就借助深圳征信的潜力科创企业挖 掘模型与风险评估模型，多维度对深圳市当前存续的260万家企业进行初筛，形成种子企业名单。种子 企业名单推送至银行后，由银行内控再次筛选。除了上述两道防线外，银行与国家融担基金、市融担基 金、担保机构将按比例承担赔付责任，有效控制业务风险。通过构建多级风险分担机制，提高了金融机 构的风险容忍度和信贷积极性，将金融服务进一步下沉至种子期、初创期企业，实现了金融资源与企业 最迫切需求的精准匹配。 高位推动落实，构建"种子贷"政策体系 近年来，深圳构建支持全面创新体制机制，打造一流创新生态体系，由深圳市财政局推 ...

金十数据6月19日讯，6月19日，据中国银行间市场交易商协会消息，首批运用科技创新债券风险分担工 具的项目正式落地。业内人士看来，配套创设科技创新债券风险分担工具，能够缓解股权投资市场社会 化募资难的问题，增强头部创投机构筹集长期稳定资金的能力。风险分担工具的创设，可显著提升民营 企业，信用资质较弱的初创期、成长期科创企业以及股权投资机构发债融资的可得性和便利性。债 市"科技板"已通过风险分担、资金传导链设计等机制初步打通"股债贷"联动。未来可能的深化措施包括 股债联动工具创新、设计含特殊条款的债券，既缓解企业短期偿债压力，又为投资者提供增值机会。 （中国基金报） 业内：创设科创债风险分担工具，可缓解股权投资市场募资难 ...

【 导读 】首批运用科技创新债券风险分担工具 的 项目正式落地 见习记者 舍梨 民营创投机构的科创债落地情况备受市场关注。6月19日，据中国银行间市场交易商协会（以 下简称交易商协会）消息，首批运用科技创新债券风险分担工具的项目正式落地。 毅达资本、金雨茂物、君联资本、中科创星和东方富海等 5家民营股权投资机构日前获分担 工具增信和投资支持，并完成发行，规模合计13.5亿元，中芯聚源等机构正在积极推进注册 科 技 创新债券。 图片来源：NAFMII资讯 这是债券市场设立"科技板"以来，首批使用央行创设风险分担工具的主体。业内人士认为， 这一创新举措不仅为民营创投机构拓宽融资渠道提供了可复制范式，更为科技创新企业引入 了新的资本活水。 据交易商协会消息，首批运用科技创新债券风险分担工具的项目中，分担工具采用信用风险 缓释凭证、担保增信等多样化增信措施，并汇聚地方政府、市场化增信机构等各方合力。 具体来看：毅达资本、金雨茂物由分担工具与金融机构联合创设信用风险缓释凭证增信；君 联资本、中科创星和东方富海则采取担保增信，并引入北京、陕西和深圳的专业担保公司提 供反担保，充分发挥分担工具和市场化增信机构的协同效应，有 ...

| | 吉星新能源[03395] 2025-06-18 12:00 | | | | | 5PMA = | 10PMA = 20PMA = 30PMA = | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 0.914 | | | | | | | | | | | 0.797 | | | | | | | | | | | 0.680 | | | | | | | | | | | 0.563 | | | | | | | | | | | 0.446 | | | | | | | | | | | 0.329 | | | | | | | | | | | 0.212 | | | | | | | | | | | 0.095 | | | | | | | | | | | -0.022 | | | | | | | | | | | 2536万 | 成交軍:23549000 | | | | | | | | | | 1902万 | | | | | | | | | | | 1268万 | | | | | | | | | | | 634万 | | | | | ...

中央财经大学经济学院教授徐翔在《学习时报》撰文指出： 培育耐心资本，政府的有效引导至关重要。这种引导并非简单粗暴的行政干预，而是通过科学的政策设 计和精准的资源配置，为耐心资本的形成和发展指明方向、提供支撑，使其更好地与国家战略同频共 振。首先，优化财税激励政策，提升长期投资吸引力。其次，发挥政府引导基金的"催化剂"与"风向 标"作用。政府引导基金应进一步优化运作模式，更多地投向市场失灵、社会资本不愿或不敢进入的早 期创新领域和关键核心技术攻关项目，强化此类基金的"耐心"属性，适当放宽对短期回报率的考核，更 加注重其对社会资本的撬动效应和对战略性新兴产业的培育效果。最后，构建国家层面的战略性项目甄 别与推送机制。提升精准识别具有战略价值和长期潜力的企业与项目的能力，确保这些项目能够被有效 发掘并进入耐心资本视野。同时，建立跨部门、多领域的专家咨询评估体系，对关乎国家长远发展和产 业链安全的关键项目进行筛选、评估和认证，形成优质项目库，向合格的耐心资本进行精准推送和对 接。 耐心资本的培育，离不开一个健康、高效、富有活力的资本市场环境。"放活"的核心在于遵循市场规 律，减少不必要的行政干预，打通资本"募、投、管 ...

Group 1 - The core viewpoint of the article highlights the successful launch and growth of the "Technology Board" in the bond market, with a total issuance scale of 4,172 billion yuan within the first month [2][3] - The issuance scale of the technology bonds accounted for 17.4% of the total market issuance during the same period, indicating strong demand from various issuers [2] - Commercial banks were the most active participants, issuing 1,910 billion yuan, which represents 45.8% of the total issuance [2][3] Group 2 - The structure of issuers has improved, with the proportion of private enterprises in non-financial technology bonds increasing from 10.1% in the first four months of 2025 to 12.5% in May [2] - The majority of newly issued technology bonds by private enterprises had a maturity of less than three years, while nearly 80% of the total issuance had a maturity of over three years [3][4] - The average issuance interest rate for bank-issued technology bonds was 1.67%, with funds directed towards technology loans and investments in technology innovation enterprises [4] Group 3 - Financial institutions, including banks and securities firms, actively participated in the issuance of technology bonds, with 23 securities firms involved [5] - The longest maturity for a technology bond issued by a securities firm was 10 years, with a significant portion of the funds allocated to support technology innovation [5] - Risk-sharing mechanisms, such as credit default swaps and risk mitigation certificates, have become popular tools in the design of technology bonds [6] Group 4 - The introduction of risk-sharing tools is expected to enhance the accessibility and convenience of financing for private enterprises and early-stage technology companies [6] - Future innovations in yield mechanisms could attract more investors to participate in technology bonds issued by small and medium-sized private technology enterprises [7] - The "Technology Board" in the bond market is anticipated to play a significant role in supporting technological innovation and progress in the future [7]