12月12日，A股三大股指开盘走势分化，沪指跌0.1%报3869.41点，深成指涨0.21%报13174.45点，创业板指涨0.29%报 3172.73点，科创50指数跌0.12%报1324.3点；贵金属板块高开，晓程科技高开3%，招金黄金、中金黄金、赤峰黄金纷纷高开； 摩尔线程开跌6.6%，公司称股票涨幅过快面临回调风险， 盘面上，市场焦点股东百集团（5板）低开6.17%，实控人变更的安妮股份（6天5板）低开4.26%，商业航天概念股再升科 技（4板）高开4.44%、航天动力（5天3板）平开、四川金顶（6天3板）高开6.45%，房地产产业链的中源家居（6天4板）高开 0.78%、南都物业（2板）低开6.46%，光通信板块跃岭股份（3板）低开1.51%，零售板块南京商旅（4天3板）低开0.46%，创 新药概念股重药控股（2板）高开4.65%，芯片产业链的立昂微（2板）平开。 公司新闻 摩尔线程：公司基于自主研发的MUSA架构，将保持较高研发投入和进行产品迭代。但与部分国际巨头相比，公司在综合 研发实力、核心技术积累、产品客户生态等方面仍存在一定的差距。公司目前新产品和新架构均处于在研阶段，量产及产生收 入仍需 ...

摩尔线程：公司基于自主研发的MUSA架构，将保持较高研发投入和进行产品迭代。但与部分国际巨头 相比，公司在综合研发实力、核心技术积累、产品客户生态等方面仍存在一定的差距。公司目前新产品 和新架构均处于在研阶段，量产及产生收入仍需一定时间。 南都电源：公司于近日收到公司控股股东杭州南都电源有限公司、上海益都实业有限公司、上海南都集 团有限公司通知，获悉其正在筹划控制权变更、促进再生铅板块股权出售的相关事宜。经申请，公司股 票自2025年12月12日开市起停牌，预计停牌时间不超过2个交易日。 万科A：公司之控股子公司为满足经营需要，继续通过信用保证、股权质押等方式为相关贷款提供担 保。截至2025年10月31日，公司及控股子公司担保余额844.76亿元，占2024年末经审计归属于上市公司 股东净资产比重为41.68%，公司无逾期担保事项。 特发信息：针对公司因收购深圳特发东智科技有限公司被合同诈骗、职务侵占一案，公司于近日收到广 东省深圳市中级人民法院出具的《刑事判决书》。本次刑事判决仅为一审判决，公司为被害单位，目前 判决尚未生效，案件最终判决及后续执行结果尚存在不确定性，对公司本期利润和期后利润的影响存在 一 ...

Group 1 - The article highlights significant announcements in the stock market, including "suspension and resumption of trading, shareholding changes, investment wins, acquisitions, performance reports, unlocks, and high transfers" [1] - Important announcements are marked in red to assist investors in identifying investment hotspots and preventing various black swan events [1] - The article emphasizes the importance of timely information for investors to discern and find suitable listed companies [1] Group 2 - A company is noted for its long-term support of the Long March series rockets, focusing on sectors such as 6G, commercial aerospace, quantum technology, satellite navigation, CPO, military industry, and drones [1] - Another company specializes in storage chips, photoresists, and advanced packaging, with products applied in storage chips, third-generation semiconductors, and other specialty process chips [1] - A company plans to acquire a leading enterprise in the new energy segment, focusing on AI smartphones, energy storage, and lithium batteries [1]

12月11日，汇成股份涨0.20%，成交额3.21亿元，换手率2.42%，总市值131.78亿元。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品是 集成电路封装测试。 来源：新浪证券-红岸工作室 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下 ...

1、 外交部发言人郭嘉昆昨日主持例行记者会。有记者提问称，据报道，英国首相斯塔默于明年1月29日到31日访华，将到访北京和 上海。郭嘉昆回应，中方重视改善和发展中英关系，愿同英方加强各层级交往。"据我所知，中方尚未同英方就斯塔默首相访华日期 等具体问题进行讨论。" 早 报 精 选 4、美联储宣布降息25个基点。鲍威尔表示，美联储一直在朝着中性利率方向调整，目前已处于中性利率区间的上端。 5、贵州茅台2025年中期分红300亿元，五粮液2025年中期分红100.07亿元。 宏 观 新 闻 2、据报道，12月9日，英国政府宣布对两家中国公司实施制裁，声称相关公司对英国及其盟友发动网络攻击，称其行为与中国政府 相关。外交部发言人郭嘉昆对此表示，中方对英方借网络安全问题搞政治操弄的做法表示强烈不满、坚决反对，并已经在北京和伦敦 向英方提出严正交涉。 3、据报道，虽然美国总统特朗普已经决定允许将英伟达的H200芯片出售给中国，但中方正在考虑限制获取该芯片。外交部发言人 郭嘉昆对此表示，具体的情况，建议向中方的主管部门进行询问。 1、外媒称中方正考虑限制获取英伟达H200芯片，外交部回应。 2、IMF拟上调2025年中国 ...

Group 1 - The core viewpoint is that 3D printing is accelerating its penetration in the consumer electronics sector, with applications such as foldable device hinges and watch/phone frames expected to mark the beginning of a new application era [1] - The global semiconductor market reached a size of $208 billion in Q3 2025, representing a quarter-on-quarter growth of 15.8%, the highest since 2009 [1] - The next three years will see "advanced process expansion" become a key focus for self-controlled development, with CoWoS and HBM positioning themselves to align with AI industry trends, highlighting the importance of advanced packaging [1] Group 2 - The demand for AI-driven computing power is surging, significantly increasing the value across various segments such as servers, AI chips, optical chips, storage, and PCB boards [1] - The Cathay Innovation Chip ETF (589100) tracks the Innovation Chip Index (000685), which saw a daily fluctuation of 20%, reflecting the overall performance of listed companies in the semiconductor industry chain [1] - The index components are primarily concentrated in manufacturing and information technology services, showcasing the technology-intensive and collaborative characteristics of the chip industry [1]

Group 1 - The article highlights the importance of efficiently navigating through a large volume of announcements, providing a service that selects and interprets key announcements for investment opportunities [1] - A subsidiary of a company has signed contracts for semiconductor testing equipment sales totaling 433 million yuan, primarily for advanced storage applications [1] - The company plans to invest 480 million yuan to construct a 40,000 tons/year electronic-grade phosphoric acid project, which is mainly used in wafer manufacturing [1] - The company is expected to win a bid for a large state-owned project involving chip packaging and human-machine collaborative systems, linking to sectors such as AI, new energy vehicles, and charging stations [1]

来源：新浪证券-红岸工作室 12月9日，汇成股份跌3.82%，成交额4.80亿元，换手率3.61%，总市值131.70亿元。 异动分析 存储芯片+先进封装+芯片概念+人民币贬值受益+专精特新 1、2025年10月14日公司，合肥新汇成微电子股份有限公司举办特定对象调研活动，向舟资本、兴全基 金、平安资管等多家机构投资者披露重磅布局：公司通过直接与间接投资相结合，拿下合肥鑫丰科技有 限公司（简称 "鑫丰科技"）27.5445% 股权，并与鑫丰科技股东华东科技（苏州）有限公司（简称 "华 东科技"）达成战略合作，共同拓展 3D DRAM 等存储芯片封测业务，瞄准 AI 基建时代下存储芯片的爆 发式需求。 2、据2023年2月投资者关系活动记录表： Chiplet先进封装技术是凸块制造、Fan-out、3D、SiP等高端先 进封装技术的集合，公司掌握的凸块制造技术是Chiplet的基础之一。在研发端，公司将以客户需求为导 向，基于凸块制造技术，纵向拓展技术边界，积极布局Fan-out、2.5D/3D、SiP等高端先进封装技术。 3、合肥新汇成微电子股份有限公司的主营业务是集成电路高端先进封装测试服务。公司的主要产品 ...

Core Insights - Nvidia's investment in Synopsys and collaboration with EDA tool providers highlights a shift in the semiconductor industry towards system-level optimization rather than just process competition [3] - The trend indicates that advanced packaging and EDA tools are becoming critical for enhancing performance and controlling costs in semiconductor design [3][13] - The local semiconductor industry is encouraged to leverage this paradigm shift to create opportunities for growth and innovation [3][15] Group 1: EDA+ Concept - The EDA+ framework proposed by Silicon Chip Technology aims to reconstruct the design, simulation, and verification processes for advanced packaging [7] - EDA+ is not merely an addition to traditional EDA tools but represents a comprehensive redesign focused on 2.5D/3D integration [7][13] - The 3Sheng Integration Platform serves as the foundational technology for EDA+, facilitating a complete engineering loop from system architecture to manufacturing verification [12] Group 2: Industry Trends - The semiconductor industry's shift towards advanced packaging is driven by the need for enhanced computational power and the limitations of Moore's Law [13] - EDA's role is evolving to become a critical link between design and manufacturing, necessitating a unified environment for considering various design factors [13][14] - Major players like TSMC and Nvidia are establishing partnerships to secure competitive advantages through deep integration of EDA and manufacturing processes [15] Group 3: Implementation and Value - EDA+ has already been implemented in several 2.5D/3D projects, significantly reducing design convergence time from three months to approximately ten days [14] - The platform is also exploring the development of reusable chiplet models, which will enhance collaboration across different manufacturers and technology nodes [14] - EDA+ provides a framework for deep industry collaboration, allowing for the transfer of manufacturing knowledge to the design phase and vice versa [14] Group 4: Opportunities for Local Industry - The local semiconductor industry can adopt a strategy of vertical and horizontal collaboration to compete with international giants [15] - Vertical collaboration involves strengthening the connections between different stages of the supply chain using platforms like EDA+ [15] - Horizontal collaboration focuses on cooperation among local EDA firms to cover the complex advanced packaging design process, potentially leading to a unified approach in the Chiplet and 3DIC markets [15][18]

如果您希望可以时常见面，欢迎标星收藏哦~ 谷歌的 TPU 在被外部采用后，成为了人工智能领域的头条新闻；然而，这其中存在一个可能成为重大制约因素的方面。 在当今人工智能计算领域，人们对专用集成电路（ASIC）的兴趣空前高涨，这主要是因为人们普遍认为，在人工智能应用的下一阶段——推理阶 段，像谷歌的TPU这样的芯片将凭借更低的总体拥有成本和更优异的性能占据主导地位。随着谷歌第七代Ironwood TPU的推出，Meta和Anthropic 等公司纷纷表示有兴趣将ASIC集成到他们的工作负载中，TPU被外部采用的趋势也愈发明显。然而，如果谷歌想要进军基础设施市场，供应链的 限制将构成巨大的挑战。 据《中国时报》报道，谷歌的TPU芯片产量可能无法达到市场预期，主要原因是该公司难以从台积电等供应商处获得先进的封装材料，而这对于成 功量产至关重要。诸如CoWoS之类的技术是芯片制造商大幅提升芯片性能的一种途径。以TPUv7为例，谷歌采用了MCM（多芯片模块）设计，可 以将多个芯片集成到一个统一的封装中。 TPUv7 并非采用大型单芯片，而是将多个硅芯片集成在硅中介层上，并通过微凸点阵列连接各个芯片组。这最终实现了可扩展 ...