证券研究报告 自动化设备 / 公司点评 / 2025.09.01 投资评级:增持(维持) | 基本数据 | 2025-08-29 | | --- | --- | | 收盘价(元) | 30.99 | | 流通股本(亿股) | 2.49 | | 每股净资产(元) | 5.57 | | 总股本(亿股) | 2.54 | 最近 12 月市场表现 -12% 2% 17% 31% 45% 60% 快克智能 沪深300 分析师 佘炜超 SAC 证书编号：S0160522080002 shewc@ctsec.com 分析师 谢铭 SAC 证书编号：S0160523010001 xieming@ctsec.com 分析师 孟欣 SAC 证书编号：S0160523090002 mengxin@ctsec.com 拥抱 AI 浪潮，产业升级带动设备需求 快克智能(603203) 分析师 何兵 SAC 证书编号：S0160525080007 hebing@ctsec.com 相关报告 1. 《消费电子逐步复苏，静待半导体业务进 展》 2025-04-30 2. 《三季度期间费用率有所上升，公司短期 业绩承压》 2024-10-31 ...

每经AI快讯，有投资者在投资者互动平台提问：请问公司的HBM键合设备项目的进展情况。 快克智能（603203.SH）8月25日在投资者互动平台表示，公司TCB设备整体进度在计划之内。 （文章来源：每日经济新闻） ...

Core Viewpoint - ASMPT reported a revenue of HKD 3.4 billion for Q2 2025, showing a year-on-year growth of 1.8% and a quarter-on-quarter growth of 8.9%, closely aligning with Bloomberg's consensus estimate of HKD 3.47 billion [1] Financial Performance - Revenue for Q2 2025 was HKD 3.4 billion, with a gross margin of 39.7%, a year-on-year decrease of 33 basis points and a quarter-on-quarter decrease of 119 basis points, in line with Bloomberg's expectation of 40% [1] - Net profit was HKD 134.3 million, a year-on-year decline of 1.7% but a quarter-on-quarter increase of 62.6%, falling short of Bloomberg's consensus estimate of HKD 147 million [1] - The company expects revenue for the next quarter to be between USD 4.45 billion and USD 5.05 billion, with a median growth of 10.8% year-on-year and 8.9% quarter-on-quarter, exceeding Bloomberg's consensus estimate of USD 4.65 billion [1] Business Segments - SMT orders saw significant growth, driven by AI and the Chinese market, with SEMI business revenue increasing by 21.4% year-on-year and 0.8% quarter-on-quarter [1] - Non-advanced packaging business is recovering steadily due to supply chain diversification, increased AI demand, and improved OSAT capacity utilization in China [1] - The company observed a trend of increasing orders in the SMT business, with a year-on-year increase of 51.6% and a quarter-on-quarter increase of 29.3% [1] Advanced Packaging Developments - Orders for TCB in advanced packaging increased by 50% year-on-year in the first half of 2025, with successful installations for leading HBM3E 12H customers [2] - The company is progressing from trial production to mass production for C2W AOR TCB in collaboration with leading foundries [2] - The second-generation HB tools are expected to be delivered to HBM customers in Q3, showcasing competitive advantages in alignment and bonding accuracy [2] Investment Recommendations - The target price has been raised to HKD 77.2, maintaining a "Buy" rating, with net profit estimates for 2025/2026/2027 increased by 3%/8%/7% to HKD 623 million/HKD 1.035 billion/HKD 1.627 billion [3] - The company is expected to benefit from AI-driven advanced packaging technology and long-term growth potential, with a target price based on a 31x PE for 2026 [3]

Investment Rating - The report maintains a "Buy" rating for ASMPT with a target price of 77.2 HKD, up from the previous 69 HKD [4][6]. Core Insights - ASMPT's 2Q25 revenue reached 34.0 billion HKD, showing a year-on-year increase of 1.8% and a quarter-on-quarter increase of 8.9%, closely aligning with Bloomberg consensus expectations [1][6]. - The order amount was 37.5 billion HKD, reflecting a year-on-year growth of 20.2% and a quarter-on-quarter growth of 11.9%, exceeding Bloomberg consensus expectations by 16% [1][2]. - The gross margin was reported at 39.7%, a slight decline of 33 basis points year-on-year and 119 basis points quarter-on-quarter, which is in line with expectations [1][2]. - Net profit for the quarter was 1.343 billion HKD, down 1.7% year-on-year but up 62.6% quarter-on-quarter, falling short of Bloomberg consensus expectations [1][2]. Revenue and Orders - The SEMI business revenue increased by 21.4% year-on-year and 0.8% quarter-on-quarter, driven by strong AI-related power management demand and improved OSAT capacity utilization in the Chinese market [2]. - SMT business revenue saw a year-on-year decline of 16.7% but a quarter-on-quarter increase of 22.6%, with orders increasing by 51.6% year-on-year and 29.3% quarter-on-quarter, driven by significant orders from smartphone clients and new AI server-related orders [2]. Advanced Packaging - Orders for TCB in the advanced packaging segment increased by 50% year-on-year in the first half of 2025, with successful installations for leading HBM3E 12H customers [3]. - The company is progressing towards mass production of AOR TCB for C2W applications, with competitive advantages in alignment and bonding accuracy for the second-generation HB tools expected to be delivered in Q3 [3]. Financial Projections - The report projects net profit increases of 3% for 2025, 8% for 2026, and 7% for 2027, resulting in net profits of 6.23 billion HKD, 10.35 billion HKD, and 16.27 billion HKD respectively [4][10]. - Corresponding EPS estimates are 1.50 HKD for 2025, 2.49 HKD for 2026, and 3.91 HKD for 2027 [4][10]. Valuation Metrics - The target price adjustment to 77.2 HKD is based on a 31x PE for 2026, compared to a comparable company average of 25.2x [4][32]. - The current market capitalization is approximately 26.32 billion HKD, with a closing price of 63.20 HKD as of July 23 [7].

Core Viewpoint - The article discusses the recent rumors regarding South Korean equipment manufacturers, specifically Hanmi Semiconductor, halting the supply of critical TCB equipment for China's HBM production, highlighting the geopolitical tensions affecting the semiconductor industry [1][4]. Group 1: HBM Technology and Equipment - HBM chips have gained significant popularity due to their high memory bandwidth and capacity, essential for AI model training and inference [2]. - The TCB equipment plays a crucial role in the production of HBM chips by aligning and welding DRAM chips to substrates with micron-level precision [2][3]. - Hanmi Semiconductor has become a leader in the TCB equipment market, supported by SK Hynix's investment and collaboration since 2017 [3]. Group 2: Geopolitical Context - The U.S. has been exerting pressure on South Korea to restrict the supply of semiconductor equipment to China, particularly targeting HBM technology [4][5]. - Chinese companies like Huawei and Biren Technology face procurement restrictions for HBM from South Korean suppliers, impacting their AI chip development [4]. Group 3: Impact and Alternatives - Despite the potential supply disruptions, Chinese companies have been stockpiling HBM equipment, with reports indicating that Hefei Changxin's inventory could last until 2027 [5]. - Other global suppliers, including Japanese and Singaporean companies, can provide similar TCB equipment, offering alternatives to Chinese manufacturers [5]. - Domestic Chinese companies, such as Plascent, are developing their own TCB equipment, indicating a shift towards self-sufficiency in semiconductor manufacturing [5]. Group 4: Future Prospects - The article suggests that advancements in HBM4 technology may favor Chinese manufacturers, as they have already begun exploring mixed bonding techniques necessary for achieving high yields [5]. - Longjiang Storage is highlighted as a key player in this development, having previously adopted complex architectures to avoid patent conflicts, positioning itself ahead of competitors [5].