Group 1: Core Insights - The semiconductor industry is transitioning into the "post-Moore era," leading to a shift in technological innovation towards advanced packaging technologies, which are crucial for the development of AI, HPC, and 5G [1][7] - The demand for advanced packaging technologies, such as CoWoS, is surging due to the rapid penetration of domestic AI chips in large model training and terminal applications [1][5] Group 2: Advanced Packaging Technology Overview - Advanced packaging technology plays a critical role in semiconductor manufacturing, providing electrical interconnection, mechanical support, and thermal management [2] - The evolution of packaging technology has seen significant changes from through-hole mounting to surface mount technology, and now to advanced packaging techniques like BGA, CSP, and 2.5D/3D packaging [3][4] Group 3: Market Demand and Applications - Advanced packaging is increasingly applied in high-end fields such as AI, HPC, and 5G, with its market share in the overall packaging and testing market continuously rising [5] - The need for advanced packaging is particularly high in AI chips due to the demands for high performance and efficiency, driven by large model training and inference [6] Group 4: Domestic Equipment Development - The domestic semiconductor industry is making significant strides in the development of advanced packaging equipment, driven by the increasing adoption of technologies like CoWoS [8] - Companies like Huazhuo Precision and Pulaixin Intelligent are leading the way in developing high-end equipment for HBM chip manufacturing and CoWoS technology, respectively [9][11] Group 5: Future Prospects - The advanced packaging market is expected to experience explosive growth as the challenges in advanced process technology increase [7] - The advancements in domestic equipment and technology are likely to enhance the competitiveness of the domestic semiconductor industry in the global market [8][10]