Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [7][8]. Event Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [8]. - The event aims to gather industry and research experts to discuss advanced packaging technologies and promote collaboration between the semiconductor industry and research institutions [9]. Conference Agenda - The agenda includes various sessions on topics such as CIS heterogeneous integration processes, 2.5D/3D chip integration, and the impact of artificial intelligence on chip interconnects [3][4]. - Keynote speeches will be delivered by government leaders and representatives from the organizing bodies [3]. Focus Areas - The conference will emphasize multi-material heterogeneous integration, optoelectronic integration, and advanced packaging technologies, including TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [9]. - Discussions will also cover challenges and innovations in semiconductor materials and equipment [9]. Registration and Fees - The registration fee is RMB 2500 per person, with early bird discounts available for those who register before October 31 [10]. - Special pricing is offered for students at RMB 1500 [10].

Core Viewpoint - The article discusses the current state and future potential of Panel Level Packaging (PLP) technology in China, highlighting its market size, key players, and the anticipated growth in the industry [2][3][4]. Market Overview - The existing market size for PLP in China is estimated at 38 million USD, accounting for 20% of the global PLP market, with expectations to exceed 100 million USD by 2028 [2]. - The PLP technology is still in the trial-and-error phase, with major companies expressing high expectations for its future applications in storage and computing chip packaging [2]. Key Players - Major global players in the PLP market include Samsung Electronics, ASE Group, STMicroelectronics, Powertech Technology, Hefei Silan Microelectronics, and Chongqing Silan Microelectronics [2]. - Domestic companies like Silan Microelectronics and Yicheng Technology are emerging as significant competitors, with Silan Microelectronics ranking among the top two in market share for power semiconductor PLP solutions [3]. Technological Development - The article emphasizes that domestic companies are accelerating the development of PLP platforms, preparing for a new technological iteration cycle in the packaging industry over the next 2-3 years [4]. - The focus of the upcoming conference will be on advanced packaging technologies, including multi-material heterogeneous integration and optical-electrical co-packaging [6]. Upcoming Events - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, aimed at fostering collaboration and innovation in the advanced electronic information industry [5][6].

Group 1 - The technology sector in A-shares continues to perform well, with a focus on systematic investment strategies in the technology field [1] - The underlying hardware systems are crucial for advancements in AI and autonomous driving, with computing power being likened to "oil" in the digital age [3] - China still relies on imports for high-end chips, advanced manufacturing equipment, and key materials, but technological breakthroughs and policy support are accelerating the restructuring of the semiconductor industry [6] Group 2 - The concept of "storage-compute integration" is emerging, which allows for data processing at the storage unit level, addressing the challenges of power consumption and latency in traditional computing architectures [9] - Advanced packaging technology, particularly optical-electrical co-packaging, is becoming essential for improving data transmission efficiency and reducing losses, with significant market growth potential [13] - The focus on semiconductor leaders and technology innovation is critical for capturing investment opportunities in the tech sector [14]

Group 1 - The technology sector in A-shares continues to perform well, with a focus on systematic investment strategies in the technology field [1] - The underlying hardware systems are crucial for advancements in AI and autonomous driving, with computing power being likened to "oil" in the digital age [3] - China still relies on imports for high-end chips, advanced manufacturing equipment, and key materials, but technological breakthroughs and policy support are accelerating the restructuring of the semiconductor industry [6] Group 2 - The concept of "storage-compute integration" is emerging, which allows for data processing at the storage unit level, addressing the challenges of power consumption and latency in traditional computing architectures [9] - Advanced packaging technology, particularly optical-electrical co-packaging, is becoming essential for improving data transmission efficiency and reducing losses, with significant market growth potential [14] - The focus on semiconductor leaders is critical for capturing opportunities in technological innovation [15]