中信建投（601066）发布研报称，PCB行业呈现重回上行期、产品高端化、东南亚建厂等特点，产量的 增加及工艺的变化有望持续拉动PCB设备的更新和升级需求。钻孔、曝光、电镀、检测为PCB生产中的 核心环节，直接决定了电路板的互联密度、信号完整性和生产良率。AI驱动行业向更高层数、更精细 布线和更高可靠性方向发展，对加工工艺提出更高的要求，各环节均有显著变化。 AI驱动下对PCB的加工工艺带来更高要求。AI驱动行业向更高层数、更精细布线和更高可靠性方向发 展，对加工工艺提出更高的要求。在钻孔环节，电路板不仅需要处理传统通孔，还要集成盲孔、埋孔、 背钻孔以及高密度层间互连孔等多种导通结构，以满足高速信号传输和紧凑布局的需求;在曝光环节， 中高端PCB产品曝光精度要求明显提升;在电镀环节，更微小、密度更高的孔，对电镀的均匀性等带来 挑战。新工艺有望持续拉动PCB设备的更新和升级需求。 全球PCB行业迎来新一轮上行周期。2024年，受益于AI推动的交换机、服务器等算力基建爆发式增长， 智能手机、PC的新一轮AI创新周期，以及汽车电动化/智能化落地带来的量价齐升，HDI、层数较高的 多层板等高端品需求快速增长，PCB行 ...

Core Viewpoint - The market is highly focused on the development of Shennan Circuit, a leading company in the PCB industry, as evidenced by over a hundred institutions conducting on-site research [1] Group 1: Business Performance - In Q1 2023, Shennan Circuit achieved revenue of approximately 48 billion yuan and a net profit attributable to shareholders of about 5 billion yuan, both showing over 20% year-on-year growth [1][2] - The company's revenue for the first three months was 47.83 billion yuan, a 20.75% increase year-on-year, while the net profit was 4.91 billion yuan, up 29.47% year-on-year [2] - The growth in revenue and profit is attributed to increased demand in high-speed network communication, computing power, and the automotive electronics sector [2] Group 2: Product and Market Strategy - Shennan Circuit's PCB business focuses on communication devices, data centers, and automotive electronics, with a notable increase in orders from the wireless communication sector [2] - The company has a diverse range of packaging substrate products, which have seen improved demand, particularly in storage products [3] - The company is expanding its overseas market presence with a factory in Thailand, investing approximately 12.74 billion yuan to enhance global supply capabilities [1][7] Group 3: Financial Health and Expansion - As of the end of 2024, Shennan Circuit's total assets increased from 207.27 billion yuan in 2022 to 253.02 billion yuan [7] - The company maintains a healthy financial position with a debt ratio of 42.14% and cash reserves of 17.08 billion yuan as of March 2023 [7] - Shennan Circuit has a history of steady dividends, proposing a cash dividend of 7.69 billion yuan for 2024, with a payout ratio of 40.97% [8][9] Group 4: Industry Position - According to Prismark, Shennan Circuit is expected to rank fourth among global PCB manufacturers in 2024, an improvement of four positions from 2023 [6] - The company has demonstrated resilience in the PCB industry, achieving continuous revenue and profit growth since 2016, except for a decline in 2023 due to market fluctuations [3][4]

Group 1: Financial Performance - In Q1 2025, the company achieved revenue of 4.91 billion RMB, a year-on-year increase of 20.75% [1] - The net profit attributable to shareholders was 0.47 billion RMB, up 29.47% year-on-year [1] - The net profit excluding non-recurring gains and losses was 0.48 billion RMB, reflecting a growth of 44.64% [1] Group 2: PCB Business Development - The PCB business focuses on communication equipment, particularly in data centers and automotive electronics, with a slight recovery in wireless orders and continued growth in wired demand [2] - Orders in the data center sector continued to grow, driven by demand for AI accelerator cards and servers [2] - The automotive electronics sector is experiencing stable growth, particularly in new energy and ADAS directions [2] Group 3: Packaging Substrate Business - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [3] - Demand for packaging substrates improved in Q1 2025, mainly due to increased demand for storage products [3] Group 4: Production Capacity and Utilization - The overall production capacity utilization remains high, particularly in the PCB business due to sustained demand in computing power and automotive electronics [4] - The packaging substrate business has seen an increase in capacity utilization compared to Q4 2024 due to improved demand in the storage sector [4] Group 5: Impact of U.S. Sales and Tariff Policies - Direct sales to the U.S. accounted for a low proportion of total revenue, indicating limited impact from U.S. tariff policies [5] - The company is closely monitoring the evolving international trade environment and maintaining communication with industry stakeholders [5] Group 6: HDI Process Capability - The company possesses HDI process capabilities, applicable in communication, data centers, industrial control, medical, and automotive electronics sectors [6] Group 7: FC-BGA Packaging Substrate Development - The company has achieved batch production capability for FC-BGA packaging substrates with up to 20 layers, with ongoing development for products exceeding 20 layers [7] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with some cost impacts on profits [7] Group 8: Expansion Plans - The PCB business is expanding with factories in Shenzhen, Wuxi, Nantong, and a project in Thailand, focusing on technology upgrades and capacity enhancement [8] - The Nantong Phase IV project is under construction to establish an HDI technology platform [8] Group 9: Thailand Factory Investment - The total investment for the Thailand factory is 1.274 billion RMB, aimed at enhancing overseas market reach and meeting international customer demands [9] Group 10: Raw Material Price Changes - Key raw materials have seen price increases in Q1 2025 due to commodity price fluctuations, impacting costs [10] - The company is actively monitoring raw material prices and maintaining communication with suppliers and customers [10]