Group 1 - The company is currently focused on the display driver chip packaging and testing field [1] - The company has not engaged in cooperation with storage chip manufacturers [1] - Major clients of the company include Lianyi, Ruiding, Yili, Jichuang Beifang, Tiande Yu, Xinxiangwei, and Yunyinggu [1]

Group 1: Financial Performance - The company achieved a revenue of 955,879.09 million CNY, representing a year-on-year growth of 12.27% [2] - The net profit attributable to shareholders was 3,251.46 million CNY, a decrease of 32.26% compared to the previous year [2] - The decline in profit was primarily due to a decrease in product prices leading to lower gross margins, an increase in financial expenses by 19.71 million CNY due to exchange rate impacts, and non-recurring gains affecting net profit by approximately 16.28 million CNY from government subsidies [3] Group 2: Profit Distribution - The proposed profit distribution plan for 2024 is to distribute a cash dividend of 0.4 CNY per 10 shares, totaling 12,659,810.60 CNY (tax included) based on a total share capital of 327,551,705 shares, after deducting repurchased shares [3] Group 3: Business Strategy and Outlook - The company is considering optimizing its business structure by eliminating underperforming assets and retaining high-value assets to enhance overall company value [2] - There are ongoing efforts to improve gross margins, control costs, and explore new business growth points to achieve profitability in the second quarter of 2025 [3] - The collaboration with Kunshan Risen Technology is focused on advancing customer resources, technology, and processes for chip packaging projects [3] Group 4: Investor Relations - The investor relations activity was held online on May 13, 2025, with participation from key executives including the Chairman and General Manager, Wan Feng, and the Vice General Manager and CFO, Li Yuyuan [2] - The company will announce any future capital operations in a timely manner [2]

Core Viewpoint - The semiconductor packaging and testing industry is undergoing significant changes as traditional OSAT (Outsourced Semiconductor Assembly and Test) companies face intense competition from foundries like TSMC, Samsung, and Intel, which are entering the advanced packaging sector. Traditional OSAT firms are actively expanding their capabilities and investing in advanced packaging technologies to maintain their market positions [1][16][38]. Group 1: Traditional OSAT Companies' Expansion - ASE Group (日月光) is expanding its advanced packaging capacity by investing $200 million in a FOPLP production line in Kaohsiung, Taiwan, aiming for mass production by the end of the year [2][3]. - ASE has also inaugurated its fourth and fifth factories in Penang, Malaysia, with a total investment of $300 million to meet the growing demand for automotive semiconductors and AI applications [3][4]. - ASE is acquiring two packaging factories from Infineon in the Philippines and South Korea for approximately NT$2.1 billion to enhance its capabilities in automotive and industrial automation applications [5][6]. Group 2: Amkor Technology's Developments - Amkor plans to triple the annual production capacity of its factory in Vietnam from 1.2 billion to 3.6 billion units, reflecting strong growth in the region [7][8]. - The company is investing $2 billion to build an advanced semiconductor packaging and testing facility in Arizona, USA, primarily serving TSMC and Apple [8][9]. Group 3: Longsys Technology's Innovations - Longsys Technology is focusing on high-density packaging technologies, including 2.5D/3D packaging, and has launched a high-end manufacturing project in Jiangsu with a total investment of 10 billion yuan [9][24]. - The company has developed a high-density heterogeneous integration technology platform, XDFOI, which has entered stable mass production and is being applied in high-performance computing and AI fields [24][25]. Group 4: Tongfu Microelectronics' Advancements - Tongfu Microelectronics has established a 2.5D/3D packaging platform and is expanding its capabilities in high-performance computing, with new processes developed for chiplet packaging [28][29]. - The company is also focusing on glass substrate packaging technology to meet the demands of various high-performance chip applications [29][30]. Group 5: Huada Semiconductor's Strategic Moves - Huada Semiconductor is investing in advanced packaging technologies, including SiP and 3D packaging, and has launched a new 2.5D packaging technology platform to cater to AI demands [31][32]. - The company is also developing a 3D Matrix packaging platform that integrates TSV and eSiFo technologies for high-density heterogeneous integration [35][36]. Group 6: Powertech Technology's Expansion - Powertech Technology is expanding its testing capabilities in Japan with a new investment of 5 billion yen to enhance its semiconductor testing and mass production capabilities [13][14]. - The company is evaluating a proposal to establish a high-end chip packaging factory in Japan, aiming to leverage the country's advanced testing technology and stable automotive chip market [14][36].