Core Viewpoint - The company, Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd., has announced an adjustment to its 2024 annual profit distribution cash dividend total due to changes in its total share capital following the completion of stock incentive plans [1][2]. Summary by Sections Adjustment of Profit Distribution - The total amount of cash dividends for the 2024 fiscal year has been adjusted from 186,080,238.60 CNY (including tax) to 187,214,710.20 CNY (including tax) [1][2]. - The adjustment is based on the increase in the company's total share capital from 622,363,735 shares to 626,145,307 shares due to the completion of various stock incentive plans [1][2]. Previous Profit Distribution Plan - The initial profit distribution plan approved on April 17, 2025, proposed a cash dividend of 3.00 CNY (including tax) for every 10 shares, based on a total share capital of 620,267,462 shares after deducting shares held in the company's repurchase account [1]. - The total cash dividend amount was calculated based on the adjusted share capital after accounting for repurchased shares [1]. Revised Profit Distribution Plan - Following the completion of the stock incentive plans, the total share capital increased, leading to a revised cash dividend distribution plan that maintains the same per-share distribution ratio [2]. - The adjusted total cash dividend amount is now based on a total of 624,049,034 shares eligible for profit distribution, resulting in a total cash dividend of 187,214,710.20 CNY (including tax) [2].

Group 1 - The company is holding its second extraordinary general meeting of shareholders in 2025 to ensure the rights of all shareholders and maintain order during the meeting [1][2] - Only shareholders, their proxies, company directors, supervisors, senior management, and invited personnel are allowed to attend the meeting, while other unrelated individuals may be refused entry [1][2] - Shareholders and their proxies must arrive 20 minutes before the meeting to sign in and present necessary identification documents [1][2] Group 2 - The meeting will announce the number of shareholders present and the total voting rights held before allowing any latecomers to participate in voting [2] - Shareholders have the right to speak, inquire, and vote during the meeting, but must adhere to the agenda and time limits for speaking [2][3] - The meeting will utilize both on-site and online voting methods, with specific time slots designated for each [4][5] Group 3 - The agenda includes the establishment of a private equity fund and related party transactions, with a proposed fundraising scale of RMB 1.5 billion [5][6] - The fund will focus on investments in the semiconductor and strategic emerging sectors, with the company planning to contribute up to RMB 735 million [5][6] - The proposal has been approved by the company's board and is now subject to shareholder voting [6]

分析师：邹臣 登记编码：S0730523100001 zouchen@ccnew.com 021-50581991 证券研究报告-行业半年度策 略 电子相对沪深 300 指数表现 人工智能创新百花齐放，半导体自主可控 加速推进 相关报告 《电子行业月报：美国半导体出口管制再升 级，存储器价格持续回升》 2025-06-13 《电子行业月报：半导体行业 25Q1 稳健增 长，端侧 AI 助力 SoC 厂商高速成长》 2025-05-12 《电子行业月报：美国"对等关税"政策落地， 关注半导体自主可控方向》 2025-04-08 投资要点： 回顾 2025 年上半年，DeepSeek 通过技术创新引领国产大模型崛 起，助力 AI 应用大规模落地，人工智能创新持续推进，AI 眼镜新 品陆续发布，比亚迪推动"智驾平权"，全民智驾时代开启，特斯 拉计划 2025 年生产数千台具身智能机器人，2026 年计划将产能提 升至 5 万台以上，具身智能机器人进入量产阶段；半导体行业上半 年延续复苏趋势，美国"对等关税"政策落地，美国半导体出口管制 不断升级，国内半导体产业自主可控需求仍然迫切。展望 2025 年 下半年，AI ...

中兴财光华会计师事务所（特殊普通合伙）关于 元成环境股份有限公司 2024 年年度 报告的信息披露监管工作函中的有关问题的专项说明 中兴财光华会计师事务所（特殊普通合伙）关于 元成环境股份有限公司 2024 年年度 报告的信息披露监管工作函中的有关问题的专项说明 上海证券交易所上市公司管理二部： 贵部《关于元成环境股份有限公司 2024 年年度报告的信息披露监管工作函》 （以下简称"工作函"）收悉。中兴财光华会计师事务所（特殊普通合伙）（以 下简称"我们"）是元成环境股份有限公司（以下简称"元成股份"或"公司"） 发表意见的问题进行了审慎核查，现将情况汇报如下： 一、关于经营情况。年报显示，2024 年度公司实现营业收入 1.46 亿元，同 比下降 46.79%，扣非前后的净利润分别亏损 3.25 亿元、3.23 亿元，同比亏损幅度 加大。公司称主要受行业周期波动影响主要业务收缩导致营业收入下滑、计提减 值损失增加等使净利润减少。分产品看，除苗木销售及电子设备及元器件外，公 司工程施工及绿化养护、规划设计等主营业务毛利率分别为-27.94%、-14.27%，同 比大幅下滑。分季度看，公司第四季度实现营收 1. ...

Core Viewpoint - The article discusses the challenges and potential solutions related to high numerical aperture (NA) EUV lithography, particularly focusing on the need for larger reticle sizes to improve manufacturing efficiency and yield [2][11][12]. Group 1: Challenges of High NA EUV Lithography - Circuit stitching between exposure fields poses significant challenges for design, yield, and manufacturability in high NA (0.55) EUV lithography [2]. - The transition from 6×6 inch reticles to 6×11 inch reticles could eliminate the need for circuit stitching but would require nearly complete replacement of the reticle manufacturing infrastructure [2][11]. - The area limitation of modern multi-core SoCs complicates the use of 193nm immersion and EUV lithography, as the effective exposure area is reduced due to the use of deformable optics [2][3]. Group 2: Yield and Performance Issues - The process of stitching multiple masks into a single design is becoming a critical challenge across various lithography processes, particularly for high NA EUV exposure [3]. - Misalignment between stitched masks can lead to yield issues, especially for critical layers, with an estimated 2nm misalignment causing at least a 10% error in critical dimensions [3][5]. - The presence of a black border on EUV masks can introduce additional stress and distortion, complicating the printing of features near the stitching boundary [6][12]. Group 3: Design Solutions and Optimizations - To mitigate performance threats, designers are encouraged to keep circuit features away from boundary areas, which can lead to yield and performance degradation [8][9]. - Various design optimizations have been proposed to reduce the number of lines crossing stitching boundaries, with some approaches achieving a reduction in stitching area loss to below 0.5% and performance degradation to around 0.2% [9]. - The industry is prepared to tackle the challenges posed by stitching-aware design, although the impact on throughput remains a concern [9]. Group 4: Future Directions and Industry Perspectives - Increasing reticle sizes could address both stitching and throughput challenges, with estimates suggesting that yield could drop by up to 40% if exposure fields are halved [11]. - The transition to larger reticle sizes will necessitate changes across various manufacturing equipment, potentially doubling costs for some devices [11][12]. - Despite the technical advantages of larger reticles, industry skepticism remains regarding the associated costs and the need for upgrades to meet future technology nodes [12].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 经济时报 。 美国芯片设备制造商应用材料公司（Applied Materials）在印度的子公司Applied Materials India 计划在班加罗尔建设一座芯片制造设备的研发中心，该项目未来有望吸引超过20亿美元的投资。 该 公 司 印 度 区 董 事 总 经 理 兼 半 导 体 产 品 事 业 部 负 责 人 Suraj Rengarajan 在 接 受 《 经 济 时 报 》 （ET）采访时透露了这一消息。这一表态出现在卡纳塔克邦内阁小组委员会批准包括应用材料项 目在内的三个半导体项目的三周后。目前，该公司正计划在未来四年内向该设施投资4亿美元。 Rengarajan表示："我们计划在印度建立一个名为'半导体制造创新中心（ICSM）'的机构，旨在引 导超过20亿美元的投资，创造高科技机会，并加速半导体创新。" 另一家美国芯片设备制造商泛林集团（Lam Research）也将在卡纳塔克邦设立两个单位：一个投 资679亿卢比的先进研发实验室，以及一个投资911亿卢比的半导体硅元件制造工厂，共将创造 1400个就业岗位，提供2nm技术与硅锭生产 ...

Core Viewpoint - Shanghai Xinshi Technology Co., Ltd. has officially submitted its IPO application to the Shanghai Stock Exchange for listing on the Sci-Tech Innovation Board, marking a significant step in its growth as a leading domestic manufacturer of semiconductor-grade perfluoroether rubber seals [2][3]. Company Overview - The company is a leading enterprise in the domestic semiconductor-grade perfluoroether rubber seal market, focusing on the research and application innovation of perfluoroether rubber technology [3]. - It has independently developed and achieved stable mass production of semiconductor-grade perfluoroether rubber materials and seals, breaking the monopoly of foreign companies like DuPont, GT, and PPE in this field [3][5]. Product and Market Position - The company's products are essential for vacuum sealing in semiconductor front-end process equipment, which is critical for wafer manufacturing [4]. - The perfluoroether rubber seals are classified as key consumable components, significantly impacting wafer yield and production continuity due to their performance in harsh environments [4]. - According to Frost & Sullivan, the company ranked third in sales of semiconductor-grade perfluoroether rubber seals in China for 2023 and 2024, and first among domestic companies [3]. Industry Context - The semiconductor-grade perfluoroether rubber seal market has a low domestic production rate, with less than 10% expected in 2024, indicating a significant opportunity for domestic manufacturers [5]. - The company has successfully passed stringent product validations from major semiconductor manufacturers in China, leading to stable supply and gradual market share capture from foreign competitors [5]. Financial Performance - The company projects revenues of approximately 130.47 million yuan and 207.55 million yuan for 2023 and 2024, respectively, with net profits of about 32.81 million yuan and 63.09 million yuan [5]. - The estimated post-IPO market capitalization is expected to be no less than 1 billion yuan [5]. Fundraising and Future Plans - The company plans to publicly issue up to 17.28 million shares, with at least 25% of the total shares being publicly held post-issue [6]. - The raised funds will be allocated to projects focused on the research and industrialization of semiconductor-grade perfluoroether rubber seals and the establishment of a research center [6]. - The implementation of these projects aims to enhance the company's technological advantages, product performance, and production capacity, thereby strengthening its market position and competitiveness in the semiconductor equipment components industry [6].

证券代码：688120 证券简称：华海清科 公告编号：2025-043 华海清科股份有限公司 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ? 股东大会召开日期：2025年7月8日 （三） 投票方式：本次股东大会所采用的表决方式是现场投票和网络投票相结 合的方式 至2025 年 7 月 8 日 采用上海证券交易所网络投票系统，通过交易系统投票平台的投票时间为股 东大会召开当日的交易时间段，即 9:15-9:25,9:30-11:30，13:00-15:00；通过 互联网投票平台的投票时间为股东大会召开当日的 9:15-15:00。 （六） 融资融券、转融通、约定购回业务账户和沪股通投资者的投票程序 涉及融资融券、转融通业务、约定购回业务相关账户以及沪股通投资者的投 票，应按照《上海证券交易所科创板上市公司自律监管指引第 1 号 — 规范运作》 等有关规定执行。 （七） 涉及公开征集股东投票权 不涉及 二、 会议审议事项 本次股东大会审议议案及投票股东类型 投票股东类型 序号 议案名称 A 股股东 非累积投票 ...

北京屹唐半导体科技股份有限公司 首次公开发行股票并在科创板上市 招股意向书附录目录 国泰海通证券股份有限公司 关于 北京屹唐半导体科技股份有限公司 首次公开发行股票并在科创板上市 之 发行保荐书 保荐机构 | 1 发行保荐书…………………………………………………………………………1 | | | --- | --- | | 财务报表及审计报告……………………………...……………………………...27 | 2 | | 3 审阅报告…………………………………………………………………………228 | | | 内部控制审计报告………………………………………………………………327 | 4 | | 经注册会计师鉴证的非经常性损益明细表…………………………...…….…346 | 5 | | 法律意见书…………………………………….…………………… ……….359 | 6 | | 发行人公司章程（草案）….…………………………………………...……….1219 | 7 | | 中国证监会同意本次发行注册的文件………………………………...……...1267 | 8 | 中国（上海）自由贸易试验区商城路 618 号 二〇二 ...

ff9 本次发行股票拟在科创板上市。科创板公司具有研发投入大、经营风险高、 业绩不稳定、退市风险高等特点，投资者面临较大的市场风险。投资者应充 分了解科创板的投资风险及本公司所披露的风险因素，审慎作出投资决定。 北京屹唐半导体科技股份有限公司 Beijing E-Town Semiconductor Technology Co., Ltd. （北京市北京经济技术开发区瑞合西二路 9 号） 首次公开发行股票并在科创板上市 招股意向书 保荐人（主承销商） （中国（上海）自由贸易试验区商城路 618 号） 联席主承销商 （北京市朝阳区建国门外大街 1 号国贸大厦 2 座 27 层及 28 层） 北京屹唐半导体科技股份有限公司 招股意向书 声 明 中国证监会、上海证券交易所对本次发行所作的任何决定或意见，均不表明 其对发行人注册申请文件及所披露信息的真实性、准确性、完整性做出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判断或 者保证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发 行人自行负责；投资者自主判断发行人的投资价值，自主 ...