Core Viewpoint - The China Securities Regulatory Commission has disclosed the completion report of the listing guidance for Beijing Kangmite Technology Co., Ltd., indicating that the company is well-prepared for its public offering and listing on the Beijing Stock Exchange [1] Group 1: Company Overview - Kangmite is a national-level specialized and innovative "little giant" enterprise engaged in the research, production, and sales of electronic packaging materials and high-performance modified plastics [1] - The company focuses on three main technology platforms: organic silicon packaging materials, epoxy packaging materials, and modified expandable polystyrene materials [1] Group 2: Product Offerings - The main product form of the electronic packaging materials is electronic adhesives for LED chip packaging, which are widely used in new displays, semiconductor general lighting, specialized lighting, semiconductor device packaging, and aerospace [2] - The high-performance modified plastics include modified expandable polystyrene, applicable in building energy conservation, safety protection in sports and transportation, and protection for electrical and lithium battery components [2] Group 3: Competitive Positioning - Kangmite's core products, such as high-refractive index organic silicon packaging glue and electronic epoxy packaging glue, have reached performance levels comparable to international brands like DuPont and Shin-Etsu [2] - The company has achieved import substitution in the LED chip packaging adhesive sector and is a leader in this field in China [2] - Since 2018, Kangmite has been a pioneer in the Mini/Micro LED sector, becoming the first domestic manufacturer to achieve mass production of Mini LED organic silicon packaging glue [2] Group 4: Client Base - The company has established a strong brand image and accumulated a wealth of high-quality customer resources, becoming a preferred partner for many well-known brands [3] - Direct or end customers of Kangmite's electronic packaging materials include domestic listed companies in the LED packaging industry and leading enterprises in the new display sector, as well as international lighting and new display industry leaders [3]

Core Viewpoint - Chip Source New Materials has successfully completed a Series C financing round exclusively invested by Beijing Xiaomi Intelligent Manufacturing Equity Investment Fund Partnership, indicating strong investor confidence in the company's growth potential in the semiconductor packaging materials sector [1]. Company Overview - Chip Source New Materials, established in 2022, focuses on the research, production, sales, and technical services of high-end semiconductor packaging materials, with sintered silver products as its core offering [2]. - The company has developed a series of products including automotive-grade sintered silver and communication-grade sintered silver, becoming the only domestic enterprise to achieve mass production of automotive-grade sintered materials [2]. - The products are widely used by major automotive manufacturers, with over 5,000 units being installed daily, showcasing a leading market share [2]. Financing Purpose - The CEO of Chip Source New Materials, Dr. Hu Bo, stated that the financing will primarily be used for the advanced research and industrialization of silicon carbide module packaging materials, aiming to enhance product performance and production processes [3]. - The company plans to strengthen its leading position in high-end semiconductor packaging materials and accelerate market expansion to meet growing demand [3]. Investment Rationale - A representative from Beijing Xiaomi Intelligent Manufacturing Equity Investment Fund highlighted the strong technical strength and innovation capability of Chip Source New Materials in the semiconductor packaging materials field, particularly the large-scale production of automotive-grade sintered silver products [3]. - The investment is expected to help the company enhance its technical level, expand market share, and promote the localization process in the semiconductor packaging materials industry [3]. Industry Perspective - The founder of Shandao Venture Capital noted that the semiconductor industry has received significant support from the government, creating a favorable development environment for semiconductor material companies [3]. - The investment in Chip Source New Materials is seen as recognition of its technical strength and market potential, setting a positive example for the industry [3]. - There is an expectation for more venture capital institutions to focus on and support innovative companies in critical fields like semiconductor materials, contributing to the healthy development of the venture capital ecosystem in China [3].

Core Viewpoint - The transaction aims to enhance the asset quality and profitability of Shenzhen Zhizheng High Polymer Materials Co., Ltd. by acquiring a controlling stake in AAMI, a leading semiconductor packaging materials company, thereby facilitating the company's transition into the semiconductor industry and improving its financial performance [1][4][10]. Group 1: Transaction Purpose and Integration Control - The transaction involves the divestment of loss-making assets and the acquisition of high-potential, profitable assets, which is expected to improve the company's asset quality and profitability [2][4]. - AAMI, as a global top-five supplier of semiconductor lead frames, has strong competitive advantages in high-precision and high-reliability applications, which aligns with the company's strategic shift towards the semiconductor sector [4][7]. - Post-transaction, the company will hold 99.97% of AAMI's shares, enhancing its control and integration capabilities over AAMI's operations [3][4]. Group 2: Financial Impact and Performance Enhancement - The transaction is projected to significantly increase the company's total assets from approximately 636.02 million yuan to 4.766 billion yuan, representing a growth rate of 649.41% [10][11]. - The company's operating revenue is expected to rise from 364.56 million yuan to 2.608 billion yuan, indicating a growth rate of 615.40% [11]. - The net profit attributable to the parent company is forecasted to turn from a loss of 30.53 million yuan to a profit of 17.49 million yuan, marking a substantial improvement in profitability [11][12]. Group 3: Market Position and Competitive Advantage - AAMI has maintained a strong market position, ranking fifth globally in the lead frame market with a market share of 9% as of 2023, and is expected to rise to fourth place with projected revenues of 293.1 million USD in 2024 [6][7]. - The company has established a robust production capacity in both domestic and international markets, which is crucial for meeting the demands of major semiconductor clients [7][18]. - The lead frame technology is critical for semiconductor device reliability and performance, making AAMI's products essential in the semiconductor supply chain [10][9]. Group 4: Management and Operational Independence - AAMI operates independently with a well-established management structure, having transitioned from a division of ASMPT to an independent entity, which enhances its operational efficiency and decision-making capabilities [19][20]. - The management team remains stable post-transaction, ensuring continuity in operations and strategic direction [19][22]. - The company plans to integrate AAMI into its management system while maintaining its operational independence, thereby leveraging AAMI's expertise in the semiconductor materials sector [24][25].

Core Viewpoint - The case of Shenzhen Jinsda Applied Materials Co., Ltd. highlights significant tax evasion through fraudulent reporting of research and development expenses, particularly involving gold materials, leading to a total penalty of 36.18 million yuan [1][7]. Group 1: Tax Evasion and Financial Misconduct - Jinsda Company falsely declared expenses related to gold materials in R&D, resulting in an underpayment of corporate income tax amounting to 16.21 million yuan [1][7]. - The company reported over 80 million yuan in gold as direct material costs, which raised suspicions due to the lack of corresponding product output or waste recovery records [3][5]. - Investigations revealed that the actual loss during gold refining was negligible, contradicting the company's claims of significant losses [5]. Group 2: Systemic Risks and Industry Context - Jinsda's financial irregularities are part of a broader pattern, as its affiliated company, Jinhui Technology, has been listed as a dishonest executor, indicating systemic risks within the group controlled by Wang Zhiliang [8]. - The semiconductor packaging materials industry faces challenges such as low gross margins and high R&D costs, with leading companies typically maintaining R&D expense ratios between 10% and 15% [9]. - If the inflated gold expenses were genuine, they would significantly increase costs and compress profit margins, leading to potential cash flow discrepancies and financial crises [9].

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本报告导读： EMC 龙头强强联合，并购衡所华威打开成长空间。衡所华威是一家从事半导体芯片封装材料研发、生 产和销售的国家级专精特新"小巨人"企业，拥有Hysol 品牌及一百多个型号的产品，销售网络覆盖全球 主要市场。据Prismark 发布的统计数据，2023 年度，衡所华威在环氧塑封料行业按出货量居全国第 一、全球第三。华海诚科和衡所华威均以高性能类环氧塑封料为主，本次并购将有利于上市公司突破海 外技术垄断，整合标的公司研发体系，协同开展半导体封装材料工艺技术的迭代开发，快速取得高端封 装材料技术突破。 EMC 龙头企业华海诚科积极进行横向拓展，收购衡所华威将有利于公司实现研发能力快速提升，加快 取得高端封装材料技术突破。 风险提示：1、下游需求弱于预期；2、新产品导入不及预期；3、并购项目进展不及预期。 投资要点： 调评至"增持 "，目标价 81.22 元。我们预计公司 2025E-2026E 收入为 4.26、5.26 亿元，同增28%、 23%；归母净利润（扣非前）为0.50、0.65 亿元，同增24%、30%。公司当前对衡所华威的收购尚未完 成，故上述盈利预测并未计入并购影响。考虑到完成收购后，公 ...

本次股票发行后拟在科创板市场上市，该市场具有较高的投资风险。科创板公司具有研发投 入大、经营风险高、业绩不稳定、退市风险高等特点，投资者面临较大的市场风险。投资者 应充分了解科创板市场的投资风险及本公司所披露的风险因素，审慎作出投资决定。 江苏华海诚科新材料股份有限公司 Jiangsu HHCK Advanced Materials Co., Ltd. （住所：连云港经济技术开发区东方大道 66 号） 首次公开发行股票并在科创板上市 招股说明书 保荐人（主承销商） （住所：上海市静安区新闸路 1508 号） wujia 江苏华海诚科新材料股份有限公司 招股说明书 声 明 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对注册 申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之 相反的声明均属虚假不实陈述。 根据《证券法》的规定，股票依法发行后，发行人经营与收益的变化，由发 行人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策，自行承 担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的投资 ...