截至发稿，联芸科技市值为213亿元。 每经头条（nbdtoutiao）——展望"十五五" | 专访黄群慧：既要重视AI赋能千行百业，也要考量其对就业 的替代效应和带来的收入极化 2024年1至12月份，联芸科技的营业收入构成为：集成电路占比99.77%，其他业务占比0.23%。 （记者 曾健辉） 每经AI快讯，联芸科技（SH 688449，收盘价：46.35元）11月21日晚间发布公告称，公司限售股份约 2.23亿股将于2025年12月1日解禁并上市流通，占公司总股本比例为48.52%。 ...

Group 1 - The company announced the resignation of its president, Liu Yuping, due to adjustments in work responsibilities, and appointed Ye Jinchun as the new president effective from the board meeting on November 21, 2025 [1] - For the year 2024, the company's revenue composition is projected to be 97.19% from integrated circuits and 2.81% from other businesses [1] - The current market capitalization of the company is 35.9 billion yuan [2]

Group 1 - The core point of the article is that Haiguang Information (SH 688041) held its 16th meeting of the second board on November 21, 2025, to discuss the proposal for the first grant of restricted stock to incentive targets [1] - For the year 2024, Haiguang Information's revenue composition is as follows: integrated circuit products account for 99.7%, while integrated circuit technology services account for 0.3% [1] - As of the time of reporting, Haiguang Information has a market capitalization of 479.5 billion yuan [1]

Core Viewpoint - Wuxi's IPO landscape is rapidly expanding, highlighted by the emergence of Shenghe Jingwei, a notable unicorn in the semiconductor industry, which is preparing for its A-share listing [5][11]. Group 1: Shenghe Jingwei's Development - Shenghe Jingwei was established in 2014 with investments from leading semiconductor companies, aiming to create a complete domestic 12-inch integrated circuit manufacturing chain [8]. - The company has achieved significant milestones, including becoming the first in mainland China to mass-produce 14nm silicon wafer bump processing [10]. - By 2024, Shenghe Jingwei is projected to have the largest 12-inch bump manufacturing capacity in mainland China, providing advanced packaging services for various high-performance chips [10]. Group 2: Financial Performance - Shenghe Jingwei's revenue from 2022 to mid-2025 is expected to grow from approximately 1.633 billion to 3.178 billion yuan, with net profits transitioning from a loss of 329 million yuan to a profit of 435 million yuan [10]. - The company has attracted significant investment, with a valuation reaching 20 billion yuan after a C+ round financing in 2023 [14]. Group 3: Wuxi's IPO Landscape - Wuxi has seen a surge in IPOs, with four companies listed in A-shares since 2025, and a total of 167 listed companies, including 126 A-share companies [6][19]. - The local government has implemented various supportive measures to facilitate the growth of listed companies, contributing to Wuxi's economic development [19][20]. Group 4: Economic Impact - Wuxi's GDP is projected to reach approximately 1.63 trillion yuan in 2024, with a growth rate of 5.8% [20]. - The city is recognized for its strong manufacturing base, with Jiangyin County leading in the number of listed companies among county-level cities in China [20].

易方达国防军工混合A（001475）成立日期2015年6月19日，最新规模81.83亿。今年以来收益9.91%， 同类排名5646/8136；近一年收益5.55%，同类排名6522/8056；成立以来收益46.4%。 易方达国防军工混合A（001475）基金经理为何崇恺。 截至发稿，何崇恺累计任职时间5年361天，现任基金资产总规模215.71亿元，任职期间最佳基金回报 100.27%， 任职期间最差基金回报-15.04%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 责任编辑：小浪快报 11月21日，振华风光跌5.03%，截至发稿，报55.55元/股，成交2.72亿元，换手率2.41%，总市值111.10 亿元。 资料显示，贵州振华风光半导体股份有限公司位于贵州省贵阳市高新区高纳路819号，成立日期2005年8 月31日，上市日期2022年8月26日，公司主营业务涉及专注于高可靠集成电路设计、封装、测试及销售, 主要产品包括信号链及电源管理器等系列产品。主营业务收入 ...

Core Insights - The total assets of state-owned enterprises in Shenyang have exceeded 427.3 billion yuan, marking a 51.5% increase since the beginning of the 14th Five-Year Plan, with operating income projected at 27.9 billion yuan in 2024, reflecting a 48.1% year-on-year growth [2] Group 1: Operational Efficiency and Growth - Shenyang's state-owned enterprises have significantly improved both scale and efficiency, with a focus on innovation and industrial upgrades [2][3] - The city has successfully completed the three-year action plan for state-owned enterprise reform, receiving high praise for its reform effectiveness, ranking first in Northeast China [1][2] Group 2: Industrial Transformation and Innovation - The aerospace industry cluster in Shenyang has surpassed 100 billion yuan, with collaborations on projects like cargo drones with central enterprises [3] - The establishment of a data asset registration center and the promotion of mixed-ownership reforms in the "space information big data" sector are notable achievements [3] Group 3: Structural Optimization and Resource Allocation - Shenyang has restructured its state-owned enterprise landscape, forming a system of 13 primary enterprises while reducing management layers by 334 [4] - The city has signed 96 central-local cooperation projects with a total investment of 361.88 billion yuan, enhancing the value of state assets by over 2.66 billion yuan [4] Group 4: Deepening Reforms and Enhancing Governance - The establishment of a dedicated external director system and a talent pool for enterprise management has been initiated, leading to cost savings of 360 million yuan [5] - A four-party supervision mechanism has been created to enhance oversight and improve operational efficiency [5] Group 5: Future Directions and Strategic Goals - The Shenyang government aims to stabilize economic operations, lead industrial development, and enhance urban quality, positioning itself as a regional benchmark for high-quality state-owned enterprise development [6]

Core Insights - The semiconductor industry is rapidly shifting towards packaging technology, with advanced packaging and bonding techniques identified as key breakthroughs to overcome critical challenges, serving as the next growth engine for the industry [1] - Technologies such as hybrid bonding and non-solder bonding are maturing, facilitating advancements in 3D packaging and heterogeneous integration towards higher density and reliability [1] - New materials like nano-silver sintering are being adopted to address traditional bonding materials' thermal expansion coefficient matching issues [1] - The demand from sectors like 5G, AI, and automotive electronics is increasing the requirements for chip heat dissipation efficiency and signal transmission speed, making advanced packaging a crucial pathway to enhance computing power cost-effectiveness amid the slowing of Moore's Law [1] - Domestic companies are entering high-end markets such as HBM and power semiconductors from the mid-to-low-end market, although they still rely on international suppliers like ASM Pacific for key equipment and materials [1] - The global advanced packaging market is expected to reach $65 billion by 2027, with hybrid bonding technology projected to grow the fastest, and advanced packaging is anticipated to surpass traditional packaging as the mainstream technology by 2026 [1] - The integrated circuit ETF (159546) tracks the integrated circuit index (932087), which selects listed companies involved in semiconductor design, wafer manufacturing, packaging testing, and related materials and equipment, effectively reflecting the overall performance of core enterprises in China's integrated circuit industry [1]

Group 1 - The core point of the article is that Dineike (300884.SZ) has invested in Fuzhou Jin'an San Chuang Equity Investment Partnership (Limited Partnership), which in turn holds a 0.24% stake in Muxi Integrated Circuit (Shanghai) Co., Ltd [1] - The investment partnership will manage its shares based on industry trends, actual investment project conditions, investment returns, and overall strategic planning [1] Group 2 - An investor inquired about the number of shares held by the company in Muxi Integrated Circuit Co., Ltd and whether the company plans to dispose of these shares after Muxi's IPO to increase revenue [3]

Core Viewpoint - The integrated circuit ETF (562820) opened with a decline of 2.89%, indicating a bearish trend in the sector [1] Group 1: ETF Performance - The integrated circuit ETF (562820) opened at 2.083 yuan [1] - Since its establishment on April 12, 2024, the fund has achieved a return of 114.57% [1] - The fund has experienced a return of -4.65% over the past month [1] Group 2: Major Holdings Performance - Major stocks within the ETF showed significant declines, including: - Cambrian (寒武纪) down 2.42% - SMIC (中芯国际) down 2.50% - Haiguang Information (海光信息) down 2.25% - Lattice Technology (澜起科技) down 2.66% - GigaDevice (兆易创新) down 5.07% - Haowei Group (豪威集团) down 1.31% - Chipone (芯原股份) down 4.01% - JCET (长电科技) down 1.44% - Unisoc (紫光国微) down 2.00% - Tongfu Microelectronics (通富微电) down 2.07% [1] Group 3: Management Information - The ETF is managed by Harvest Fund Management Co., Ltd. [1] - The fund manager is Tian Guangyuan [1] - The performance benchmark for the ETF is the CSI All-Share Integrated Circuit Index [1]

重要内容提示： ● 本次股票上市类型为股权激励股份；股票认购方式为网下，上市股数为1,456,540股。 本次股票上市流通总数为1,456,540股。 登录新浪财经APP 搜索【信披】查看更多考评等级 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 ● 本次股票上市流通日期为2025年11月26日。 根据中国证券监督管理委员会、上海证券交易所、中国证券登记结算有限责任公司上海分公司相关业务 规定，合肥晶合集成电路股份有限公司（以下简称"公司"）于近日收到中国证券登记结算有限责任公司 上海分公司出具的《证券变更登记证明》，公司完成了2023年限制性股票激励计划（以下简称"本激励 计划"）首次授予部分第一个归属期的股份登记工作。现将有关情况公告如下： 一、本激励计划已履行的决策程序和信息披露情况 （一）2023年8月14日，公司召开第一届董事会第十九次会议，审议通过了《关于公司〈2023年限制性 股票激励计划（草案）〉及其摘要的议案》《关于公司〈2023年限制性股票激励计划实施考核管理办 法〉的议案》《关于提请股东大会授权董事 ...