Core Insights - Amkor Technology reported a full-year revenue of $6.7 billion, reflecting a 6% increase, with strong growth across computing, automotive, consumer, and stabilized communications markets [1][4][6] - The company achieved record revenue in computing and expects continued growth in 2026, particularly in advanced packaging and computing sectors [4][5][16] Financial Performance - For the fourth quarter, Amkor reported revenue of $1.89 billion and EPS of $0.69, exceeding guidance, with a year-over-year increase of 16% despite a sequential decline of 5% [3][6] - Gross profit for the quarter was $315 million, with a gross margin of 16.7%, including a one-time benefit of approximately $30 million from asset sales [2][6] - Full-year gross profit was $939 million, with a gross margin of 14%, and net income totaled $374 million, resulting in an EPS of $1.50 [7] 2026 Guidance and Strategy - Amkor guided Q1 2026 revenue to be between $1.6 billion and $1.7 billion, indicating a 25% year-over-year growth at the midpoint, with expected lower seasonal margins [5][12] - The company plans capital expenditures of $2.5 billion to $3.0 billion for 2026, focusing on facility expansion and advanced packaging capacity [14][15] - Strategic priorities include enhancing technology leadership, expanding geographic footprint, and investing in advanced packaging platforms critical for AI and high-performance computing [9][10][11] Market Outlook - The company anticipates strong growth in computing, expected to exceed 20%, along with continued growth in advanced automotive, while other segments are projected to grow in single digits [16][19] - Amkor is optimistic about demand in communications, particularly related to iOS, and expects a solid performance in Android markets [18] - In the automotive sector, while overall unit sales are flat, the semiconductor content per vehicle is increasing due to the shift towards hybrid and electric vehicles [19] Operational Developments - The Vietnam facility reached break-even in Q4, and construction of the Arizona campus is underway, with a focus on expanding advanced packaging capacity [8][11][20] - The company is prioritizing high-density fan-out (HDFO) and other advanced packaging technologies, with new programs expected to launch in 2026 [10][11]

Amkor Technology (AMKR) reported $1.89 billion in revenue for the quarter ended December 2025, representing a year-over-year increase of 15.9%. EPS of $0.69 for the same period compares to $0.43 a year ago.The reported revenue compares to the Zacks Consensus Estimate of $1.83 billion, representing a surprise of +3.35%. The company delivered an EPS surprise of +60.47%, with the consensus EPS estimate being $0.43.While investors scrutinize revenue and earnings changes year-over-year and how they compare with ...

Amkor Technology, Inc. (NASDAQ:AMKR) will release earnings results for its fourth quarter, after the closing bell on Monday, Feb. 9.Analysts expect the Tempe, Arizona-based company to report quarterly earnings at 44 cents per share, up from 43 cents per share in the year-ago period. The consensus estimate for Amkor Technology's quarterly revenue is $1.84 billion, versus $1.63 billion a year earlier, according to data from Benzinga Pro.On Oct. 27, Amkor Tech posted better-than-expected earnings for the third ...

Core Viewpoint - The company, Tongfu Microelectronics, announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) packaging, with related products passing preliminary reliability tests by 2025 [1] Group 1 - The company is focusing on technological advancements in the CPO sector [1] - Initial reliability testing of the new products has been successfully completed [1] - Future developments will be guided by customer and market demand [1]

Financial Data and Key Metrics Changes - Consolidated net revenues for Q4 were NT$177.9 billion, a 6% sequential increase and a 10% year-over-year increase [15] - Fully diluted EPS for Q4 was $3.24, and basic EPS was $3.37 [14] - Gross profit was NT$34.7 billion, with a gross margin of 19.5%, improving by 2.4 percentage points sequentially and 3.1 percentage points year-over-year [15] - Operating profit for Q4 was NT$17.7 billion, up NT$4.5 billion sequentially and NT$6.5 billion year-over-year, with an operating margin of 9.9% [16] - For the full year 2025, consolidated net revenues improved by 8% compared to 2024, with net income increasing by 25% to NT$40.7 billion [20] Business Line Data and Key Metrics Changes - The ATM business grew by 20% in 2025, accounting for 60% of consolidated net revenue, up from 54% in 2024 [18] - The EMS business declined by 5% annually, with revenues flat sequentially at NT$69 billion in Q4 [28] - The testing business grew 36% year-on-year in 2025, supported by expanding turnkey and leading-edge test services [10] Market Data and Key Metrics Changes - The overall ATM utilization rate was around 80%, with higher loading in Taiwan factories [13] - The general segment is expected to grow at a similar pace as last year, driven by AI proliferation and recovery in automotive and industrial sectors [11] Company Strategy and Development Direction - The company is focusing on expanding its footprint outside Taiwan, particularly in Penang, Korea, and the Philippines, to capture customers and wafers not produced in Taiwan [9] - The strategy includes a "Taiwan Plus One" approach to support global manufacturing requirements [8] - The company aims to double its LEAP revenue to TWD 3.2 billion in 2026, with a strong focus on leading-edge solutions [11][37] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the semiconductor manufacturing leadership in Taiwan and the competitive advantages of the Taiwan cluster amid supply constraints [5][6] - The outlook for 2026 is optimistic, with expectations for continued revenue growth driven by leading-edge solutions and broad-based semiconductor demand [11][37] Other Important Information - Machinery CapEx for 2025 totaled TWD 3.4 billion, with significant investments in R&D and advanced capacity [10][33] - The company plans to remain aggressive in CapEx spending to support strong business prospects for 2026 and beyond [37] Q&A Session Summary Question: Can you provide a breakdown of LEAP business revenue? - Management indicated that LEAP revenue is expected to double to TWD 3.2 billion, with a significant portion coming from OS and wafer sort testing, and full process revenue expected to triple [41][42] Question: What is the outlook for the mainstream business? - The mainstream business is expected to grow at a similar pace as last year, with a friendly pricing environment and decent loading from IoT, automotive, and industrial sectors [51][52] Question: Is the EMS business being downsized? - Management clarified that the EMS business is not being downsized but is realigning to focus on AI and system-level optimization opportunities [96][97] Question: How much of the CapEx is going to full process packaging? - Management stated that about 10% of the LEAP revenue will come from full process packaging, with ongoing collaboration with foundry partners [111][112]

Core Viewpoint - The company is positioned as one of the few domestic packaging and testing enterprises with capabilities in HBM packaging and CPO silicon photonic packaging, highlighting its competitive edge in the AI computing packaging sector [1] Group 1: Technology and Innovation - The company has achieved significant breakthroughs in the field of optical-electrical co-packaging (CPO) by 2025, with related products passing initial reliability tests [1] - The self-developed thermal management technology addresses high-end computing power challenges, enhancing the company's technological advantage [1] Group 2: Market Position and Client Considerations - The technological advantages in CPO are becoming a core consideration for leading computing power clients in their collaboration decisions [1] - Future developments will be assessed based on customer and market demands, indicating a responsive approach to market needs [1]

格隆汇2月3日丨气派科技(688216.SH)近日接受特定对象调研时表示，受2020~2021年半导体行业爆发式 增长的影响，大量资本涌入，产能的无序扩张及行业去库存导致封测价格呈现大幅度下降；经过持续三 年多的去库存期，终端需求逐渐恢复增长，目前整体行业回暖，从2025年四季度开始订单逐步饱满。另 外随着AI、算力、存储等需求对先进封装产能要求较高，挤占了封测行业龙头的传统封装产能，行业 整体情况向好。从订单方面来看，公司目前来料订单创新高。 ...

格隆汇2月3日丨气派科技(688216.SH)近日接受特定对象调研时表示，2026年公司全力以赴提高公司规 模，一方面随着行业景气度回暖，以及目前原材料、设备等上下游的涨价趋势，公司将结合实际情况逐 步推动不同产品的价格调整；另一方面公司将根据本次行业周期的恢复调整公司产品结构、产能分配。 ...

1月26日，甬矽电子跌4.41%，成交额10.26亿元。两融数据显示，当日甬矽电子获融资买入额6527.25万 元，融资偿还1.25亿元，融资净买入-6010.24万元。截至1月26日，甬矽电子融资融券余额合计5.24亿 元。 截至9月30日，甬矽电子股东户数2.10万，较上期增加25.61%；人均流通股13336股，较上期减少 20.14%。2025年1月-9月，甬矽电子实现营业收入31.70亿元，同比增长24.23%；归母净利润6312.47万 元，同比增长48.87%。 分红方面，甬矽电子A股上市后累计派现4280.43万元。 融资方面，甬矽电子当日融资买入6527.25万元。当前融资余额5.21亿元，占流通市值的2.74%，融资余 额超过近一年80%分位水平，处于高位。 融券方面，甬矽电子1月26日融券偿还2407.00股，融券卖出3780.00股，按当日收盘价计算，卖出金额 17.53万元；融券余量7.16万股，融券余额332.10万元，超过近一年90%分位水平，处于高位。 资料显示，甬矽电子(宁波)股份有限公司位于浙江省余姚市中意宁波生态园兴舜路22号，成立日期2017 年11月13日，上市日期2 ...

证券代码：688352 证券简称：颀中科技 公告编号：2026-009 转债代码：118059 转债简称：颀中转债 合肥颀中科技股份有限公司 登录新浪财经APP 搜索【信披】查看更多考评等级 二、对公司的影响及应对措施 本次事故未造成人员伤亡，事故导致凸块制程段部分无尘室环境及生产设备受到影响，具体损失情况正 在核实评估，初步预计或将对2026年全年业绩产生一定影响。公司已对受损资产投保财产险，相关保险 核损理赔工作有序推进。苏州颀中因本次事故部分需后续处理的产品的生产进度，公司正统筹安排合肥 厂区产能提供支应，并加速凸块产能扩充，尽最大努力保障客户订单交付，同时全力加快多元化芯片封 测事业的布局与扩展。 截至本公告日，公司生产经营情况正常。公司将全力配合相关部门对事故进行调查，认真查明事故原 因，敦促下属子公司加强自身的安全管理，防止类似事故再次发生。 三、风险提示 公司指定信息披露媒体为《上海证券报》《中国证券报》《证券时报》《证券日报》《经济参考报》等 及上海证券交易所网站（www.sse.com.cn），公司发布的信息均以在上述指定媒体披露的信息为准。公 司将密切关注本次事故的具体影响，并及时按规定履 ...