Core Insights - The article discusses the upcoming "Collaborative Innovation Forum from Devices to Networks," scheduled for March 18, 2026, at the Shanghai New International Expo Center, focusing on the deep integration of the semiconductor and computing power industries [2] - The forum aims to address the challenges of the post-Moore era by promoting collaboration across the entire semiconductor value chain, emphasizing the importance of synergy between semiconductor technology and applications [12][14] Event Overview - The forum is a key event of the Munich Shanghai Optical Expo, co-hosted by Semiconductor Industry Observation and the expo itself, with a mission centered on "collaborative breakthroughs across the semiconductor value chain" [2][4] - It will feature 200 core industry professionals from various sectors, including operators, equipment manufacturers, and data center service providers, ensuring targeted and professional technical exchanges [4][5] Company Spotlight: Xizhi Technology - Xizhi Technology, a leading provider of optoelectronic hybrid computing power, will present its groundbreaking technology at the forum, showcasing its role in driving the upgrade of computing power [2][7] - The company has developed a unique optoelectronic hybrid computing architecture, achieving significant improvements in computing density and energy efficiency compared to traditional electronic computing [8] Technological Innovations - Xizhi Technology's optoelectronic hybrid architecture allows for massive parallel computing, with its core product, the Tian Shu (PACE 2) hybrid computing accelerator card, supporting a matrix size of 128×128 [8] - The company has introduced the first optical interconnect GPU supernode in China, which utilizes a distributed all-optical interconnect chip to overcome limitations in core devices and supply chains [9] Industry Impact - The forum aims to break down barriers between the semiconductor and computing power industries, addressing critical issues such as insufficient computing power, high energy consumption, and interconnect limitations [12] - By leveraging the global resource advantages of the Munich Shanghai Optical Expo, the forum will provide innovative references for local semiconductor companies and practical guidance for small and medium enterprises [16] Collaborative Opportunities - The event will create direct opportunities for technical cooperation and ecosystem building between Xizhi Technology and upstream and downstream enterprises [16] - The dual approach of offline targeted connections and online broad dissemination will enhance the impact of the forum, facilitating efficient channels for technology demonstration and business matching [5][16]

2026 年伊始，港交所的钟声为上海芯片企业接连敲响。1月8日，上海天数智芯半导体有限公司正式挂 牌港股。而在短短一个月内，壁仞科技登陆港交所成为"港股国产 GPU 第一股"，沐曦股份在科创板上 市首日涨幅近7倍，燧原科技完成IPO辅导冲刺科创板…… 加上此前上市的英矽智能，一个月内，上海 人工智能与集成电路企业密集叩开资本市场大门。 这不是幸运的偶然，而是一场基于硬核实力、爆发于优越生态的"上海现象"。壁仞、沐曦、天数、燧原 等芯片企业，连同在AI大模型、具身智能、AI制药等领域领跑的一批上海企业，共同勾勒出上海"芯"势 力的崛起图景。 创新能力：从"量产破局"到"全球领跑" 登陆资本市场的底气，源于实实在在的创新与交付能力。 天数智芯战略与公共关系部副总裁余雪松表示，上市是企业发展的新起点。作为国内首款量产通用 GPU 的缔造者，天数智芯的"天垓"系列产品已累计交付超5.2万片，服务290余家客户。其招股书以详实 的出货数据，传递出"量产即王道"的硬核逻辑。即将量产的"天垓 Gen3"瞄准更优性能的AI计算需求。 "这绝非初创公司凭一己之力所能实现。"曦智科技创始人沈亦晨坦言，上海政府部门有过两次关键相 ...

今天，"人均95后"的大模型公司MiniMax（稀宇科技）正式港股上市。 自去年12月17日起，沐曦股份、英矽智能、壁仞科技、天数智芯先后登陆科创板或港交所。短短一个月 内，五家上海AI产业链相关企业叩开资本市场大门。 ■上海目前拥有集成电路企业超过1200家，汇聚了全国约40%的集成电路产业人才、近50%的产业创新 资源 本报记者 李晔 查睿 ■上海拥有全球范围内首屈一指的营商环境。尤其是上海拿出算力底座场景，为各路GPU公司提供公开 公平的技术比武大平台，"这既能帮助创业者找到自身的短板和快速迭代补足的能力，又能提供最接近 市场的场景环境，更好地让产品说话" 另据证监会官网IPO辅导公示系统显示，燧原科技近期已完成上市辅导，将申报科创板。这意味 着，"上海GPU四小龙"（沐曦股份、壁仞科技、天数智芯、燧原科技）的上市版图合拢在即。此外，去 年A股涨幅榜冠军也来自上海——去年7月起，由智元机器人总裁彭志辉出任董事长的科创板上市企业 上纬新材，一改平淡低迷，股价全年涨幅高达1820%。 上海AI产业链相关企业近期密集引爆资本市场，是幸运之神意外眷顾，还是意料之中？ 绩优硬核 上月17日登陆科创板首日，沐曦股价 ...

壁仞科技是"国产GPU四小龙"中唯一选择港股"全流通"上市的企业。而在此之前，该公司曾于2024年9月在上海证监局办理科创板IPO辅导备案。 12月15日，证监会国际合作司披露了关于上海壁仞科技股份有限公司(以下简称"壁仞科技")境外发行上市及境内未上市股份"全流通"备案通知书。 根据备案通知书，壁仞科技拟发行不超过372458000股境外上市普通股并在香港联合交易所上市。该公司57名股东拟将所持合计873272024股境内未上市股 份转为境外上市股份，并在香港联合交易所上市流通。 市场端同样对壁仞科技给予高度关注。2025年胡润百富独角兽排行榜显示，其估值已达160亿元人民币。 基于BR100及其衍生产品(如BR104)，壁仞科技打造了壁砺系列商用硬件产品线，已量产落地。该系列包含液冷/风冷OAM模组、推理AI加速卡等，依托原 创的GPGPU芯片架构以及BIRENSUPA软件开发平台，支持业内主流的深度学习框架与模型，为广泛的AI计算场景提供高能效比、高通用性的强大算力。 研发方面，截至2025年9月30日，壁仞科技在全球多个国家和地区累计公开专利1200余项，位列中国通用GPU公司第一，获得专利授权550 ...

12月15日，证监会国际合作司披露了关于上海壁仞科技股份有限公司(以下简称"壁仞科技")境外发行上市及境内未上市股份"全 流通"备案通知书。 根据备案通知书，壁仞科技拟发行不超过372458000股境外上市普通股并在香港联合交易所上市。该公司57名股东拟将所持合计 873272024股境内未上市股份转为境外上市股份，并在香港联合交易所上市流通。 壁仞科技是"国产GPU四小龙"中唯一选择港股"全流通"上市的企业。而在此之前，该公司曾于2024年9月在上海证监局办理科创 板IPO辅导备案。以通用GPU为核心 壁仞科技由前商汤科技总裁张文于2019年创立。 在"国产GPU四小龙"中，壁仞科技与沐曦股份均选择了通用GPU(GPGPU)技术路线：壁仞更专注于高端云端大算力GPGPU，沐 曦布局了更全栈的通用计算与图形渲染融合产品。 2022年，壁仞科技发布其首款通用GPU芯片BR100。BR100采用7nm制程，创新性应用Chiplet与2.5D CoWoS封装技术，将两颗计 算核心封在一块硅Interposer上，其16位浮点算力达到1000T以上、8位定点算力达到2000T以上，在当时创造了全球算力纪录。 值得一提 ...

Core Viewpoint - China Mobile has awarded a procurement project for a super node testing device to Huawei, with a bid of 135 million yuan, indicating a significant investment in advanced computing infrastructure [1] Group 1: Huawei's Innovations - Huawei's "Scale-up super large-scale super node computing platform" was recognized as its top invention, showcasing a new architecture that allows for flexible resource allocation among AI processors [1] - The Ascend 384 super node features 384 Ascend NPUs and 192 Kunpeng CPUs, achieving a total computing power of 300 Pflops, which is 1.7 times that of NVIDIA's NVL72 [2] - The total network bandwidth of the Ascend 384 super node reaches 269 TB/s, surpassing NVIDIA's NVL72 by 107% [2] Group 2: Industry Trends - The demand for computing power in large models is rapidly increasing, while traditional computing architectures face challenges such as low resource utilization and frequent failures [4] - Super nodes are emerging as a new norm in AI infrastructure, with several domestic manufacturers exploring super node systems [4] - Inspiring innovations include the launch of the world's first single-cabinet 640-card super node by Sugon, which enhances computing density by 20 times compared to traditional solutions [4][5] Group 3: Future Developments - Huawei plans to launch the Atlas 950 super node in Q4 2026, featuring 8192 Ascend 950DT chips and achieving FP8 computing power of 8 EFLOPS [12] - The Atlas 950 super node is projected to be significantly more powerful than NVIDIA's upcoming NVL144, with a total computing power 6.7 times greater and memory capacity 15 times larger [14] - Future plans include the Atlas 950 SuperCluster, which will consist of 64 Atlas 950 super nodes, achieving a total FP8 computing power of 524 EFLOPS, surpassing the current largest cluster, xAI Colossus [14]

Core Insights - Intel and Nvidia have formed a historic partnership, with Nvidia investing $5 billion in Intel to co-develop customized data center and personal computing products, aiming to enhance large-scale computing capabilities [1][2] - This collaboration signifies a shift in the semiconductor industry, potentially leading to market differentiation, where competitors like AMD and ARM may face increased pressure [1][11] Group 1: Partnership Details - Nvidia will utilize its NVLink technology to integrate its AI and accelerated computing strengths with Intel's advanced CPU technology, providing cutting-edge solutions for clients [2][4] - Intel will customize x86 processors for Nvidia's AI infrastructure and launch a new x86 system-on-chip (SoC) that integrates Nvidia's RTX GPU for various PC products [2][4] Group 2: Market Reactions - Following the announcement, Intel's stock surged nearly 30%, closing with a 22.77% increase at $30.57 per share, while Nvidia's stock rose 3.49% to $176.24 per share [6][9] - The partnership has raised concerns for competitors AMD and ARM, with AMD's stock dropping over 5% initially, reflecting market apprehension about the new alliance [9][10] Group 3: Strategic Implications - Nvidia's investment is seen as a strategic move to solidify its position in the CPU market while mitigating risks from competitors like Microsoft and Amazon, which are developing their own chips [4][10] - The collaboration may also challenge TSMC if Nvidia shifts some of its chip manufacturing to Intel, although TSMC's market outlook remains stable for now [8][10] Group 4: Impact on Chinese Semiconductor Industry - The partnership could further entrench the U.S. dominance in high-end computing and data center chips, complicating competition for Chinese firms [11][12] - Chinese semiconductor companies are expected to accelerate their independent innovation efforts, particularly in the development of "super nodes" to enhance their competitive edge [11][13]

Core Viewpoint - Intel and Nvidia have formed a historic partnership, with Nvidia investing $5 billion in Intel to co-develop customized data center and personal computing products, marking a significant shift from competition to collaboration in the semiconductor industry [2][3][4]. Group 1: Partnership Details - Nvidia will utilize its NVLink technology to seamlessly integrate its AI and accelerated computing advantages with Intel's advanced CPU technology, aiming to provide cutting-edge solutions for customers [3]. - Intel will customize x86 processors for Nvidia's AI infrastructure and launch x86 system-on-chip (SoC) products that integrate Nvidia's RTX GPU chiplets for various PC applications [4]. - This partnership is seen as a strategic move for both companies, with Nvidia seeking to enhance its CPU market presence and Intel aiming to revitalize its position in the semiconductor industry [5][6]. Group 2: Market Impact - Following the announcement, Intel's stock surged nearly 30%, closing with a 22.77% increase, while Nvidia's stock rose by 3.49% [6]. - The collaboration is expected to create a new competitive landscape in the semiconductor market, particularly affecting AMD and ARM, which may face increased pressure due to the strengthened position of Intel and Nvidia [9][10]. - The partnership may also challenge TSMC's dominance if Nvidia shifts some of its chip manufacturing to Intel [9]. Group 3: Implications for Chinese Semiconductor Industry - The alliance between Nvidia and Intel could further consolidate the U.S. dominance in high-end computing and data center chips, complicating competition for Chinese manufacturers [11]. - Chinese companies are likely to accelerate their independent innovation efforts, focusing on developing "super nodes" as a key strategy to enhance their competitive edge [11][12]. - Domestic firms are exploring distributed architectures and interconnect innovations to create independent systems that do not rely on Nvidia's ecosystem, which is crucial for China's long-term technological independence [13].

Company Overview - Xizhi Technology recently completed a C-round financing exceeding 1.5 billion RMB, attracting investments from major institutions including China Mobile's fund, Shanghai Guotou, Guoxin Fund, and Pudong Venture Capital, with continued support from existing shareholders [1] - The company focuses on photonic networks and photonic computing, aiming to drive the commercialization of optoelectronic hybrid technology [2] Leadership and Innovation - The CEO and founder, Shen Yichen, is a MIT PhD graduate who has made significant contributions to the field, including a publication in "Science" during his doctoral studies [2] - Xizhi Technology has launched the world's first distributed optical interconnect GPU super node, LightSphere X, and the first domestic xPU-CPO optoelectronic co-packaged prototype system [2] Market Position and Growth - The global photonic chip market is projected to grow, with an estimated size of approximately 2.78 billion USD in 2023, reflecting a year-on-year increase of 14.4% [3] - Xizhi Technology is recognized as a unicorn in the optoelectronic hybrid computing sector, with plans to accelerate the development of next-generation computing cards that will fully support AI large models [3] Technological Advancements - The company has made strides in photonic computing, releasing the latest generation of optoelectronic hybrid computing cards, which integrate the largest 128×128 photonic matrix globally [3] - Xizhi Technology's advancements in photonic technology are positioned to enhance its competitive edge as domestic firms improve their technological capabilities and market recognition [3]

Group 1 - The core viewpoint of the news is that Xizhi Technology has successfully completed a C-round financing exceeding 1.5 billion yuan, indicating strong market confidence in its technology and commercialization prospects [2] - The financing round was participated by well-known investment institutions such as China Mobile, Shanghai Guotou, and Pudong Venture Capital, along with continued investment from existing shareholders [2] - Xizhi Technology is a leading unicorn in the field of optoelectronic hybrid computing, focusing on three core technologies: Optical Matrix Computing (oMAC), On-Chip Optical Networks (oNOC), and Inter-Chip Optical Networks (oNET) [2] Group 2 - In the field of optical networks, Xizhi Technology has successfully delivered multiple clusters with thousands of cards, focusing on Scale-Up solutions for intelligent computing centers [3] - The company launched the world's first distributed optical interconnect optical switching GPU supernode, LightSphere X, at the 2025 World Artificial Intelligence Conference, winning the highest honor, the "SAIL Award" [3] - Xizhi Technology is actively developing higher integration and larger bandwidth density CPO solutions to address bandwidth and latency bottlenecks in large-scale computing clusters [3] Group 3 - Xizhi Technology's optical hybrid computing card, released in March, integrates the world's largest 128×128 optical matrix, achieving practical application in complex commercial models [4] - The innovative optical hybrid computing architecture was published in the prestigious journal "Nature," marking a dual breakthrough in technology development and industry influence [4] - The company is accelerating the development of the next generation of optical hybrid computing cards to fully support the training and inference needs of AI large models [4] Group 4 - The rapid development of trillion-parameter large models has led to an explosive growth in global computing power demand, while traditional electronic chip performance is nearing physical limits [4] - Xizhi Technology addresses this bottleneck through two main paths: its optical interconnect solutions enhance multi-card collaboration efficiency and GPU utilization, while its optical hybrid computing reduces latency and total cost of ownership (TCO) [4] - The recent financing will be used to further expand technological advantages, accelerate product iteration, and enhance market applications, positioning China favorably in the global next-generation computing competition [4]