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筑巢引凤,上海AI“集团军”崛起全球赛道
Guo Ji Jin Rong Bao· 2026-01-09 07:48
1月9日,上海人工智能龙头企业、"北斗七星"之一MiniMax(稀宇科技)正式登陆港股资本市场,成为"全球从成立到IPO最快的AI公司"。 至此,岁末年初的一个月内,壁仞科技、沐曦股份、英矽智能、天数智芯、稀宇科技五家上海AI企业接连登陆港股或科创板,掀起一场覆盖算力芯 片、大模型、AI制药等多个赛道的上市热潮。在业界看来,这是上海以政策为引领,深耕人工智能产业生态的必然结果,标志着这座城市的AI产业正式进 入集中收获期。 政策精准滴灌:构建全周期创新保障体系 在企业成长的关键节点,上海的精准服务同样不可或缺。上市筹备阶段,市委金融办、监管和产业部门与上交所等机构紧密合作,通过专题座谈会、专 项辅导等形式,帮助企业更早了解资本市场规则,提早规划上市路径。"我们的上市节奏比较快,得到了市委金融办、监管和产业部门的有力指导和支 持。"乔卓真仪说。 对于融资遇困的企业,上海更是伸出援手。英矽智能首席执行官任峰介绍称,2024年下半年公司上市前融资受阻时,浦发集团、浦东创投集团果断投资 3000万美元,不仅助力其完成1.23亿美元融资,更引来更多投资机构跟进,为上市扫清了障碍。 人才作为AI产业的核心资源,得到上海的 ...
全靠硬核,上海“AI天团”成资本宠儿
Jie Fang Ri Bao· 2026-01-09 01:03
今天,"人均95后"的大模型公司MiniMax(稀宇科技)正式港股上市。 自去年12月17日起,沐曦股份、英矽智能、壁仞科技、天数智芯先后登陆科创板或港交所。短短一个月 内,五家上海AI产业链相关企业叩开资本市场大门。 ■上海目前拥有集成电路企业超过1200家,汇聚了全国约40%的集成电路产业人才、近50%的产业创新 资源 本报记者 李晔 查睿 ■上海拥有全球范围内首屈一指的营商环境。尤其是上海拿出算力底座场景,为各路GPU公司提供公开 公平的技术比武大平台,"这既能帮助创业者找到自身的短板和快速迭代补足的能力,又能提供最接近 市场的场景环境,更好地让产品说话" 另据证监会官网IPO辅导公示系统显示,燧原科技近期已完成上市辅导,将申报科创板。这意味 着,"上海GPU四小龙"(沐曦股份、壁仞科技、天数智芯、燧原科技)的上市版图合拢在即。此外,去 年A股涨幅榜冠军也来自上海——去年7月起,由智元机器人总裁彭志辉出任董事长的科创板上市企业 上纬新材,一改平淡低迷,股价全年涨幅高达1820%。 上海AI产业链相关企业近期密集引爆资本市场,是幸运之神意外眷顾,还是意料之中? 绩优硬核 上月17日登陆科创板首日,沐曦股价 ...
腾讯参投!光电混合算力独角兽曦智科技完成超15亿元C轮融资
Xin Lang Cai Jing· 2025-09-05 01:17
Company Overview - Xizhi Technology recently completed a C-round financing exceeding 1.5 billion RMB, attracting investments from major institutions including China Mobile's fund, Shanghai Guotou, Guoxin Fund, and Pudong Venture Capital, with continued support from existing shareholders [1] - The company focuses on photonic networks and photonic computing, aiming to drive the commercialization of optoelectronic hybrid technology [2] Leadership and Innovation - The CEO and founder, Shen Yichen, is a MIT PhD graduate who has made significant contributions to the field, including a publication in "Science" during his doctoral studies [2] - Xizhi Technology has launched the world's first distributed optical interconnect GPU super node, LightSphere X, and the first domestic xPU-CPO optoelectronic co-packaged prototype system [2] Market Position and Growth - The global photonic chip market is projected to grow, with an estimated size of approximately 2.78 billion USD in 2023, reflecting a year-on-year increase of 14.4% [3] - Xizhi Technology is recognized as a unicorn in the optoelectronic hybrid computing sector, with plans to accelerate the development of next-generation computing cards that will fully support AI large models [3] Technological Advancements - The company has made strides in photonic computing, releasing the latest generation of optoelectronic hybrid computing cards, which integrate the largest 128×128 photonic matrix globally [3] - Xizhi Technology's advancements in photonic technology are positioned to enhance its competitive edge as domestic firms improve their technological capabilities and market recognition [3]
曦智科技宣布完成超15亿元C轮融资,中国移动和国新基金等参与
Zheng Quan Shi Bao Wang· 2025-09-04 10:25
Company Overview - XiZhi Technology, a provider of optical-electrical hybrid computing power, has completed a C-round financing exceeding 1.5 billion RMB, attracting investments from China Mobile, Shanghai Guotou, and others [1] - The company aims to push the commercialization of large-scale optical integration technology, expecting photon chips to account for 30% of the computing power in intelligent computing centers within the next five years [1] Business Focus - The company focuses on two main business directions: photonic networks and photonic computing, with a vision to "break the boundaries of computing power through optical-electrical integration" [1] - XiZhi Technology has established strategic partnerships with leading domestic optical/electrical wafer manufacturers, packaging factories, and system vendors, facilitating breakthroughs in key areas such as supernode construction and CPO [1] Product Development - In the photonic network sector, the company has launched the world's first distributed optical interconnect GPU supernode, LightSphere X, and received the SAIL Award at the 2025 WAIC [2] - The company has also introduced the first domestic xPU-CPO optical-electrical co-packaged prototype system and is developing higher integration and bandwidth density CPO solutions [2] Industry Context - The demand for computing power is surging due to the development of trillion-level large models, while the performance of electrical chips is nearing physical limits, leading to a growing computing power gap [3] - XiZhi Technology's optical interconnect solutions can build high-bandwidth, low-latency large-scale computing clusters, significantly improving GPU utilization [3] - The optical-electrical hybrid computing architecture offers advantages in enhancing computing density and energy efficiency while reducing latency and overall costs [3]
超15亿!上海芯片独角兽获新一轮融资,中移动参投
是说芯语· 2025-09-04 07:27
Core Viewpoint - The commercialization of photonic networks and photonic computing is reaching a critical turning point, with significant advancements in technology and funding opportunities for companies in this sector [1]. Group 1: Company Overview - Xizhi Technology, a leading player in the photonic computing sector, has completed over 1.5 billion CNY in Series C financing, with participation from major investors including China Mobile and Shanghai Guotou [2]. - The company is the only domestic unicorn focused on photonic mixed computing and is accelerating the development of the next-generation photonic mixed computing card to support AI large models [2][3]. Group 2: Technological Advancements - The company has developed a high-bandwidth, low-latency optical interconnect solution that significantly enhances GPU utilization and demonstrates advantages in computing density, energy efficiency, and cost reduction [3]. - Xizhi Technology launched the world's first distributed optical interconnect GPU supernode, LightSphere X, during the 2025 WAIC, winning the highest award, the SAIL Award [3][5]. Group 3: Research and Development - The latest generation of photonic mixed computing cards, Xizhi Tian Shu, features a 128×128 photonic matrix, marking the first application of photonic mixed computing in complex commercial models [5]. - The company has established strategic partnerships with leading domestic photonic/electronic wafer manufacturers and system vendors, facilitating breakthroughs in key areas such as supernode construction and CPO [5].
曦智科技完成超15亿元C轮融资,中国移动旗下基金等参投
2 1 Shi Ji Jing Ji Bao Dao· 2025-09-04 06:33
Core Viewpoint - Shanghai Xizhi Technology Co., Ltd. has completed a C round financing exceeding 1.5 billion RMB, aimed at accelerating the development of core technologies and the large-scale implementation of photonic hybrid computing power [1][9] Company Overview - Founded in February 2018, Xizhi Technology has a team of nearly 250 people, with over 80% being R&D personnel, primarily from MIT and other industry experts [2] - The company focuses on photonic networks and photonic computing, transitioning photonic hybrid technology from R&D to industrial application [2] Financing History - Xizhi Technology raised $10.7 million in seed funding in 2018, with investors including Baidu Ventures and ZhenFund [3] - In April 2020, the company completed a $26 million Series A financing led by Matrix Partners China and CICC Capital [3] - The company also completed a Series A+ financing in July 2020, with investments from HeLi Capital [4] - The B round financing details remain undisclosed, but it was reported that Shanghai International Group led the round, with subsequent investments from Tencent and Sequoia Capital [4] Technological Advancements - Xizhi Technology has made significant breakthroughs in key areas such as supernode construction and CPO (Co-Packaged Optics), with multiple technology and commercialization advancements announced recently [5] - The company launched the world's first distributed optical interconnect GPU supernode, LightSphere X, at the 2025 World Artificial Intelligence Conference, which won the highest award, the SAIL Award [5] - The LightSphere X aims to expand Scale-Up networks, introducing advanced optical interconnect technology to overcome physical limitations of traditional interconnect methods, significantly enhancing GPU utilization [5] Market Position and Strategy - With the increasing demand for computing power driven by large model parameters, Xizhi Technology is strategically positioning itself in the supernode market, recognizing it as a significant opportunity [6][7] - The company has completed multiple thousand-card clusters and aims to deploy ten-thousand-card clusters within the year [7] - Xizhi Technology is accelerating the development of the next generation of photonic hybrid computing cards to fully support AI large models while deepening commercial applications and ecosystem development [8]
光计算芯片,Roadster时刻
半导体芯闻· 2025-04-08 10:33
Core Viewpoint - The article draws a parallel between Tesla's Roadster and the current state of the chip industry, suggesting that the introduction of "optical-electrical hybrid computing" marks a new era in computing, similar to how the Roadster initiated the electric vehicle revolution [1][6]. Group 1: Industry Challenges - The traditional chip industry is facing limitations due to the failure of Moore's Law, which has been a guiding principle for over 60 years, with performance improvements slowing down significantly [3][4]. - The demand for computing power has surged, particularly driven by advancements in artificial intelligence, leading to a doubling of computational needs every 4-6 months [3][4]. - Current innovations, such as near-storage computing and non-GPU architectures, address bandwidth and transistor utilization issues but do not fundamentally resolve the limitations of transistor density and absolute computing power [4][5]. Group 2: New Paradigm Introduction - The company proposes a new paradigm called "optical-electrical hybrid computing," which aims to overcome the limitations of traditional transistors by utilizing optical components [5][6]. - The introduction of the "Tianshu" system represents a significant advancement, integrating optical chips with electrical chips in a novel 3D stacked architecture to enhance computational capabilities [7][9]. Group 3: Technical Innovations - The optical chip in the Tianshu system employs Optical Multiply Accumulate (oMAC) technology for integer operations, significantly improving computational power without additional energy consumption [8][10]. - The electrical chip is a custom ASIC designed for floating-point operations, and the integration of over 40,000 optical devices allows for high bandwidth and low latency in processing complex algorithms [9][10]. Group 4: Software and Ecosystem Development - The company has developed a software framework to support popular programming languages like PyTorch, facilitating the integration of complex algorithms into the Tianshu system [12][13]. - A performance index called Equivalent Optical Processing Power (EOPP) has been introduced, which combines peak processing power, output precision, and weight refresh rates to provide a more comprehensive measure of performance [14]. Group 5: Future Prospects - The company is exploring further applications of its technology in various fields, including EDA systems, quantitative trading, and security recognition, with plans to expand into more scenarios [14][15]. - Innovations in optical interconnect technologies, such as Optical Network on Chip (oNOC) and Optical inter-chip Networking (oNET), are being developed to enhance data transmission efficiency and flexibility in chip architectures [15][16].
【电子】名企持续加入机器人产业,新凯来发布半导体设备新品——光大证券科技行业跟踪报告之七(刘凯/于文龙/白玥)
光大证券研究· 2025-04-03 08:47
Group 1: AI Developments - The DeepSeek V3 model has completed a minor version upgrade, showing improvements across various capabilities [3] - Tencent has officially launched its self-developed deep thinking model, the mixed Yuan T1, enhancing reasoning abilities [3] - Google's new model, Gemini 2.5 Pro, has achieved state-of-the-art (SOTA) performance in multiple benchmark tests and topped the Arena leaderboard [3] - OpenAI has released the native multimodal image generation feature of GPT-4o, enabling the generation of more realistic images [3] Group 2: Semiconductor Industry - New Kai Lai showcased around 30 devices at the 2025 Semicon China exhibition, covering four major categories: diffusion, etching, thin films, and measurement [5] - The U.S. Department of Commerce announced the addition of 54 Chinese entities to the export control entity list, with 12 listings effective from March 25, 2025, and the remaining 42 expected to take effect from March 28, 2025 [5] Group 3: Robotics Industry - Vivo announced the establishment of "vivo Robot Lab" to enter the home robotics sector during the Boao Asia Forum 2025 [6] - Yijiahe has strategically upgraded, leading to the formal establishment of Lindo Technology [6] - Zhiyuan held its first supplier conference, collaborating with over a hundred partners to layout the robotics market [6] - Wolong Electric Drive has invested in Zhiyuan Robotics to jointly promote the development of embodied robots [6] - Figure Robotics released a new video showcasing its transition from "stumbling" to "steady," unlocking new natural walking skills [6] Group 4: New Product Launches - Xizhi Technology launched the new generation of optical hybrid computing card "Xizhi Tian Shu," which integrates the advantages of optical and electronic chips and employs advanced 3D packaging technology, showing significant performance improvements over previous models [4]
光大证券科技行业跟踪报告之七:名企持续加入机器人产业 新凯来发布半导体设备新品
Xin Lang Cai Jing· 2025-04-03 00:28
AI Industry Developments - DeepSeek V3 model has completed a minor version upgrade, showing improvements across various capabilities [1] - Tencent has officially launched its self-developed deep thinking model, MixT1, with enhanced reasoning abilities [1] - Google's new model, Gemini 2.5 Pro, has achieved state-of-the-art (SOTA) levels in multiple benchmark tests and topped the Arena leaderboard [1] Semiconductor Sector Updates - OpenAI has released GPT-4o with native multimodal image generation capabilities, allowing for more realistic image creation [2] - Xizhi Technology has globally launched a new generation of optoelectronic hybrid computing card, "Xizhi Tian Shu," which integrates optical and electronic chip advantages and employs advanced 3D packaging technology, showing significant performance improvements over previous models [2] - New products from New Kai Lai were showcased at SemiconChina 2025, covering approximately 30 types of equipment across four categories: diffusion, etching, thin film, and measurement [2] - The U.S. Department of Commerce has added 54 Chinese entities to its export control list, with 12 listings effective from March 25, 2025, and the remaining 42 expected to take effect on March 28, 2025 [2] Robotics Industry Trends - VIVO announced the establishment of "vivo Robot Lab" to enter the home robotics sector during the Boao Asia Forum 2025 [3] - Yijiahe has strategically upgraded, leading to the establishment of Lindo Technology [3] - Zhiyuan held its first supplier conference, collaborating with over a hundred partners to expand in the robotics market [3] - Wolong Electric Drive has invested in Zhiyuan Robotics to advance embodied robotics development [3] - Figure Robotics released a new video showcasing its progress from "stumbling" to "steady" walking capabilities [3] Investment Recommendations - The emergence of DeepSeek is expected to catalyze the accelerated iteration of global large models, with AI application scenarios such as edge computing, intelligent driving, and robotics likely to experience higher growth rates [3] - Continued optimism for investment opportunities in the technology sector, particularly in domestic computing infrastructure [3] - Recommendations for the electronic communication sector include focusing on domestic AI computing companies such as Cambrian, Haiguang Information, and others [3] - In the computer industry, attention is drawn to companies like Kingsoft Office and Foxit Software due to the increasing value of high-frequency interaction entry points [4] - The robotics industry suggests monitoring various segments, including connectors, main bodies, PCB, equipment, dexterous hands, 3D vision, motors, scene robots, operating systems, and sensors [4]