Core Viewpoint - Jinpan Technology (688676.SH) plans to issue convertible bonds to raise funds for various projects, including smart manufacturing and working capital, with a total amount not exceeding 1.6715 billion yuan [1][2]. Group 1: Convertible Bond Issuance - The convertible bonds will be issued at a face value of 100 yuan each, with a term of 6 years from the issuance date [1]. - The total amount to be raised from the issuance is capped at 1.6715 billion yuan, which will be allocated to specific projects and working capital [2][4]. - The initial conversion price will be determined based on the average stock price over the 20 trading days prior to the announcement [1][2]. Group 2: Fund Allocation - The funds will be used for several projects, including: - Data center power modules and energy-efficient power equipment manufacturing, with a total investment of approximately 523.42 million yuan, of which 473.37 million yuan will be funded by the raised capital [3][4]. - High-efficiency liquid-immersed transformers and amorphous alloy core manufacturing, with a total investment of about 734.22 million yuan, with 616.53 million yuan from the raised funds [4]. - R&D office building construction in Tongxiang, with an investment of 82.97 million yuan, funded entirely by the raised capital [4]. - Supplementing working capital with 501.40 million yuan [4]. Group 3: Previous Fundraising and Financial Performance - Jinpan Technology has previously raised funds through convertible bonds, totaling approximately 976.70 million yuan in a prior issuance [5]. - The company reported a revenue of 1.343 billion yuan for the first quarter of 2025, reflecting a year-on-year increase of 2.90%, and a net profit attributable to shareholders of 107.24 million yuan, up 13.32% [7][8]. - The net cash flow from operating activities for the same period was 135 million yuan [8].