Core Viewpoint - Hangzhou Lian Microelectronics Co., Ltd. announced the interest payment details for its convertible bonds, which will begin on November 14, 2025, covering the period from November 14, 2024, to November 13, 2025 [2][11]. Summary by Sections Convertible Bond Issuance Overview - The company issued convertible bonds on November 14, 2022, with a total issuance scale of 3.39 billion yuan (339 million) [2]. - The bonds have a face value of 100 yuan each and will be valid for six years, maturing on November 13, 2028 [2][3]. Interest Rate and Payment Details - The interest rates for the bonds are structured as follows: 0.3% for the first year, 0.5% for the second year, 1.0% for the third year, 1.5% for the fourth year, 1.8% for the fifth year, and 2.0% for the sixth year [3]. - The interest payment method is annual, with the first payment scheduled for November 14, 2025, amounting to 1.00 yuan per bond (including tax) for the third year [11][12]. Important Dates - The bondholders' registration date for interest payment is November 13, 2025, with the interest payment and ex-dividend date both set for November 14, 2025 [5][12]. Tax Implications - Individual investors are subject to a 20% personal income tax on the interest income, resulting in a net payment of 0.80 yuan per bond after tax [15]. - Non-resident enterprises are exempt from corporate income tax on interest income until December 31, 2025 [16]. Contact Information - The issuer is Hangzhou Lian Microelectronics Co., Ltd., with contact details provided for the legal department and the underwriter, Dongfang Securities Co., Ltd. [17].

Group 1 - The chairman of Diou Home has announced plans to increase his stake in the company after the stock price rose from around 3 to over 6 [1] - Shareholders of Fumiao Technology plan to transfer 5% of their shares to Shanghai Gengrui and have signed a strategic cooperation agreement with Xinhu Maofang [2] - Red Wall Co.'s controlling shareholder intends to reduce their stake by no more than 3% [2] - ST Shengxun's shareholders plan to collectively reduce their stake by no more than 5.08% [2] - Li Bo Convertible Bond will be listed on July 22, and there will be no adjustment to the Lian Ang Convertible Bond [2]

Group 1 - The company, Hangzhou Lion Microelectronics Co., Ltd, has issued convertible bonds totaling 339 million RMB, with 3.39 million bonds at a face value of 100 RMB each [3][4][15] - The bonds have a maturity period of up to 6 years, with an interest rate that increases from 0.3% in the first year to 2.0% in the sixth year [4][6] - The initial conversion price for the bonds is set at 45.38 RMB per share, subject to adjustments based on various corporate actions [6][8] Group 2 - The company reported a significant decline in net profit for 2024, with a loss of 26.58 million RMB, a decrease of 504.18% compared to the previous year [18] - The total revenue for 2024 was 309.23 million RMB, reflecting a 14.97% increase from 2023 [18] - The company's total assets increased by 5.73% year-on-year, reaching 1.93 billion RMB by the end of 2024 [18] Group 3 - The company is engaged in the semiconductor industry, focusing on the research, production, and sales of semiconductor silicon wafers and power device chips [18] - The main applications of the company's products include 5G communication, automotive electronics, and artificial intelligence [18] - The company has faced challenges in project timelines due to external economic conditions, leading to delays in the construction of certain projects [21][22]