证券研究报告：机械设备|深度报告 行业投资评级 强于大市 |维持 行业基本情况 | 收盘点位 | | 2116.63 | | --- | --- | --- | | 52 | 周最高 | 2116.63 | | 52 | 周最低 | 1420.7 | 行业相对指数表现（相对值） 2024-12 2025-03 2025-05 2025-07 2025-10 2025-12 -10% -5% 0% 5% 10% 15% 20% 25% 30% 35% 机械设备 沪深300 资料来源：聚源，中邮证券研究所 研究所 分析师:刘卓 SAC 登记编号:S1340522110001 Email:liuzhuo@cnpsec.com 分析师:陈基赟 SAC 登记编号:S1340524070003 Email:chenjiyun@cnpsec.com 分析师:虞洁攀 SAC 登记编号:S1340523050002 Email:yujiepan@cnpsec.com 近期研究报告 高功率电子器件热管理问题愈发严峻，散热会明显影响电子器件 性能、寿命、安全性。近年来，随着电子器件遵循着摩尔定律逐步向 集成化、高热流密度和微小型化 ...

Core Viewpoint - The article emphasizes the critical role of material innovation in driving the next generation of AI computing power, highlighting the shift from traditional silicon-based materials to advanced materials that can meet the increasing demands of AI applications [2][53]. Group 1: Key Materials for AI Computing - Advanced channel materials are essential for semiconductor transistors, directly influencing speed, power consumption, and integration [4]. - AI chips require channel materials with high mobility, high switching ratio, high stability, low power consumption, low leakage current, and ultra-thin thickness [6]. - Various materials such as MoS₂, black phosphorus, InGaAs, germanium, and carbon nanotubes are identified as promising candidates for next-generation AI chips, each with specific performance metrics [7][10][11][12][14]. Group 2: Gate and Dielectric Materials - Gate and dielectric materials are crucial for controlling the flow of current in transistors, affecting switching speed, power consumption, and reliability [17]. - Hafnium oxide (HfO₂) and its doped variants are highlighted for their low leakage currents and high dielectric constants, suitable for advanced logic chips [18][20][21]. Group 3: Substrate Materials - Substrate materials provide physical support and thermal management for semiconductor chips, impacting performance and reliability [23]. - Silicon carbide (SiC) and gallium oxide (β-Ga₂O₃) are noted for their high breakdown fields and thermal conductivity, making them suitable for AI power modules [24][25]. Group 4: Non-volatile Storage Materials - Phase change materials and resistive switching materials are identified for their potential in next-generation memory applications, offering high speed and low power consumption [26][27]. Group 5: Advanced Packaging and Integration Materials - Materials for substrate and interconnects, such as silicon photonic intermediates and glass substrates, are crucial for enhancing signal transmission speed and reducing power loss [29][30]. - Diamond-based thermal management materials are highlighted for their superior heat dissipation capabilities, essential for high-performance AI chips [32]. Group 6: New Computing Paradigms - Photonic computing materials, such as lithium niobate and silicon-based photonic materials, are discussed for their potential to significantly increase processing speed while reducing energy consumption [35][36]. - Quantum computing materials, including superconductors and diamond nitrogen-vacancy centers, are essential for developing quantum computing hardware [38][39]. Group 7: Investment Logic - The investment opportunity lies in material innovation that can replace traditional silicon technologies, aligning with national strategies for semiconductor supply chain security [53]. - Focus areas for investment include advanced logic and storage materials, packaging and thermal management materials, and frontier materials for emerging computing paradigms [54]. Group 8: Conclusion - The article presents a comprehensive overview of the material innovations driving the AI computing revolution, emphasizing the importance of these advancements for China's semiconductor industry and global competitiveness [56].

Core Insights - The semiconductor industry is facing significant thermal management challenges as chip sizes shrink and power levels increase, leading to the urgent need for effective heat dissipation solutions [1][2] Group 1: Semiconductor Industry Challenges - The transition towards advanced semiconductor processes (2nm, 1nm, and even sub-nanometer levels) is resulting in increased power density and heat generation, creating "hotspot" issues that can degrade performance and reliability [1] - Ineffective heat dissipation can lead to localized overheating, resulting in performance degradation, hardware damage, and increased costs [1] Group 2: Diamond as a Thermal Management Solution - Diamond is identified as an ideal thermal management material due to its exceptional thermal conductivity of 2000 W/m·K, which is significantly higher than traditional materials like copper and aluminum [2] - The applications of diamond in thermal management include diamond substrates, heat sinks, and diamond structures with microchannels, which cater to the cooling needs of semiconductor devices and server GPUs [2] Group 3: Advantages of Diamond as a Semiconductor Substrate - Diamond offers the highest thermal conductivity among known materials, making it effective for heat dissipation in high power density devices [3] - With a bandgap of approximately 5.5 eV, diamond can operate stably in high-temperature and high-voltage environments, making it suitable for high-power electronic devices [3] - Diamond's electrical current carrying capacity far exceeds that of traditional semiconductor materials, allowing it to accommodate high current applications [3] - The mechanical strength and wear resistance of diamond enhance the reliability and lifespan of devices under harsh operating conditions [3] - Diamond's radiation resistance makes it suitable for use in high-radiation environments such as space and nuclear applications [3]

Market Overview - On May 27, the cultivated diamond sector opened strong, with Huanghe Xuanfeng hitting the daily limit up, and companies like Huifeng Diamond, Sifangda, and Liliang Diamond also experiencing significant gains [1] Company Developments - **ST Yazhen (603389.SS)**: Holds a 30% stake in Yazhen Diamond, which specializes in CVD large-size diamond manufacturing and sales, contributing to about 20% of the cultivated diamond sales market, with high-end quality diamonds accounting for over 50% [3] - **Huanghe Xuanfeng (600172.SS)**: Plans to increase its stake, leveraging 20 years of technical experience in cultivated diamonds, with a focus on R&D, production, and quality management [3] - **Sifangda (300179.SZ)**: Its subsidiary Tianxuan Semiconductor is involved in CVD technology R&D and has signed a 700 million yuan investment agreement to establish a production line for 700,000 carats of functional diamonds annually [3] - **Liliang Diamond (301071.SZ)**: A leading domestic producer of cultivated diamonds, currently producing high-grade diamonds in the range of 2-10 carats, with research indicating potential for 25-carat diamonds [4] Industry Events - On May 27, Huanghe Xuanfeng announced a joint venture with Bozhi Jinduan to develop diamond-based thermal materials for the semiconductor packaging sector [5] - Liliang Diamond is focusing on high-power heat sink projects, anticipating broad applications for diamonds in semiconductor cooling [5] - A $27 million agreement was signed between Akash and NxtGen for deploying diamond cooling servers in India [5] - Huawei and Nvidia are both exploring diamond cooling technologies, with Huawei filing a patent related to semiconductor devices involving diamond cooling [5] Industry Insights - Diamonds possess the highest known thermal conductivity, being 13 times that of silicon and 4-5 times that of copper and silver, making them a promising material for the semiconductor industry [6] - The diamond cooling technology can enhance GPU and CPU performance by three times, reduce temperatures by 60%, and lower energy consumption by 40%, potentially saving millions in cooling costs for data centers [6] - The diamond cooling market is projected to grow from $0.5 million in 2025 to $15.2 billion by 2030, with a compound annual growth rate of 214% [6] - In quantum computing, nitrogen-vacancy centers in diamonds are seen as a core material due to their ability to maintain quantum states at room temperature [6] - CVD-produced polycrystalline diamond heat sinks have a diameter of up to 2 inches and a thickness of 0.3 to 1 mm, offering superior thermal conductivity compared to traditional materials [6]