金刚石作为半导体衬底材料优势显著 1)高热导率：金刚石在目前已知材料中热导率最高，能在高功率密度设备中有效散热。2)高带隙：金刚 石的带隙约为5.5eV，能够在高温、高电压环境中稳定工作，特别适用于高温/高功率电子设备。3)极高 的电流承载能力：金刚石的电流承载能力远超传统半导体材料，能适应高电流应用。4)优异的机械强 度：金刚石的硬度和抗磨损性使其在苛刻的工作条件下能够保持稳定性能，增加器件的可靠性和寿命。 5)抗辐射性：金刚石的抗辐射性使其适合用于空间、核能等高辐射环境中。 风险提示：AI发展不及预期;新产品市场开拓风险;宏观经济波动风险;政策与标准变化。 随着半导体产业遵循着摩尔定律逐步向2纳米、1纳米甚至是埃米级别迈进，尺寸不断缩小，功率不断增 大，带来了前所未有的热管理挑战。芯片在运行过程中会产生大量热量，若散热不及时芯片温度将急剧 上升，进而影响其性能和可靠性。芯片内部热量无法有效散发时，局部区域会形成"热点"，导致性能下 降、硬件损坏及成本激增。 金刚石是良好的散热材料 传统金属散热材料(如铜、铝)虽然导热性能较好，但其热膨胀系数与高导热、轻量化要求难以兼顾。金 刚石作为一种散热材料，它的热导率 ...

Market Overview - On May 27, the cultivated diamond sector opened strong, with Huanghe Xuanfeng hitting the daily limit up, and companies like Huifeng Diamond, Sifangda, and Liliang Diamond also experiencing significant gains [1] Company Developments - **ST Yazhen (603389.SS)**: Holds a 30% stake in Yazhen Diamond, which specializes in CVD large-size diamond manufacturing and sales, contributing to about 20% of the cultivated diamond sales market, with high-end quality diamonds accounting for over 50% [3] - **Huanghe Xuanfeng (600172.SS)**: Plans to increase its stake, leveraging 20 years of technical experience in cultivated diamonds, with a focus on R&D, production, and quality management [3] - **Sifangda (300179.SZ)**: Its subsidiary Tianxuan Semiconductor is involved in CVD technology R&D and has signed a 700 million yuan investment agreement to establish a production line for 700,000 carats of functional diamonds annually [3] - **Liliang Diamond (301071.SZ)**: A leading domestic producer of cultivated diamonds, currently producing high-grade diamonds in the range of 2-10 carats, with research indicating potential for 25-carat diamonds [4] Industry Events - On May 27, Huanghe Xuanfeng announced a joint venture with Bozhi Jinduan to develop diamond-based thermal materials for the semiconductor packaging sector [5] - Liliang Diamond is focusing on high-power heat sink projects, anticipating broad applications for diamonds in semiconductor cooling [5] - A $27 million agreement was signed between Akash and NxtGen for deploying diamond cooling servers in India [5] - Huawei and Nvidia are both exploring diamond cooling technologies, with Huawei filing a patent related to semiconductor devices involving diamond cooling [5] Industry Insights - Diamonds possess the highest known thermal conductivity, being 13 times that of silicon and 4-5 times that of copper and silver, making them a promising material for the semiconductor industry [6] - The diamond cooling technology can enhance GPU and CPU performance by three times, reduce temperatures by 60%, and lower energy consumption by 40%, potentially saving millions in cooling costs for data centers [6] - The diamond cooling market is projected to grow from $0.5 million in 2025 to $15.2 billion by 2030, with a compound annual growth rate of 214% [6] - In quantum computing, nitrogen-vacancy centers in diamonds are seen as a core material due to their ability to maintain quantum states at room temperature [6] - CVD-produced polycrystalline diamond heat sinks have a diameter of up to 2 inches and a thickness of 0.3 to 1 mm, offering superior thermal conductivity compared to traditional materials [6]