金刚石材料：性能优异的芯片散热材料 高性能高集成芯片散热问题亟待解决 AI芯片散热技术通过直接在芯片或处理器表面移除热量来优化设备性能并延长使用寿命，主要分为散 热材料及散热技术两类。在散热材料方面，目前主要以热界面材料（TIM）、金属和陶瓷基导热材料为 主。在散热技术方面，主要包含风冷、液冷、热管、VC均热板及散热器等多种方案。 电子封装材料需具备良好的导热性能 电子封装起到保护芯片和快速散热作用，因此电子封装材料需具备良好的导热性能、力学性能及可加工 性能等各项物理性能，保证电子设备的稳定、可靠及安全运行。 电子封装的主要是为了给电子器件提供稳定的工作环境，同时起到保护芯片和快速散热的作用。电子封 装结构如示意图，图中芯片通过金锡焊料与导热基板连接，导热基板再通过铅锡焊料与壳体相连，将热 量传递到壳体。最后通过导热硅脂将热量传递到热沉材料，以风冷或水冷的方式将热量带出。因此电子 封装材料需具备良好的导热性能、力学性能和可加工性能等各项物理性能，保证电子设备的稳定、可靠 和安全的运行。 在芯片集成度提升及尺寸微缩发展态势下，芯片功能及性能进一步提升强化，但芯片功耗及发热量提 升，随服役温度上升半导体元件失效 ...

Core Insights - The article discusses the development of a novel thermal interface material (TIM) that meets the stringent cooling requirements of AI chips, achieving a total thermal resistance of 1.8 mm²K/W, which is significantly lower than traditional materials [1][2][10] - The research highlights the effectiveness of a two-step ultrasonic-polishing treatment that enhances the thermal performance of graphite-silicone composite materials, making them comparable to liquid metal in terms of heat dissipation [2][3][10] Group 1: Thermal Resistance and Performance - The newly developed TIM exhibits an ultra-low thermal resistance of 1.8 mm²K/W at 50 psi, which is the lowest reported for solid-state thermal pads, second only to liquid metal [2][3] - The thermal conductivity of the material is measured at 460 W/mK, with a high compression strain of 45% under 50 psi pressure, demonstrating excellent thermal cycling stability [2][3] - The performance of the TIM in actual gaming laptop cooling tests is comparable to that of liquid metal, maintaining CPU temperatures around 86 °C [3][8] Group 2: Manufacturing Process and Advantages - The ultrasonic treatment creates micro and nano-scale defects in the graphite sheets, optimizing the contact between the TIM and the surfaces it interfaces with, thus enhancing heat dissipation [6][10] - The polishing process further reduces surface roughness from 34.5 μm to 11.1 μm, improving the overall thermal contact performance [6][10] - The manufacturing technique is noted for its simplicity, efficiency, low cost, and potential for industrialization, making it a viable option for mass production [2][3]

Core Insights - The transition to liquid cooling in data centers is becoming essential due to the rising power consumption of AI chips, marking a significant structural shift in the industry [1][2][4] - The global market for direct liquid cooling (DLC) is projected to grow from $1.138 billion in 2024 to $31.191 billion by 2030, with a compound annual growth rate (CAGR) of 51% [14][16] - The shift towards liquid cooling is driven by the need to meet stringent energy efficiency standards and the increasing power density of server cabinets [7][10] Market Dynamics - AI accelerator thermal design power (TDP) is rapidly increasing, with NVIDIA's GPUs expected to reach power levels between 1,800W to 7,000W in the coming years [2][4] - Traditional air cooling methods are becoming inadequate as cabinet power density exceeds 30-40kW, necessitating a shift to liquid cooling solutions [5][10] - Liquid cooling technology can reduce Power Usage Effectiveness (PUE) to below 1.2, making it a favorable option for meeting regulatory requirements [7] Technology Trends - The liquid cooling market is bifurcating into two main technology segments: Cold Plate technology for applications below 3,500W and Micro-Channel Lid (MCL) technology for higher power applications [10][12] - Cold Plate technology is expected to remain dominant for lower power applications, while MCL technology is anticipated to become mainstream for high-performance chips by 2026 [11][12] - The value of liquid cooling per rack is expected to quadruple by 2030, indicating a significant increase in market value [15] Supply Chain Evolution - NVIDIA is shifting its supply chain strategy from a "closed delivery" model to an "open ecosystem," allowing more suppliers to enter its supply chain [17][19] - This change provides opportunities for domestic suppliers to become either secondary suppliers through ODMs or primary suppliers as their technologies mature [17][19] - The estimated market for liquid cooling systems required for ASIC chips is projected to reach 35.3 billion RMB by 2026, with NVIDIA's platform requiring even more [19]

Core Insights - The liquid cooling market in China's intelligent computing centers is projected to reach 18.4 billion yuan in 2024, representing a 66% year-on-year growth, and is expected to further expand to 130 billion yuan by 2029, indicating a potential market explosion [1] - Cold plate liquid cooling is anticipated to become the mainstream cooling solution for data centers due to its higher efficiency compared to traditional air cooling methods, especially as GPU power design continues to increase [1][2] - 3D printing is expected to emerge as the optimal manufacturing technology for liquid cooling plates, offering advantages over traditional machining methods [2][4] Market Trends - The cold plate liquid cooling method is the most widely used, utilizing a closed cavity made of copper or aluminum to conduct heat without direct contact with the liquid, thus requiring less redesign of existing data center equipment [1] - The historical data indicates that cooling can account for up to 40% of a data center's energy consumption, highlighting the importance of efficient cooling solutions [1] Technological Advancements - 3D printing allows for complex flow channel designs that enhance cooling performance, overcoming limitations faced by traditional manufacturing methods [2][3] - Microchannel liquid cooling plates are becoming a new trend, with companies like Jinfu Technology successfully developing microchannel designs that improve heat dissipation [3] - The industry is transitioning from traditional machining methods to 3D printing for liquid cooling plate production, driven by the need for intricate designs and improved performance [3][4] Industry Developments - Companies are developing advanced 3D printing technologies to overcome the challenges of printing with copper, which has high reflectivity in the red light spectrum [4] - Several firms have successfully launched 3D printed liquid cooling plate products, demonstrating the feasibility and advantages of this technology in the market [4]

Core Insights - The report from Nomura Securities highlights the urgent need for advanced cooling solutions in AI chips due to rapidly increasing thermal design power (TDP) levels, with projections indicating that TDP for mainstream AI chips will rise from 600-700W in 2023 to potentially over 3500W by 2027 [3][4][10]. AI Chip Cooling Demand - The TDP of AI chips is expected to escalate significantly, with Nvidia's Blackwell series reaching 1000-1400W by 2025 and the Rubin series potentially hitting 2300W in 2026, and 3500W in 2027 [3][4]. - Traditional single-phase liquid cooling solutions are nearing their limits, necessitating new technological breakthroughs to handle TDPs above 2000-3000W [4]. Microchannel Cold Plates (MCL) - MCL is identified as the most practical solution for cooling chips exceeding 3000W post-2027, integrating heat spreaders and cold plates to reduce thermal resistance [5][7]. - MCL maintains compatibility with existing supply chains, utilizing current cooling fluids and components, unlike two-phase liquid cooling which requires extensive redesign [7]. - There are three main challenges to MCL mass production: design precision of microchannels, manufacturing capabilities, and supply chain coordination [8][9][10]. Thermal Interface Materials (TIM) - Upgrading TIM is crucial, with current materials like graphite films being insufficient for future TDPs; alternatives like indium TIM show promise but face challenges in assembly and interface treatment [10][11]. Other Technologies - Emerging technologies such as TSMC's Si integrated microcoolers and Microsoft's embedded microfluidics are considered less likely to be implemented in the short term due to scalability issues [11]. Market Opportunities for Traditional Cooling Manufacturers - Traditional cooling manufacturers like AVC and Auras are expected to see growth due to overlooked liquid cooling demands for non-core chips and the overall acceleration of liquid cooling adoption in AI servers [12][13]. - The market for liquid cooling components in AI servers is projected to grow from $1.2 billion to $3.5 billion between 2025 and 2027, with a compound annual growth rate exceeding 60% [12]. Investment Targets - Jentech is highlighted as a leading player in the microchannel market, with expected revenue from MCL contributing significantly to its overall earnings by 2028 [15]. - AVC and Auras are also recommended for investment, with AVC being a key supplier for Nvidia and Auras having advantages in manifold components [15].

Summary of Liquid Cooling Materials Industry Report Industry Overview - The report focuses on the liquid cooling materials industry, particularly in the context of increasing power consumption in AI chips and the demand for hybrid liquid cooling solutions [1][2]. Key Points and Arguments - **Server Cooling Demand Upgrade**: The power consumption of GPUs has increased from 1.2 kW to 1.8 kW, leading to total cabinet power consumption reaching 250-300 kW. Traditional single-phase cold plates are inadequate, necessitating an upgrade to liquid cooling solutions, with hybrid liquid cooling likely becoming mainstream, especially for high-power products like Rubin Ultra [1][2]. - **Advantages of Hybrid Liquid Cooling**: Compared to silent liquid cooling, hybrid solutions retain cold plates covering CPUs/GPUs, removing 60%-70% of heat, reducing the requirements for silent loops, enhancing system stability, allowing for single-point maintenance, and significantly lowering the amount of fluorinated fluids used, thus reducing costs [1][4]. - **Market Potential for Fluorinated Materials**: If hybrid liquid cooling solutions can be scaled, they could significantly drive demand for fluorinated materials, with a potential market size reaching 20 billion yuan, compared to the current demand of around 1,000 tons and a market capacity of 3 billion yuan [1][5]. - **NVIDIA Cooling Architecture Optimization**: The GB200 architecture uses one liquid cooling plate for two GPUs and one CPU, while the GB300 architecture provides individual cooling plates for each GPU and CPU, achieving more precise cooling and controlling total cabinet power consumption to approximately 132 kW. Higher power products like the Shadow series will require upgrades to bidirectional or phase change medium solutions [1][6]. Additional Important Insights - **Liquid Medium Choices**: Different cooling solutions utilize various liquid mediums. Single-phase cold plates typically use ethylene glycol, while bidirectional systems require low-boiling-point fluorinated fluids like R134A, hydrofluoroethers, and hexapropylene dimer [2][10]. - **New Zobon’s Liquid Cooling Strategy**: New Zobon is actively expanding in the liquid cooling sector, planning to add nearly 12,000 tons of capacity, including about 5,000 tons of perfluoropolyether capacity. The company aims to capture 50% of the semiconductor etching and temperature control market share [2][18]. - **Future Prospects for New Zobon**: The company expects its main business revenue to reach around 1.4 billion yuan by 2025-2026 and potentially 1.8-1.9 billion yuan by 2027. If the liquid cooling business materializes, the long-term market potential could reach 20 billion yuan, positioning the company for a valuation exceeding 20 billion yuan, with a short-term target market cap close to 50 billion yuan [2][20]. - **Challenges in Silent vs. Hybrid Solutions**: Silent solutions face high costs and reliability issues, while hybrid solutions enhance reliability and maintainability, significantly reducing the amount of medium required and overall costs [2][7]. - **Market Potential for Liquid Cooling Solutions**: The liquid cooling market has substantial potential, with estimates suggesting that if 100,000 cabinets are sold, the market space could approach 20 billion yuan, indicating significant growth elasticity compared to the current demand and market capacity [2][17]. This summary encapsulates the critical insights and projections regarding the liquid cooling materials industry, highlighting the evolving technology landscape and market opportunities.

Core Viewpoint - Nvidia is driving upstream suppliers to develop a new type of water cooling component called MLCP (Microchannel Liquid Cooling Plate) to address the increasing heat generated by AI GPU chips as technology advances [1] Industry Summary - The computing power and chip cooling industry is shifting from "technological breakthroughs" to "scale applications" [1] - As the computing power of AI chips increases, their power consumption grows exponentially, making cooling technology a necessity rather than an option [1] - The demand for cooling components is driven by the need for new data centers to achieve a Power Usage Effectiveness (PUE) of ≤1.25 as part of China's "East Data West Computing" initiative [1] - Cooling systems account for over 20% of total energy consumption in data centers, making them the largest energy source after IT equipment itself [1] Technology Summary - Microchannel water cooling technology is an advanced and efficient cooling solution, offering revolutionary advantages over traditional air cooling and conventional liquid cooling, especially for high-power, small-sized heat sources [1] Company Summary - Relevant A-share concept stocks mentioned include Aled and Plittech [1]

Summary of Liquid Cooling Materials Conference Call Industry Overview - The conference focuses on the liquid cooling materials industry, particularly in the context of AI chip cooling and data centers [1][2][4]. Key Points and Arguments Types of Liquid Cooling Media - Liquid cooling media are categorized into three types: water-based, oil-based, and fluorinated liquids, each with distinct advantages and disadvantages [1][3][5]. - **Water-based Media**: High thermal efficiency, low cost (around tens of yuan per kilogram), but prone to leakage and microbial growth [5]. - **Oil-based Media**: Cheapest option (around 10 yuan per kilogram), but poor fluidity and potential fire hazards [5]. - **Fluorinated Liquids**: High performance but expensive (high-end options like 3M perfluoropolyether cost 400-500 yuan per kilogram) and face regulatory risks regarding PFAS [1][6]. Trends in AI Chip Cooling - The trend in AI chip cooling is shifting from traditional air cooling to liquid cooling solutions due to high power density requirements [2][4]. - Single-phase cooling plates are being replaced by dual-phase cooling plates, which are expected to be widely adopted by 2024 [2]. Cost Considerations - The cost of cooling media is significant in system design. For example, a single cabinet requiring 120-150 kW can cost up to 1 million yuan when using high-end fluorinated liquids [1][10]. - Using alternative media like triol or silicone oil can significantly reduce costs [10][11]. Future Trends - The combination of full immersion cooling and dual-phase cooling plates is seen as a future trend to reduce costs and address high heat flux density issues [1][13]. - The industry is moving towards designs that minimize liquid usage and optimize heat dissipation through techniques like zoning and partitioning [1][13]. Market Dynamics - Major data centers in China, such as Alibaba and ByteDance, are currently using single-phase silent liquid cooling systems, indicating a trend towards advanced cooling technologies despite high costs [18]. - Alibaba is also exploring cooling plate technology to find more economical solutions [19]. Challenges and Innovations - Dual-phase cooling technology is gaining traction, especially with NVIDIA's upcoming Ruby architecture, but faces challenges such as medium boiling point limits and pressure handling [7][24]. - The use of refrigerants in dual-phase systems is expected to grow, with potential for mainstream adoption by mid-2026 [24]. Additional Important Content - The volatility and maintenance requirements of different cooling media vary, with silicone oil and fluorinated liquids requiring less frequent additions compared to triol [14][16]. - The efficiency of cooling media is measured by specific heat capacity, with water being the most efficient but limited in application due to its non-insulating properties [22]. - The domestic market for fluorinated liquids includes major manufacturers like Juhua, New Zhiyuan, and Tianjin Changlu, indicating a competitive landscape [21]. This summary encapsulates the critical insights from the conference call, highlighting the evolving landscape of liquid cooling technologies and their implications for the AI and data center industries.