Investment Rating - The industry investment rating is "Outperform the Market - A" and the rating is maintained [5]. Core Insights - The report highlights that Huawei's Ascend and Kunpeng chip roadmaps were announced at the Huawei Connect 2025 event, showcasing advancements in AI computing capabilities and the introduction of new supernodes [1][2][10]. - Domestic cloud service providers (CSPs) are increasingly adapting to domestic chips, which is expected to boost terminal demand, particularly with the upcoming Alibaba Cloud Summit [3][12]. - The report suggests that the domestic computing power industry is experiencing changes on both the supply and demand sides, with continuous iterations of domestic chips and increasing capital expenditures from major internet companies [3][12]. Summary by Sections Industry Overview - Huawei announced the Ascend 950 chip architecture, which supports low-precision data formats, enhances vector computing power, and increases interconnect bandwidth by 2.5 times [1][10]. - The new supernodes, Atlas950 SuperPoD and Atlas960 SuperPoD, support 8192 and 15488 Ascend cards respectively, leading in key metrics such as card scale and total computing power [2][11]. Market Performance - The report notes that the computer industry index rose by 0.16% this week, outperforming the Shanghai Composite Index by 1.46 percentage points [13][14]. - The overall performance of the computer sector was described as average, with market focus primarily on the domestic computing power industry chain [18]. Key Developments - Tencent Cloud has fully adapted to mainstream domestic chips and is actively participating in the open-source community, enhancing its software capabilities for AI computing [3][12]. - The upcoming Alibaba Cloud Summit is expected to feature over 110 specialized discussions on AGI, which may further stimulate demand for domestic computing power [3][12].

Core Viewpoint - Huawei has made significant advancements in self-developed chips and AI infrastructure, showcasing its commitment to enhancing computing power for artificial intelligence applications in the coming years [1][3][5]. Group 1: Chip Development - Huawei plans to release multiple Ascend chips, including the 950PR, 950DT, and Ascend 960 and 970, with the 950PR set to launch in Q1 2026 featuring Huawei's self-developed HBM technology [1]. - The company has emphasized the importance of computing power as a key driver for artificial intelligence, particularly in the context of China's AI development [3]. Group 2: AI Infrastructure - The deployment of over 300 Cloud Matrix 384 supernodes marks a new norm in AI infrastructure, with Huawei focusing on a "supernode + cluster" computing solution to meet the growing demand for computing power [3]. - Huawei introduced the Atlas950 SuperPoD and Atlas 960 SuperPoD supernodes, supporting 8192 and 15488 Ascend cards respectively, positioning them as global leaders in key performance metrics [5]. Group 3: Technological Innovations - The launch of the TaiShan 950 SuperPoD marks Huawei's entry into general computing supernodes, aiming to replace various large and small machines as well as Exadata database systems [5]. - Huawei has overcome significant challenges in interconnecting large-scale supernodes, introducing the UnifiedBus protocol, with plans to open up the Lingqu 2.0 technology specifications in the future [5]. Group 4: Competitive Positioning - Despite facing challenges due to U.S. sanctions and limitations in chip manufacturing capabilities, Huawei leverages its extensive experience in connectivity technology to maintain a competitive edge in supernode capabilities [6].

Core Viewpoint - Huawei has announced the launch of new AI chip technologies, aiming to challenge Nvidia's dominance in the market, with plans to release multiple Ascend series chips by 2028 [1][2][4]. Group 1: Product Launch and Features - Huawei's Vice Chairman Xu Zhijun revealed the upcoming Ascend 950, 960, and 970 series chips, with the Ascend 950PR expected in Q1 2026 and the Ascend 970 in Q4 2028 [1]. - The new SuperPoD nodes, based on the Ascend 950 and 960 chips, will offer unprecedented computing power, with the former supporting 8192 cards and the latter 15488 cards [1][4]. - Huawei's SuperPoD products are designed to enhance computing capabilities by bundling multiple AI chips together, positioning them as a direct competitor to Nvidia's technology [4][8]. Group 2: Strategic Implications - The launch of these chips signifies China's efforts to reduce reliance on Nvidia's AI hardware, marking a significant step towards domestic alternatives in the AI sector [2][8]. - Huawei's advancements in chip technology are seen as crucial for breaking supply bottlenecks in China's AI development, potentially enhancing the country's autonomous capabilities in AI computing [2][8]. - The introduction of the "Lingqu" interconnect protocol aims to link more computing resources, allowing for clusters exceeding 500,000 cards based on the Ascend 950 and over 990,000 cards based on the Ascend 960 [5]. Group 3: Competitive Landscape - Despite facing U.S. sanctions, Huawei is positioning itself as a leader in developing solutions that do not depend on American technology, thereby bolstering China's AI ambitions [8]. - The new technologies are viewed as an upgrade to Nvidia's NVLink, which facilitates high-speed communication between chips in servers, indicating Huawei's intent to compete effectively in the AI market [8]. - Research indicates that Huawei's products may outperform Nvidia's systems in certain performance metrics, despite the latter's advanced AI chips [8].

Core Insights - Huawei has unveiled multiple self-developed chip advancements at the 2025 Global Connectivity Conference, including the launch timeline for the Ascend 950PR chip in Q1 2026, which utilizes Huawei's self-developed HBM technology [2] - The concept of "super nodes" has emerged as a new norm in AI infrastructure, with over 300 Cloud Matrix 384 super nodes deployed, emphasizing the critical role of computing power in the future of artificial intelligence in China [4][5] Group 1 - Huawei's newly released Atlas950 SuperPoD and Atlas 960 SuperPoD super nodes support 8,192 and 15,488 Ascend cards respectively, showcasing global leadership in key metrics such as card scale, total computing power, memory capacity, and interconnect bandwidth [7] - The company has also introduced super node clusters, Atlas950 SuperCluster and Atlas960 SuperCluster, with computing power exceeding 500,000 cards and reaching one million cards [7] - Huawei is confident in providing sustainable and ample computing power for the long-term rapid development of artificial intelligence, leveraging the strongest computing power globally through super nodes and clusters [8] Group 2 - Huawei has pioneered the introduction of super node technology into general computing, launching the world's first general computing super node, TaiShan 950 SuperPoD, which aims to replace various large and small machines as well as Exadata database integrated machines [8] - The company has overcome significant challenges in interconnect technology for large-scale super nodes, introducing the UnifiedBus interconnect protocol, with plans to open the Lingqu 2.0 technical specifications in the future [8] - Despite facing restrictions from U.S. sanctions that limit access to TSMC for chip production, Huawei emphasizes its strengths in connectivity technology, which has been developed over 30 years, enabling the achievement of super nodes with tens of thousands of cards [8]

2025.09. 18 本文字数：1091，阅读时长大约2分钟 作者 | 第一财经 李娜 华为在全联接大会2025上罕见公布了多款自研芯片的研发进展。 此外，他表示，超节点成为AI基础设施建设新常态，目前Cloud Matrix 384超节点累计部署300套 以上。 徐直军指出："算力过去是，未来也将继续是人工智能的关键，更是中国人工智能的关键。"此外， 他再次强调："基于中国可获得的芯片制造工艺，华为努力打造'超节点+集群'算力解决方案，来满足 持续增长的算力需求。" 徐直军认为，超节点在物理上由多台机器组成，但逻辑上以一台机器学习、思考、推理。 华为还在现场发布了Atlas950 SuperPoD和Atlas 960 SuperPoD超节点，分别支持8192及 15488张昇腾卡，从卡规模、总算力、内存容量、互联带宽等关键指标上看，处于全球领先位置。 此外，华为还同时发布了超节点集群，分别是Atlas950 SuperCluster和Atlas960 SuperCluster，算力规模分别超过50万卡和达到百万卡。 徐直军表示，基于全球最强算力的超节点和集群，华为对于为人工智能的长期快速发展提供可持续且 ...

Core Viewpoint - Huawei expresses confidence in providing sustainable and sufficient computing power for the long-term rapid development of artificial intelligence, leveraging its supernodes and clusters with the world's strongest computing capabilities [1][6]. Group 1: Chip Development - Huawei has announced the development progress of several self-developed chips, including the Ascend 950PR, 950DT, and Ascend 960 and 970, with the 950PR set to launch in Q1 2026 [1]. - The company is focusing on creating a "supernode + cluster" computing solution to meet the continuously growing demand for computing power, based on China's available chip manufacturing processes [3]. Group 2: Supernode Infrastructure - The supernode has become a new norm in AI infrastructure construction, with over 300 Cloud Matrix 384 supernodes deployed [3]. - Huawei has released the Atlas 950 SuperPoD and Atlas 960 SuperPoD supernodes, supporting 8192 and 15488 Ascend cards respectively, showcasing global leadership in key metrics such as card scale, total computing power, memory capacity, and interconnect bandwidth [5]. Group 3: Technological Innovations - Huawei has introduced the world's first general-purpose computing supernode, TaiShan 950 SuperPoD, which, combined with the GaussDB distributed database, aims to replace various large and small machines as well as Exadata database integrated machines [6]. - The company has overcome significant challenges in large-scale supernode interconnect technology, launching the UnifiedBus interconnect protocol, with plans to open the Lingqu 2.0 technology specifications in the future [6].