Core Insights - The article discusses the rapid growth of High Bandwidth Memory (HBM) driven by the increasing demand for artificial intelligence (AI) and the acceleration of GPU development by companies like NVIDIA [1][2][5] - HBM is a high-end memory technology that is difficult to implement, and customization is crucial for its continued benefit from the widespread application of GPUs and accelerators [1][2] Market Trends - According to Dell'Oro Group, the server and storage components market is expected to grow by 62% year-over-year by Q1 2025 due to the surge in demand for HBM, accelerators, and network interface cards (NiC) [1] - AI server sales have increased from 20% to approximately 60% of the total market, significantly boosting GPU performance and HBM capacity [2] Competitive Landscape - SK Hynix leads the HBM market with a 64% sales share, followed by Samsung and Micron [1][2] - Micron plans to begin mass production of the next-generation HBM4 with a 2048-bit interface in 2026, expecting a 50% quarter-over-quarter revenue growth in HBM by Q3 FY2025, reaching an annual revenue of $6 billion [2] Technological Challenges - The demand for HBM is increasing rapidly, with manufacturers facing challenges due to the accelerated release cycles of GPU technologies, which are now updated every 2 to 2.5 years compared to the traditional 4 to 5 years for standard memory technologies [3][4] - The complexity of HBM5 architecture poses challenges for standardization and widespread adoption, as it requires a balance between high memory bandwidth and increased capacity for next-generation AI and computing hardware solutions [5][6] Future Developments - Marvell Technology is collaborating with major HBM suppliers to develop a custom HBM computing architecture, expected to be released in the second half of 2024, which will integrate advanced 2.5D packaging technology and custom interfaces for AI accelerators [4][6] - The HBM memory bandwidth and I/O count are expected to double with each generation, necessitating innovative packaging technologies to accommodate the increased density and complexity [4][6]

Group 1 - The core concept of hybrid bonding technology is gaining traction among major semiconductor companies like TSMC and Samsung, as it is seen as a key to advancing packaging technology for the next decade [2][4][10] - Hybrid bonding allows for high-density, high-performance interconnections between different chips, significantly improving signal transmission speed and reducing power consumption compared to traditional methods [5][11] - The technology is particularly relevant for high bandwidth memory (HBM) products, with leading manufacturers like SK Hynix, Samsung, and Micron planning to adopt hybrid bonding in their upcoming HBM5 products to meet increasing bandwidth demands [10][12] Group 2 - TSMC's SoIC technology utilizes hybrid bonding, achieving a 15-fold increase in chip connection density compared to traditional methods, which enhances performance and reduces size [14][15] - Intel has also entered the hybrid bonding space with its 3D Foveros technology, which significantly increases the number of interconnections per square millimeter, enhancing integration capabilities [19] - SK Hynix and Samsung are actively testing and planning to implement hybrid bonding in their next-generation HBM products, with Samsung emphasizing the need for this technology to meet height restrictions in memory packaging [20][22] Group 3 - The global hybrid bonding technology market is projected to grow from $123.49 million in 2023 to $618.42 million by 2030, with a compound annual growth rate (CAGR) of 24.7%, particularly strong in the Asia-Pacific region [22]

Core Viewpoint - The cooling technology will become a key competitive factor in the high bandwidth memory (HBM) market as HBM5 is expected to commercialize around 2029, shifting the focus from packaging to cooling methods [1][2]. Summary by Sections HBM Technology Roadmap - The roadmap from HBM4 to HBM8 spans from 2025 to 2040, detailing advancements in HBM architecture, cooling methods, TSV density, and interlayer technologies [1]. - HBM4 is projected to have a data rate of 8 Gbps, a bandwidth of 2.0 TB/s, and a capacity of 36/48 GB per HBM, utilizing liquid cooling methods [3]. - HBM5 will maintain the 8 Gbps data rate but will double the bandwidth to 4 TB/s and increase capacity to 80 GB [3]. - HBM6 will introduce a data rate of 16 Gbps and a bandwidth of 8 TB/s, with a capacity of 96/120 GB [3]. - HBM7 is expected to reach 24 TB/s bandwidth and 160/192 GB capacity, while HBM8 will achieve 32 Gbps data rate, 64 TB/s bandwidth, and 200/240 GB capacity [3]. Cooling Technologies - HBM5 will utilize immersion cooling, where the substrate and package are submerged in cooling liquid, addressing limitations of current liquid cooling methods [1]. - HBM7 will require embedded cooling systems to inject cooling liquid between DRAM chips, introducing fluid TSVs [2]. - The professor emphasizes that cooling will be critical as the base chip will take on part of the GPU workload starting from HBM4, leading to increased temperatures [1][2]. Bonding and Performance Factors - Bonding will also play a significant role in determining HBM performance, with mixed glass and silicon interlayers being introduced from HBM6 onwards [2].

Core Viewpoint - The cooling technology will become a key competitive factor in the high bandwidth memory (HBM) market as HBM5 is expected to commercialize around 2029, shifting the focus from packaging to cooling solutions [1][2]. Summary by Sections HBM Technology Roadmap - The roadmap from HBM4 to HBM8 spans from 2025 to 2040, detailing advancements in HBM architecture, cooling methods, TSV density, and interposer layers [1]. - HBM4 is projected to be available in 2026, with a data rate of 8 Gbps, bandwidth of 2.0 TB/s, and a capacity of 36/48 GB per HBM [3]. - HBM5, expected in 2029, will double the bandwidth to 4 TB/s and increase capacity to 80 GB [3]. - HBM6, HBM7, and HBM8 will further enhance data rates and capacities, reaching up to 32 Gbps and 240 GB respectively by 2038 [3]. Cooling Technologies - HBM5 will utilize immersion cooling, where the substrate and package are submerged in cooling liquid, addressing limitations of current liquid cooling methods [2]. - HBM7 will require embedded cooling systems to inject coolant between DRAM chips, introducing fluid TSVs for enhanced thermal management [2]. - The introduction of new types of TSVs, such as thermal TSVs and power TSVs, will support the cooling needs of future HBM generations [2]. Performance Factors - Bonding techniques will also play a crucial role in HBM performance, with HBM6 introducing a hybrid interposer of glass and silicon [2]. - The integration of advanced packaging technologies will allow base chips to take on GPU workloads, necessitating improved cooling solutions due to increased temperatures [2].