东 兴 晨 报 东兴晨报 P1 2026 年 1 月 28 日星期三 经济要闻 1. 国税局：2025 年税务部门全年征收各项税费 33.1 万亿元。其中，未扣 除出口退税的税收收入 17.8 万亿元，同比增长 2.7%。支持科技创新和制造 业发展的主要优惠政策减税降费退税超 2.8 万亿元，有力促进新质生产力和 实体经济发展。（资料来源：同花顺） 2. 国资委：1 月 28 日，国务院国资委企业改革局局长林庆苗在国新办新 闻发布会上透露，下一步国资委将聚焦国有资本"三个集中"，以重组整合为 抓手，扎实推进国有经济布局优化和结构调整，加快建设更多世界一流企业。 国有资本"三个集中"，首先是扎实做好新央企组建和战略性重组，更加突出 中央企业在战略安全、产业引领、国计民生、公共服务等领域的支撑作用， 更好把企业做强做优做大。其次，深入推进专业化整合，支持创新能力强的 企业作为主体，开展同类业务横向整合、产业链上下游纵向整合，减少行业 内卷。再次，支持中央企业开展高质量并购，获取核心要素、抢占技术先机， 加快培育发展战略性新兴产业和未来产业。（资料来源：同花顺） 3. 国家移民管理局：2025 年，全国移民管理机构 ...

3. 海关：1 月 26 日，海关总署署长孙梅君在署会见哈萨克斯坦总统办公 厅副主任扎纳索娃。双方就落实中哈两国元首战略共识，加强智慧海关合作、 跨境贸易便利化、检验检疫、口岸保通保畅等议题交换意见，达成积极意向。 （资料来源：同花顺） 4. 人力资源保障部：我国将制定《新就业形态劳动者基本权益保障办法》， 进一步明确新就业形态劳动基准和企业劳动保护责任；出台《超龄劳动者基 本权益保障暂行规定》；推动修订《职工带薪年休假条例》，促进用人单位落 实职工带薪年休假制度。（资料来源：同花顺） 5. 香港：香港和上海签订合作协议，成立香港贵金属中央结算系统有限公 司(港金结算公司)。担任主席的财经事务及库务局局长许正宇表示，有逾 10 间本地及海内外银行参与，短期内会召开董事会。为配合黄金市场发展，当 局已将商品交易人才纳入人才清单，相关海外专业人士可透过加分制度申请 来港，同时鼓励企业透过旧人带新人及专业培训，以支持市场长远发展。（资 料来源：同花顺） 6. 财政部：为整治政府采购领域"内卷式"竞争，形成优质优价、良性竞 争的市场秩序，日前，财政部印发《关于推动解决政府采购异常低价问题的 通知》（以下简称"通知"） ...

Group 1 - The core viewpoint of the article is that Donghai Securities has given a "buy" rating to Tuojing Technology (688072.SH) based on its leading position in the domestic semiconductor thin film deposition equipment industry and its rapid performance growth [1] - The company is capitalizing on advanced processes and three-dimensional integration trends, leading to sustained high growth in its thin film deposition business [1] - The company has strategically positioned itself in advanced bonding and supporting measurement equipment, opening new growth opportunities for the future [1]

Core Viewpoint - Through-Silicon Vias (TSVs) are essential for modern 3D Integrated Circuit (3D-IC) technology, providing vertical interconnections that enable short and low-latency signal paths between stacked chips [1] Group 1: TSV Structure and Manufacturing - TSVs are vertical metal plugs, typically made of copper, embedded in the thickness of silicon chips. The classic manufacturing process includes deep reactive ion etching (DRIE), deposition of liner and barrier layers, copper electrochemical deposition, and back thinning to expose the vias [3] - TSVs can be categorized into three types based on their introduction in the manufacturing process: front-side, middle, and back-side vias, with middle vias being most common in high-density logic memory stacking [3] Group 2: TSV Spacing and Electrical Characteristics - TSV spacing is a critical parameter affecting system design choices. Smaller spacing allows for more vertical interconnections per unit area, supporting higher bandwidth between stacked chips, but also presents challenges [5] - Parasitic parameters of TSVs, including resistance, capacitance, and inductance, must be accurately modeled early in the process. These parameters impact signal integrity, timing convergence, power transmission, and inter-layer communication [7] - The capacitance of TSVs acts like a metal-insulator-semiconductor capacitor, where higher capacitance increases delay and reduces noise tolerance, introducing crosstalk to nearby networks [7] - Resistance from copper filling is significant for high-frequency signals, directly affecting insertion loss and power efficiency for wideband memory and high-speed SerDes paths [7] - The vertical geometry of TSVs can introduce inductive behavior that affects impedance matching and eye diagram margins for fast edges and GHz-range components [7] Group 3: Design Constraints and Reliability - The choice of TSV spacing must optimize electrical performance, mechanical reliability, and physical design constraints due to increased mechanical stress and larger KOZ (Keep Out Zone) areas [8] - Each TSV requires a KOZ, preventing the placement of active devices or sensitive interconnections within that area to avoid performance degradation due to stress and leakage current [12] - The thermal expansion coefficient (CTE) of copper is higher than that of silicon, leading to local stress during temperature cycling, which can alter transistor characteristics and affect long-term reliability [12] - To mitigate stress impacts, TSVs can be compared with micro-bumps, with TSVs offering shorter vertical path lengths, typically in the range of tens of micrometers, compared to hundreds of micrometers for micro-bumps [12] Group 4: Applications and Performance - TSVs significantly enhance vertical bandwidth density, supporting more parallel connections in a smaller space, crucial for high bandwidth memory (HBM) stacks achieving terabits per second [15] - TSVs provide lower interconnect latency due to shorter path lengths and reduced RC delay compared to micro-bump interconnections, which introduce longer paths and additional parasitic layers [15] - TSVs can also serve as thermal conduits, aiding in vertical heat dissipation, a feature not available with micro-bumps, although TSVs introduce thermal stress that requires balanced layout strategies [15] - Engineering teams must establish a TSV budget early in the 3D IC design phase, influencing chip size, partitioning strategies, bandwidth targets, and overall packaging economics [15] Group 5: Verification and Reliability Considerations - Electrical, physical, and reliability verification are essential for TSVs, addressing long-term reliability concerns such as hybrid bonding and TSV integration [20] - Specific scenarios for hybrid bonding include precise extraction of TSV array parasitics, timing analysis of inter-layer paths, and SI/PI analysis of vertical power networks [21]

Investment Rating - The report gives a "Buy" rating for the company, indicating a positive outlook for investment [6]. Core Insights - The company is a leading manufacturer of front-end thin film deposition equipment in China, with core products including PECVD, ALD, SACVD, and HDPCVD, which are widely used in integrated circuit manufacturing and advanced packaging [9][14]. - The global thin film deposition equipment market is expected to reach $34 billion by 2025, with a CAGR of 13.3% from 2020 to 2025, driven by the continuous evolution of advanced logic processes and the increasing complexity of storage devices [6][43]. - The company has a clear layout in three-dimensional integration and is transitioning from a single deposition equipment focus to a dual-engine platform that includes both deposition and bonding technologies [6][9]. Financial Data and Profit Forecast - The company’s total revenue is projected to grow from 2,705 million yuan in 2023 to 10,817 million yuan in 2027, with a CAGR of 54.4% [5]. - The net profit attributable to the parent company is expected to increase from 663 million yuan in 2023 to 2,522 million yuan in 2027, reflecting a growth rate of 40.4% [5]. - The gross margin is forecasted to stabilize around 41.1% by 2027, after experiencing fluctuations due to new product introductions and validation costs [29]. Company and Industry Situation - The company has established a strong competitive position in the PECVD segment, which accounts for approximately 33% of the thin film deposition market value, and is the only domestic manufacturer to achieve stable mass production of PECVD equipment [47][59]. - The thin film deposition equipment is a core component of the semiconductor front-end equipment system, with a stable market share of about 22% in wafer manufacturing equipment [47]. - The company is well-positioned to benefit from the ongoing expansion of domestic wafer fabs and the trend towards domestic substitution in semiconductor equipment [6][43]. Product and Technology Development - The company’s product lineup includes advanced bonding equipment and supporting measurement devices, which have already achieved mass production in fields such as advanced storage and image sensors [19][21]. - The PECVD series products have maintained a competitive advantage, with significant production scale expansion, while ALD products have also begun to receive repeat orders due to their leading domestic process coverage [19][20]. - The company’s new product introductions, including ALD and SACVD, are expected to enhance profitability as they transition from validation to mass production [21][25].

Core Viewpoint - The storage market is experiencing a rare price increase across all segments, driven by the growing demand for AI servers and high-density storage, leading to a tightening of upstream capacity and healthier inventory levels [2]. Group 1: Market Dynamics - NAND manufacturers' decisions on next-generation technology routes are becoming increasingly critical, as any lead or lag will directly impact cost and performance competition over the next two to three years [3]. - SK Hynix has made a disruptive decision to introduce hybrid bonding at the 300-layer NAND node, a technology previously expected to be implemented only after reaching 400 layers [5]. - The competitive landscape is intensifying, with Samsung Electronics pushing for 400+ layer V10 NAND and Kioxia applying hybrid bonding technology in its 218-layer BiCS 3D NAND, achieving a 59% increase in bit density and a 33% improvement in NAND interface speed [5][6]. Group 2: Technological Shifts - The necessity for hybrid bonding is increasing as NAND layer counts rise, with traditional single-chip manufacturing architectures facing systemic bottlenecks beyond 300 layers [8]. - Hybrid bonding allows for separate manufacturing of storage unit wafers and peripheral circuit wafers, significantly reducing the thermal burden on peripheral circuits and enabling independent advancements in both areas [8][10]. - Kioxia's CBA technology and Samsung's CoP architecture demonstrate the advantages of hybrid bonding, achieving higher I/O speeds and improved power efficiency [11][12]. Group 3: Competitive Strategies - Samsung's aggressive dual-track strategy aims to lead in both high-layer stacking and hybrid bonding technology, although it faces significant manufacturing challenges [15]. - Kioxia's more cautious approach focuses on gradual advancements and cost control through partnerships, with plans to produce over 1000-layer 3D NAND by 2031 [16]. - Yangtze Memory Technologies has leveraged its early adoption of hybrid bonding technology to expand capacity amid a market contraction, positioning itself favorably against competitors [17]. Group 4: Industry Trends - The surge in enterprise SSD demand, driven by AI model growth, is pushing NAND manufacturers to rapidly enhance capacity and technology to seize market opportunities [20]. - The traditional PUC architecture is reaching its limits, necessitating a shift to hybrid bonding as a required option rather than a choice [24]. - The upcoming years are critical for SK Hynix as it aims to convert existing production capacity to V9 while advancing V10 development, highlighting the urgency of technological upgrades [25]. Group 5: Future Outlook - The breakthrough of hybrid bonding technology instills confidence in NAND manufacturers to pursue ultra-high layer counts, with Samsung and Kioxia setting ambitious goals for 1000-layer NAND development [27]. - Achieving 1000-layer stacking will require overcoming significant engineering challenges, including deep aspect ratio etching and maintaining reliability while compressing thickness [28][29]. - The industry is exploring various paths for expansion, including logical, physical, and performance enhancements, indicating that future NAND development will focus on a comprehensive optimization of layers, architecture, materials, and processes [38].

Group 1: Smartphone Panel Market - The global smartphone panel shipment volume is projected to reach 586 million units in Q3 2025, reflecting a quarter-on-quarter increase of 8.1% and a year-on-year increase of 5.3% [2] - The growth is primarily driven by the iPhone 17 series and new product launches from other major smartphone brands in the second half of the year [2] - AMOLED panel demand continues to rise, while LCD panel shipments remain stable in the entry-level smartphone and repair markets [2] - The total smartphone panel shipment volume for 2025 is expected to reach 2.243 billion units, marking a year-on-year increase of 3.4%, which is a recent peak [2] Group 2: Memory Industry Capital Expenditure - The average selling price (ASP) of memory products is on the rise, leading to increased profitability for suppliers [5] - Capital expenditure for DRAM and NAND Flash is expected to continue to rise; however, the contribution to bit output growth in 2026 will be limited [5] - The investment focus in the DRAM and NAND Flash industries is shifting from merely expanding capacity to upgrading process technologies, high-layer stacking, hybrid bonding, and high-bandwidth memory (HBM) products [5]

Financial Data and Key Metrics Changes - Camtek reported record revenues of $123.3 million for Q2, reflecting over 20% growth year over year [6][12] - Gross margin was maintained at approximately 52%, contributing to a record operating income of over $37 million [6][12] - Operating profit for the quarter was $37.4 million, compared to $30.8 million in the same quarter last year [13] - Net income for Q2 was $38.8 million, or $0.79 per diluted share, compared to $32.6 million, or $0.66 per share in the prior year [14] Business Line Data and Key Metrics Changes - High-performance computing (HPC) applications contributed approximately 45-50% of total revenue, while advanced packaging applications accounted for about 20% [7] - The advanced packaging segment is rapidly evolving, driven by technological changes to support high-performance computing for AI applications [8] Market Data and Key Metrics Changes - Geographic revenue split for the quarter was 90% from Asia and 10% from the rest of the world [12] - The advanced packaging market supporting AI-related applications is expected to grow rapidly over the next few years [8] Company Strategy and Development Direction - Camtek has made significant strategic investments to develop innovative solutions addressing emerging opportunities in advanced packaging and inspection technologies [10] - The company anticipates that its new systems, AUK and Eagle 5, will generate approximately 30% of total revenue this year, with larger contributions expected next year [11] Management's Comments on Operating Environment and Future Outlook - Management expressed positive momentum heading into the third quarter, with expectations of approximately $125 million in revenue for Q3 [8][16] - The company expects continued growth in the high-performance computing market, driven by advancements in packaging technologies [36][54] Other Important Information - Operating expenses increased to $26.6 million due to exceptionally high shipping costs related to geopolitical conflicts, but these costs are expected to normalize [13][75] - Cash and cash equivalents as of June 30, 2025, were $544 million, up from $523 million at the end of the previous quarter [15] Q&A Session Summary Question: Update on business composition for the second half of the year - Management expects HPC contribution to remain similar to the first half, with a slight increase in China's contribution to total revenue [20][21] Question: Camtek's position against KLA in HPC markets - Management believes they are well-positioned to compete with KLA, citing strong customer relationships and competitive technology [25][26] Question: Traction for Eagle G5 and Hawk products - The Hawk provides high throughput and addresses challenging applications, while the Eagle G5 is faster and offers better defect detection capabilities [30][32] Question: Growth prospects for 2026 - Management anticipates rapid growth in the high-performance computing market, with expectations for another growth year in 2026 [36][54] Question: Impact of HBM4 on shipments - The ratio of Hawk versus Eagle shipments for HBM4 is customer-dependent, with both products being successful in the market [85] Question: OSATs and their strengthening - OSATs are increasingly involved in high-performance computing applications, with significant orders being received for these applications [58][89]

Core Viewpoint - Hybrid bonding technology is rapidly transitioning from laboratory to mass production, becoming a new pillar in storage chip manufacturing, particularly in the context of advanced packaging technologies like 3D NAND and HBM [2][3]. Group 1: Hybrid Bonding Technology - Hybrid bonding eliminates size limitations and parasitic effects associated with traditional bump structures, resulting in shorter signal transmission paths, lower power consumption, and higher speeds [3]. - In 3D NAND, hybrid bonding is expected to replace some existing structures, enabling stable manufacturing at higher stacking layers (e.g., over 300 layers) [3][7]. - Leading companies like Micron, SK Hynix, and Samsung are actively investing in hybrid bonding technology for HBM4 and next-generation CUBE architectures, highlighting its strategic importance [3][5]. Group 2: Samsung's Initiatives - Samsung has shown a strong commitment to hybrid bonding, recognizing its necessity for manufacturing 16-layer HBM [4][5]. - The company plans to produce HBM4 samples by 2025, with mass production expected in 2026, and has already tested a 16-layer HBM sample using hybrid bonding technology [5][6]. - Samsung is also preparing for a custom HBM business, responding to demand from major tech companies like Google and NVIDIA for tailored HBM products [6][7]. Group 3: SK Hynix's Developments - SK Hynix is also pursuing hybrid bonding technology, planning to mass-produce 16-layer HBM4 by 2026 and exploring the potential for over 20 layers [9][10]. - The company aims to implement hybrid bonding for its NAND products, targeting 400-layer NAND flash production by 2025 [10][11]. Group 4: Micron's Position - Micron has been relatively quiet about hybrid bonding but has begun delivering HBM4 samples, which feature a capacity of 36 GB and a bandwidth of up to 2 TB/s [13][14]. - The company is focusing on optimizing existing technologies and may adopt hybrid bonding later than its competitors [14]. Group 5: Equipment Manufacturers - Equipment manufacturers like BESI and Applied Materials are leading the hybrid bonding equipment market, with BESI having developed systems for high-precision bonding since 2019 [15][16]. - Applied Materials has integrated its hybrid bonding platform with wafer processing data, emphasizing system-level integration [16][17]. - Other companies, including ASMPT and Korean firms like Hanmi Semiconductor and Hanwha, are also entering the hybrid bonding equipment market, with various development stages and partnerships [18][19][20]. Group 6: Future Outlook - The semiconductor industry is increasingly focused on hybrid bonding as a key technology to overcome traditional packaging limitations and achieve higher performance integration [25]. - As Moore's Law slows, hybrid bonding is expected to play an irreplaceable role in advancing the industry towards greater integration and performance [25].

Investment Rating - The report maintains a positive outlook on ASMPT, indicating strong performance and growth potential in the advanced packaging sector [1][11]. Core Insights - ASMPT reported robust financial results for the first half of 2025, with revenue reaching $837.6 million, a year-on-year increase of 31.7%, and an operating profit of $329.3 million, up 79.5% quarter-on-quarter [1][11]. - The advanced packaging (AP) business is a key growth driver, accounting for 39% of total revenue, with TCB tools being the largest revenue source, showing a 50% increase in orders [2][12]. - The company expects Q3 revenue guidance of $445-455 million, reflecting a year-on-year growth of approximately 10.8% and a quarter-on-quarter increase of 8.9%, surpassing market consensus [1][11]. Revenue Breakdown - The Semiconductor Solutions (Semi) segment generated Q2 revenue of $257.6 million, up 20.9% year-on-year, driven by growth in the AP business, particularly TCB tools [3][14]. - The SMT segment reported Q2 revenue of $178.5 million, a quarter-on-quarter increase of 22.6%, primarily fueled by demand from the Chinese market, including AI servers and electric vehicles [3][14]. Long-term Growth Prospects - ASMPT forecasts the TCB market to reach a total addressable market (TAM) of $1 billion by 2027, with HBM, C2W logic, and advanced memory packaging identified as key growth areas [3][15]. - Despite anticipated short-term declines in Q3 orders, year-on-year growth is expected to continue, supported by AI-driven TCB orders and demand for mainstream semiconductor equipment [3][15].