Core Viewpoint - The demand for printed circuit boards (PCBs) is surging due to the accelerated construction of AI computing power infrastructure, with significant growth expected in high-layer boards, high-density interconnect (HDI) boards, and IC substrates. Domestic manufacturers are actively expanding high-end capacity, and it is anticipated that domestic PCB equipment manufacturers will seize the AI PCB boom, validating emerging technologies and capturing incremental demand, leading to an increase in domestic market share and value enhancement [1]. Supply and Demand Trends - Structural demand for high-layer boards, HDI boards, and IC substrates is robust due to AI servers. The overall demand for AI PCBs is outpacing supply, with a projected compound annual growth rate (CAGR) of 11.6% for global market server/storage PCBs from 2024 to 2029, driven by AI demand. The planned output value for high-layer boards, HDI boards, and IC substrates is growing rapidly, with an estimated investment of 41.9 billion yuan from leading domestic AI PCB companies by 2025-2026 [1][2]. AI PCB Upgrades - The usage and specifications of PCBs are evolving due to AI servers. For instance, the configuration of Nvidia's NVL36 includes 36 GPUs, 18 CPUs, and 9 NVSwitches, with even higher usage in the NV72 model. The demand for high-layer and HDI PCBs is increasing, leading to higher requirements for wiring, copper plating, and blind/buried holes [2]. Beneficiaries in AI PCB Equipment - The increase in layers and precision in PCBs is benefiting exposure, drilling, electroplating, and inspection equipment. According to Prismark, the global market value shares for these equipment types are 17%, 21%, 7%, and 15%, respectively. The demand for more precise wiring is raising requirements for LDI equipment, while higher layer counts and complex HDI structures are increasing the need for micro-drilling and laser drilling technologies. The uniformity requirements for micro-hole filling are also rising, with expectations for VCP penetration rates to improve from 55% [3][4].

Core Viewpoint - The PCB industry is experiencing significant growth driven by increasing demand for HDI products, particularly due to advancements in AI server technology and substantial capital investments from major tech companies [3][7]. Market Trends - The HDI market is projected to grow at a compound annual growth rate (CAGR) of 6.4% from 2024 to 2029, reaching a global market size of $17.037 billion by 2029 [3]. - Major companies like Google are increasing their capital expenditures, with a reported $22.446 billion for Q2 2025, marking a 30.5% quarter-over-quarter increase and a 70.2% year-over-year increase [3]. Company Performance - Shengyi Technology (生益电子) reported a 91% year-over-year increase in revenue for the first half of 2025, reaching 3.769 billion yuan, and a 452% increase in net profit to 531 million yuan [3]. Technological Developments - The PCB industry is evolving towards high-frequency, lightweight, and lead-free technologies, with CoWoP (Chip-on-Wafer-on-Panel) becoming a focal point for innovation [5][9]. - CoWoP technology requires Low-CTE (Coefficient of Thermal Expansion) materials to ensure compatibility with high-precision applications, leading to a focus on specialized materials and advanced manufacturing processes [9]. Key Drivers of Demand - The demand for PCBs is primarily driven by two segments: high-performance GPUs led by Nvidia and custom ASIC chips developed by cloud service providers like Google and Amazon [7][8]. - The shift towards custom ASICs is aimed at optimizing workloads and reducing reliance on external suppliers, which is expected to further increase PCB demand [8]. Advanced Packaging and Materials - CoWoP technology transforms PCBs from mere connectors to high-precision "inner substrates," necessitating advanced materials and manufacturing techniques [9]. - The introduction of HVLP (High-Voltage Low-Power) copper foil is essential for high-speed signal transmission, with surface roughness controlled to minimize signal loss [12][13]. Resin Innovations - The industry is moving away from traditional epoxy resins due to high dielectric loss, favoring advanced resin systems like PPO, PTFE, and CH, which offer better electrical performance [14].

Core Insights - The company reported a revenue of 597 million yuan for the first half of 2025, representing a year-on-year increase of 10% [1] - The net loss attributable to shareholders was 14 million yuan, a reduction in loss by 46% year-on-year [1] - The gross margin was 34.81%, down by 4 percentage points year-on-year, while the net margin improved to -2.39%, narrowing by 2 percentage points year-on-year [1] Business Segment Performance - **Visual Measurement Equipment**: Revenue reached 226 million yuan, up 73% year-on-year, with a gross margin of 48.74%, down 7 percentage points [2] - **Visual Inspection Equipment**: Revenue fell to 65 million yuan, down 71% year-on-year, with a gross margin of 30%, down 9 percentage points, primarily due to the ongoing downturn in the photovoltaic sector [2] - **Visual Process Equipment**: Revenue was 241 million yuan, an increase of 52% year-on-year, with a gross margin of 24.55%, down 6 percentage points [2] - **Intelligent Connected Solutions**: Revenue was 65 million yuan, up 124% year-on-year, with a gross margin of 29.19%, an increase of 19 percentage points [3] Future Outlook - The company is projected to achieve revenues of 1.897 billion yuan, 2.249 billion yuan, and 2.426 billion yuan for the years 2025 to 2027, with net profits of 164 million yuan, 218 million yuan, and 253 million yuan respectively [3] - The company is expected to benefit from significant domestic replacement opportunities in PCB and wafer inspection equipment, as well as advancements in intelligent driving control and humanoid robot brain products [3]

Investment Rating - The investment rating for the company is "Accumulate" (maintained) [2] Core Views - The company achieved a revenue of 597 million yuan in the first half of 2025, representing a year-on-year increase of 10.32%, while the net profit attributable to shareholders was a loss of 14 million yuan, a reduction in loss by 12 million yuan [8] - The second quarter performance met expectations, with revenue of 378 million yuan, up 8.76% year-on-year, and a net profit of 18 million yuan, up 54.07% year-on-year [8] - The company has seen progress across multiple sectors, including PCB, semiconductor, and controllers, despite challenges in the photovoltaic sector [8] - The forecast for revenue from 2025 to 2027 is 1.817 billion yuan, 2.070 billion yuan, and 2.286 billion yuan respectively, with net profits of 178 million yuan, 234 million yuan, and 258 million yuan [8] Financial Performance Summary - Revenue for 2023 is projected at 1,648 million yuan, with a growth rate of 3.7%, while 2024 is expected to see a slight decline of 2.4% [7] - The net profit for 2023 is estimated at 215 million yuan, with a significant growth rate of 41.5% [7] - Earnings per share (EPS) for 2025 is projected to be 0.92 yuan, with a price-to-earnings (PE) ratio of 55.8 [7] - The return on equity (ROE) is expected to be 8.9% in 2025, increasing to 12.2% by 2027 [7] Market Performance - The company's stock has shown a performance of -8% over the last 12 months, compared to a 14% increase in the CSI 300 index [4]