Core Viewpoint - The semiconductor advanced packaging and testing industry is experiencing rapid expansion, presenting potential investment opportunities despite recent market corrections [1]. Industry Overview - The global semiconductor packaging and testing market is projected to grow from $101.47 billion in 2024 to $134.90 billion by 2029, with advanced packaging's market share increasing from 40% to 50% [1]. - The fastest-growing technology segment is multi-chip integrated packaging, with an expected compound annual growth rate (CAGR) of 25.8% [1]. - The explosive growth of the digital economy and artificial intelligence is identified as a key growth driver for the advanced packaging sector, with global computing power anticipated to rise from 2,207 EFLOps in 2024 to 14,130 EFLOps by 2029 [1]. Market Dynamics - In the consumer electronics sector, the accelerated penetration of high-end and AI smartphones is driving demand for advanced packaging technologies such as WLCSP and FO [1]. - China's semiconductor industry still has a low self-sufficiency rate, indicating significant potential for domestic substitution [1]. ETF Insights - The Cathay Consumer Electronics ETF (561310) tracks the consumer electronics index (931494), which includes companies involved in the design, manufacturing, and sales of consumer electronics products [1]. - The index reflects the overall performance of publicly listed companies in the consumer electronics sector, characterized by high growth potential and volatility [1].

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has recently received acceptance for its IPO application on the Sci-Tech Innovation Board, planning to raise 4.8 billion yuan for projects related to three-dimensional multi-chip integration packaging and ultra-high-density interconnection projects, despite facing multiple regulatory inquiries regarding fundraising necessity, customer concentration, technological leadership, and supply chain security [1][2][14]. Financial Performance - The company's revenue has shown significant growth from 1.633 billion yuan in 2022 to 3.038 billion yuan in 2023, with projections of 4.705 billion yuan in 2024 and 3.178 billion yuan in the first half of 2025 [1]. - The multi-chip integration packaging business has become a core revenue pillar, with its revenue share rising to 56.24% in the first half of 2024 [1]. Capacity Utilization and Fundraising Concerns - The company has faced scrutiny over its low capacity utilization rates, which have not reached 80% across various business lines, with the multi-chip integration packaging utilization at only 57.62% in 2024 [2][14]. - Regulatory inquiries focus on the rationale behind raising 4.8 billion yuan for expansion when current capacity is underutilized, questioning the company's ability to absorb new capacity [14]. Customer Concentration Risks - Customer concentration has increased significantly, with sales to the top five customers rising from 72.83% in 2022 to 90.87% in the first half of 2025, with the largest customer accounting for 74.40% of sales [3][4]. - The company acknowledges that high customer concentration aligns with industry characteristics but recognizes the associated risks [5]. Supply Chain and Technological Concerns - The company relies on imported key equipment, raising supply chain risk concerns, especially in the context of potential trade barriers [19]. - Regulatory bodies have questioned the company's claims of "international leading" technology, requiring quantitative data to substantiate its competitive advantages [11][19]. Business Composition and Revenue Sources - The company provides customized services for high-performance computing chips and smartphone application processors, with applications spanning high-performance computing, artificial intelligence, data centers, and automotive electronics [1]. - The revenue from the multi-chip integration packaging business has been particularly strong, benefiting from the growth in domestic smartphone shipments and the demand for high-performance computing chips [6].

Group 1 - The core viewpoint of the article emphasizes the transition of the integrated circuit industry from traditional transistor scaling to system-level integration and architecture innovation, particularly highlighting the importance of advanced packaging and testing in enhancing chip performance and optimizing system power consumption [2][4][9]. Group 2 - The integrated circuit manufacturing industry consists of three main segments: chip design, wafer manufacturing, and packaging testing, with packaging testing further divided into packaging and testing processes [4][6]. - Advanced packaging is a critical aspect of modern integrated circuit manufacturing, focusing on enhancing functionality density and system-level optimization, distinguishing itself from traditional packaging methods [9][11]. Group 3 - The global integrated circuit packaging and testing industry has shifted from its early development in Europe and the United States to emerging markets in Asia, with Taiwan, mainland China, and the United States forming a triad in the current market landscape [14][16]. - The market size of the global integrated circuit packaging and testing industry is projected to grow from $55.46 billion in 2019 to $101.47 billion in 2024, with a compound annual growth rate (CAGR) of 12.8% [16]. - The advanced packaging market is expected to grow at a CAGR of 10.6% from 2024 to 2029, significantly outpacing the traditional packaging market's 2.1% CAGR [17]. Group 4 - In mainland China, major players in the integrated circuit packaging and testing industry include Longsys Technology, Tongfu Microelectronics, and Huatian Technology, with a market size projected to grow from ¥234.98 billion in 2019 to ¥331.90 billion in 2024, reflecting a CAGR of 7.2% [20][22]. - The advanced packaging market in mainland China is expected to grow at a CAGR of 14.4% from 2024 to 2029, with its market share reaching 22.9% by 2029 [22]. Group 5 - The global advanced packaging industry includes participants from both wafer manufacturing and packaging backgrounds, with significant growth driven by the demand for high-performance computing applications such as artificial intelligence and data centers [24][25]. - The market for Flip Chip (FC) packaging is projected to grow from $18.75 billion in 2019 to $26.97 billion in 2024, with a CAGR of 7.5% [28]. - Chiplet integration packaging is identified as a key growth area, with its market size expected to increase from $2.49 billion in 2019 to $8.18 billion in 2024, reflecting a remarkable CAGR of 26.9% [29]. Group 6 - The advanced packaging technology is widely applied across various sectors, including consumer electronics, mobile communications, and high-performance computing, with significant growth driven by the demand for advanced packaging in smartphones and AI applications [34][42]. - The global computing power is expected to grow from 309.0 EFlops in 2019 to 2,207.0 EFlops in 2024, with a CAGR of 48.2% [36]. Group 7 - The article outlines several trends in the integrated circuit advanced packaging and testing industry, including the acceleration of domestic substitution, the rise of chiplet integration packaging, and the increasing importance of industry chain collaboration [48][50][51]. - The value of advanced packaging is expected to continue rising, driven by the shift towards high-performance applications in AI and data centers [52].

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications and high-performance computing [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a remarkable rate of 20.9% over the next five years, becoming a key driver for overall market growth [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is projected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is expected to increase rapidly due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets, along with the continuous application of advanced packaging technology, is expected to sustain healthy growth in the coming years [15]. - The integration of AI applications in various sectors, including automotive and consumer electronics, is driving the demand for advanced packaging solutions [30]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei are highlighted as key players benefiting from the local supply chain advantages in the advanced packaging sector [5]. - Significant investments in packaging projects are underway, with total planned investments amounting to approximately $100 billion [29]. - The ongoing demand for advanced packaging solutions is expected to lead to sustained revenue growth for companies involved in this sector [30].

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a CAGR of 20.9% over the next five years, becoming a key driver for market expansion [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is expected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is rapidly increasing due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets and the ongoing application of advanced packaging technology are expected to sustain healthy growth in the coming years [15]. - AI applications are driving long-term growth in semiconductor revenues, with the AI-related semiconductor market projected to grow at a CAGR of 28.9% from 2024 to 2033 [27]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei Company are recommended for investment due to their breakthroughs in niche areas of the domestic equipment market [5]. - Major packaging projects are underway or planned, with total investments amounting to approximately $100 billion [29].