Group 1 - The article emphasizes the importance of revitalizing the domestic semiconductor industry in the context of an information-explosive era [1] - It suggests that in a fragmented information age, individuals need to focus on efficient ways to acquire high-quality information [1] - The article recommends that semiconductor professionals should follow five specific public accounts to stay updated [1] Group 2 - The recommended public accounts include "Semiconductor Technology World," which focuses on industry technology and expert insights [3] - Another highlighted account is "Global Electronic Market," which has garnered attention from 500,000 industry professionals [5] - The article also mentions "Semiconductor Industry Circle" and "Semiconductor Industry Alliance" as valuable resources for industry networking and information sharing [7][9] Group 3 - The article promotes a WeChat group with 80,000 members, emphasizing that all groups are free to join [12] - It outlines the steps to join the group, which include scanning a QR code and responding with "join group" in the public account [13][15]

Core Viewpoint - The article emphasizes the growth and potential of China's semiconductor industry, particularly focusing on Yangtze Memory Technologies Co., Ltd. (YMTC) and its expansion plans in the memory chip sector [2][4]. Group 1: Company Overview - Yangtze Memory Technologies Co., Ltd. (YMTC) was established in July 2016 and is a leading manufacturer in China's storage chip sector, providing 3D NAND flash wafers, embedded storage chips, and solid-state drives (SSDs) for both consumer and enterprise markets [4]. - The company has seen significant capital investments, with its second phase company established in December 2021 having a registered capital of 60 billion yuan, and the third phase project initiated in September 2025 with a registered capital of 20.72 billion yuan [4]. Group 2: Market Position and Future Prospects - According to industry reports, YMTC is expected to capture approximately 7% to 8% of global production capacity by 2025, with the potential to exceed 10% by 2026, positioning it to surpass Micron Technology and become the fourth-largest memory chip manufacturer globally [4]. - The third phase project is part of a broader initiative to create a world-class integrated industry base around YMTC, aiming to enhance collaboration across demand, design, technology routes, and supply chains [4][5]. Group 3: Industry Context - The global storage industry is entering a high-growth cycle, with leading overseas manufacturers shifting advanced production capacity towards high-margin products, thereby creating more market space for domestic mature process storage products [5].

半导体论坛 振兴国产半导体产业！ 信息爆 炸的时代 更需要断舍离 如何更加高效的获取高质量的信息 国芯网 ID：CSF211ic 在碎片化的时代里 收获满满？ 2026年，半导体人只需关注5个公众号 半导体技术天地 ID：ic2018ic ▲长按二维码"识别"关注 专注半导体产业技术，技术资料，专家讲解。欢迎关注! ↓↓↓值得您的关注↓↓↓ ▲长按二维码"识别"关注 半导体行业第一的微信公众平台，50万的从业人员都已关注！ ↓↓↓值得您的关注↓↓↓ 全球电子市场 ID：xinlun99 ▲长按二维码"识别"关注 芯媒评论，请关注！ ↓↓↓值得您的关注↓↓↓ 半导体行业圈 ▲长按二维码"识别"关注 半导体全产业链联盟，请关注！ ***************END************** * ID：ic211ic ▲长按二维码"识别"关注 半导体行业圈，半导体人自己的圈子，请关注！ ↓↓↓值得您的关注↓↓↓ 半导体产业联盟 ID：icchinaunion 投稿 或 商务合作 请 联系 iccountry 半导体论坛微信群 8万人在群，所有微信群免费开放！ 加群步骤： 第一步：扫描下方二维码，关注中国半导体论 ...

Group 1 - TSMC has decided to adjust its advanced packaging capacity planning for CoWoS 2.5D heterogeneous integration technology, increasing its production targets for 2026-2027 [2] - The primary reason for TSMC's adjustment is the strong demand for high-end AI chips, particularly from its largest customer, NVIDIA, and the accelerating growth of AI ASIC production [4] - TSMC plans to add two new advanced packaging facilities focused on CoWoS technology at its AP8 plant in the southern science park, while also converting existing facilities originally intended for SoIC processes to CoWoS production [4] Group 2 - Media reports indicate that MediaTek, which recently entered the AI ASIC design service market, is increasing its orders with TSMC due to insufficient CoWoS capacity to meet customer demand [4] - The mass production timeline for panel-level CoPoS packaging has been postponed to 2029 [4] - TSMC is also considering building a new advanced packaging facility in Yunlin, and plans to double the number of advanced packaging facilities at its Arizona subsidiary from two to four [4]

半导体论坛 振兴国产半导体产业！ 信息爆 炸的时代 如何更加高效的获取高质量的信息 在碎片化的时代里 收获满满？ 2026年，半导体人只需关注5个公众号 半导体技术天地 ID：ic2018ic ▲长按二维码"识别"关注 专注半导体产业技术，技术资料，专家讲解。欢迎关注! ↓↓↓值得您的关注↓↓↓ 国芯网 更需要断舍离 ID：CSF211ic ▲长按二维码"识别"关注 半导体行业第一的微信公众平台，50万的从业人员都已关注！ ↓↓↓值得您的关注↓↓↓ 全球电子市场 ID：xinlun99 ▲长按二维码"识别"关注 芯媒评论，请关注！ ↓↓↓值得您的关注↓↓↓ 半导体行业圈 ID：ic211ic ▲长按二维码"识别"关注 半导体行业圈，半导体人自己的圈子，请关注！ ↓↓↓值得您的关注↓↓↓ 半导体产业联盟 ID：icchinaunion ▲长按二维码"识别"关注 半导体全产业链联盟，请关注！ ***************END************** * 半导体论坛微信群 8万人在群，所有微信群免费开放！ 加群步骤： 第一步：扫描下方二维码，关注中国半导体论坛微信公众号。 第二步：在公众号里面回复"加群"， ...

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ ***************END*************** 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 2月3日消息，美国地方法院做出正式裁决，驳回了韩国三星电子对中国通信设备厂商中兴通讯发起的公 平、合理且非歧视的许可合同诉讼及反垄断诉讼，这为中兴通讯在与三星电子后续FRAND条款谈判及诉 讼带来更多优势。 在此之前，中兴通讯已经在英国、中国、巴西等地的与三星电子的相关诉讼中获得了初步胜利。 资料显示，三星电子和中兴通讯之间的纠纷源于双方在2021年签署的一项涵盖双方4G资产组合及早期SEP 的全球专利交叉许可协议。该协议于2023年底到期，但包含了不得在2024年12月31日前提起诉讼的契约。 根据续约的预期条款，三星电子将成为净支付方。也就是说，在两家公司专利组合价值相互抵消后，三星 电子将向中兴通讯支付更高的专利权使用费。 但是，在协议到期后的续约谈判期间，双方在续约谈判中就FRAND许可费率产生了严重分歧。 争议的核 心在于许可费率——作为5G标准的主要贡献者之一，中兴通讯手握超过6500族5G标准必要专利，认为其 专利组合 ...

Core Viewpoint - Elon Musk's SpaceX has acquired its AI startup xAI, integrating advanced rocket and satellite technology with AI capabilities, marking a significant step in Musk's dual ambitions of artificial intelligence and space exploration [2][4]. Group 1: Acquisition Details - The merger is expected to create a new entity valued at approximately $1.25 trillion, with stock priced around $527 per share [2]. - The acquisition is set to be completed through a stock exchange, where xAI shares will convert to 0.1433 shares of SpaceX [6]. - Employees of xAI have the option to cash out by selling their shares back to the company [6]. Group 2: Strategic Implications - Musk aims to create an innovative engine for both Earth and space through this acquisition, enhancing SpaceX's capabilities [4]. - SpaceX operates a fleet of reusable rockets and has developed a crewed spacecraft capable of sending astronauts into orbit, alongside the Starlink project providing broadband internet globally [4]. Group 3: Ownership Structure - Prior to the acquisition, Musk controlled both SpaceX and xAI, holding approximately 42% of SpaceX's shares and 80% of its voting rights [7].

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 2月3日消息， 寒武纪股价在今日早盘遭遇大幅下挫，跌幅一度扩大至13.38%；截至午市收盘，公司股价报1082.09元，跌幅收窄至 12.88%，单日市值蒸发近700亿元。 2月3日中午，"寒武纪科技"微信公众号发布"严正声明"称，公司关注到今日网络传播的关于公司近期组织小范围交流等信息为不实信息， 公司近期从未组织任何小范围交流，没有出具过任何年度、季度营业收入指引数据，相关信息请以公司公开披露的信息为准。公司目前研 发进展顺利，经营稳步推进。 值得注意的是，就在此次股价大跌前，寒武纪刚发布亮眼的业绩预告。 在此，公司提醒广大投资者，公司相关事项均以公开披露信息为准，请各位投资者提高信息辨别能力，不传播、不采信来源不明或未经核 实的虚假信息。此外，对于任何捏造、散布传播不实信息的行为，公司将保留追究相关人员法律责任的权利。 针对市场对股价大跌的关切，寒武纪方面公开回应表示，暂不清楚此次股价大跌的具体原因。有市场分析认为，公司估值高企，叠加市场 对AI芯片行业竞争加剧的担忧，或是引发资金出逃的主要原 ...

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ ***************END*************** 半导体公众号推荐 半导体论坛百万微信群 2月3日消息，在全球存储芯片供应严重短缺的背景下，中国两大存储巨头正加速扩张以抢占市场先机。 据日经亚洲报道，中国两大头部存储芯片制造商，长鑫存储与长江存储已启动史上最大规模扩产计划， 力图缩小与三星、SK海力士等国际龙头的差距。 报道称，作为中国最大DRAM厂商，长鑫存储正在上海建设新工厂，新增产能将达其合肥总部基地的两 至三倍。 该厂计划于2026年下半年启动设备安装，2027年正式投产，产品覆盖服务器、PC、汽车电子等领域， 同时，公司还在上海扩建HBM生产线，瞄准AI算力需求。 有知情人士表示，长鑫存储在合肥、北京的两处工厂已处于满负荷运转状态，"本土企业需求极为旺 盛，公司希望尽快扩大产能。" 至于中国头部NAND厂商长江存储也在武汉建设第三座工厂，计划于2027年投产。 据透露，长江存储已明确新厂产能规划，除生产NAND外，50%产能将用于DRAM制造；同时还将与本 土存储封装企业 ...

国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 2月2日消息，据外媒日报道，苹果正在考虑将部分低端处理器的产能从台积电转移至其他供应商，报道没有提及任何候选的公司名称。 报告指出，受人工智能（AI）热潮的影响，一方面，OpenAI、谷歌、Meta 和微软等公司正在基础设施上持续增加投入，导致 DRAM 和 NAND 内存的供 应紧张；另一方面，英伟达已经超越苹果，成为了台积电的最大客户。 若《华尔街日报》的消息落地，这将是苹果首次打破 12 年来一直以台积电为独家芯片供应商的商业传统。 ***************END*************** 半导体公众号推荐 半导体论坛百万微信群 加群步骤： 第一步：扫描下方二维码，关注国芯网微信公众号。 第二步：在公众号里面回复"加群"，按照提示操作即可。 AI 行业的需求正在重塑半导体行业的等级秩序，同时削弱了苹果对供应商的议价权。据《华尔街日报》的供应链消息人士称，三星和 SK 海力士都获得 了足够的议价能力，要求苹果为 RAM 芯片支付更高的价格。在成本压力的作用下，苹果开始首先为低端处理器寻 ...