Core Viewpoint - The article highlights the significant growth and advancements in the semiconductor photoresist industry, showcasing various companies' performance and R&D capabilities in this sector. Group 1: Business Performance - Tongcheng New Materials achieved a 50.43% year-on-year increase in semiconductor photoresist revenue for 2024, with ArF photoresist passing customer validation and generating revenue [1] - Aisen Semiconductor reported a 37.68% year-on-year growth in photoresist and supporting reagent revenue for 2024, with significant market penetration in advanced packaging negative photoresist [2] - Shanghai Xinyang's photoresist products saw an overall revenue increase of over 100% year-on-year, with multiple KrF photoresists achieving bulk sales [4] - Nanda Optoelectronics experienced a breakthrough of over 80% year-on-year growth in photoresist business, with several ArF products validated by customers [6] - Jingrui Electric Materials reported a nearly 30% year-on-year growth in photoresist business for 2024, maintaining a strong market position with its UV wide-spectrum photoresists [5] Group 2: R&D Capabilities - Tongcheng New Materials has nearly 50 semiconductor photoresist R&D projects, with half validated by users and some entering small-scale production [2] - Aisen Semiconductor is advancing its PSPI photoresist product certifications and has formed an expert team for KrF photoresist development [3] - Shanghai Xinyang is enhancing its R&D and industrialization of high-end photoresists for integrated circuit manufacturing, focusing on 3D NAND, DRAM, and logic advanced processes [5] - Nanda Optoelectronics is developing high-resolution photoresists for 300mm wafers below 90nm and aims to establish a proprietary patent system [6] - Jingrui Electric Materials is collaborating with Sinopec Group on ArF high-end photoresists and has multiple R&D projects underway for various photoresist applications [7] Group 3: Industry Events - The 2025 TrendBank (Fifth) Lithography Industry Conference will be held on July 9-10 in Hefei, aiming to gather experts, scholars, and industry representatives to discuss advancements and challenges in lithography technology and materials [9]

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities and self-sufficiency in the semiconductor industry [20][22][23]. Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [11][12]. - It will feature over 20 speakers from the lithography industry, covering various topics related to advanced lithography technologies and materials [10][12]. Key Topics - Discussions will include the latest research and application prospects of cutting-edge lithography technologies such as EUV, electron beam lithography, and nanoimprint lithography [9][20]. - The conference will also analyze the current state and technological bottlenecks of lithography materials, including photoresists and wet electronic chemicals, and explore solutions for improving domestic production and quality [9][20][22]. Industry Challenges - The domestic lithography industry faces significant challenges, including low self-sufficiency rates for high-end photoresists and reliance on imports for certain high-purity electronic chemicals and mask materials [20][22]. - The high-precision manufacturing technology for masks is difficult, and the rapid repair and update technologies need improvement [20]. Strategic Importance - The conference aims to foster collaboration among experts, scholars, and industry representatives to enhance the integration of production, learning, and research, thereby accelerating technological innovation and the transformation of results [22]. - It seeks to build a communication bridge for upstream and downstream enterprises in the industry chain, promoting resource integration and competitive advantages [22].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities and self-sufficiency in the semiconductor industry [12][21]. Conference Overview - The conference will take place on July 9-10, 2025, in Hefei, Anhui, at the Sheraton Hotel [16][20]. - It will feature over 20 industry experts discussing advanced lithography technologies, including EUV, electron beam lithography, and nanoimprint techniques [13][12]. - The agenda includes sessions on lithography materials, chemical products, and equipment, emphasizing the need for domestic production and innovation [12][21]. Keynote Speakers and Topics - Li Jiarong, General Manager of Hangzhou Zhongtai Hydrogen Energy Technology Co., will present on "Application of Lithography Gases and Development of China's Rare Gas Industry" [6][11]. - Other notable speakers include representatives from BOE Technology Group and Nankai University, discussing various aspects of lithography technology and materials [9][10]. Industry Challenges - The domestic lithography industry faces significant challenges, including low self-sufficiency in high-end photoresists and reliance on imports for critical materials and equipment [20][21]. - The conference aims to foster collaboration between academia and industry to address these challenges and promote technological innovation [21][12]. Registration and Participation - Registration fees are set at RMB 2600 before June 30 and RMB 2800 thereafter, which includes conference materials, meals, and a gala dinner [17][16]. - The conference is expected to attract around 300 participants, providing a platform for networking and resource integration within the lithography supply chain [16][21].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities in the semiconductor industry [19][20]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [14][19]. - The event will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, and equipment [12][20]. - The agenda includes discussions on cutting-edge lithography techniques such as EUV, electron beam lithography, and nanoimprint lithography, as well as the current state and challenges of domestic photoresist production [11][19]. Group 2: Key Topics and Challenges - The conference will explore the low self-sufficiency rate of high-end photoresists in China and the technological gaps compared to international standards [19][20]. - It will address the reliance on imports for high-purity electronic chemicals and the challenges in the precision manufacturing of photomasks [19][20]. - The event aims to foster collaboration between academia, research institutions, and industry to enhance innovation and the domestic supply chain in lithography technology [20]. Group 3: Featured Speakers and Sessions - Notable speakers include Zhang Wali, who will present on the application and challenges of hybrid bonding in advanced packaging [7][11]. - Other sessions will cover topics such as the development of new photoresist materials and the application mechanisms of wet electronic chemicals [8][11]. - The conference will also feature a roundtable discussion on the current state and future trends of the mask and lithography equipment industry [9][11]. Group 4: Industry Context - The lithography technology is critical for semiconductor manufacturing, directly impacting chip performance, integration, and production costs [19]. - The conference aims to strengthen the self-sufficiency of the lithography industry in China amid increasing geopolitical tensions affecting the semiconductor supply chain [20]. - The event will serve as a platform for resource integration and collaboration among upstream and downstream enterprises in the lithography supply chain [20].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities and self-sufficiency in the semiconductor industry [21][22]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui, with an expected attendance of 300 participants [15][21]. - The agenda includes discussions on advanced lithography technologies, the current state of lithography materials, and the challenges faced in domestic production [13][22]. - Keynote speakers and industry experts will present on various topics, including the latest research in extreme ultraviolet lithography (EUV) and the domestic production of photoresists and wet electronic chemicals [10][14]. Group 2: Industry Challenges - The domestic high-end photoresist supply rate is low, and the technology lags behind international standards, affecting the performance and quality required for advanced chip manufacturing [21][22]. - The reliance on imports for high-purity and specialized wet electronic chemicals poses a supply risk, while the manufacturing of high-precision masks remains a significant challenge [21][22]. - The lithography equipment market is dominated by foreign companies, with domestic manufacturers facing substantial technological and precision gaps [21][22]. Group 3: Company Profile - Jiangsu Jicui Photo-sensitive Electronic Materials Research Institute, established in June 2021, focuses on the R&D and industrialization of photoresist raw materials and related technologies [7][8]. - The company has achieved recognition as a high-tech enterprise and is a member of the "Integrated Circuit Photoresist Industry Innovation Alliance" [8]. - The company has successfully developed several KrF photoresist resins that have passed customer testing and are in small-scale production [8]. Group 4: Conference Highlights - The conference will feature over 20 speakers from the lithography industry, providing insights and fostering interaction across the supply chain [14]. - Three main sessions will cover advanced lithography technologies, photoresists and wet electronic chemicals, and mask and lithography equipment, offering a comprehensive view of the industry [14]. - The event aims to facilitate collaboration between academia, research institutions, and industry players to enhance innovation and technology transfer [22].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 7月9日-10日，2025势银（第五届）光刻产业大会（安徽合肥） 点此报名 添加文末微信，加 光刻胶 群 在半导体芯片集成高密化和线路精细化上，光刻与刻蚀承担着重要的工艺角色，尤其是在半导体前 道制程中，光刻机与刻蚀机分辨率很大程度上决定了集成电路精细化发展水平。在这里我们重点阐 述光刻产业话题。 | 制程 | 晶圆尺寸 | 金属材料 | 光刻机类型 | | --- | --- | --- | --- | | 0.5µm | 200mm | Al | g-line:436nm | | 0.35µm | 200mm | Al | i-line:365nm | | 0.25µm | 200mm | Al | KrF:248nm(stepper) | | 0.18/0.15µm | 200mm | Al | KrF:248(stepper&scanner) | | 0.13µm | 200/300mm | Al/Cu | ArF: ...

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, focusing on enhancing domestic capabilities and self-sufficiency in the semiconductor industry [21][22][23]. Conference Overview - The conference will take place on July 9-10, 2025, in Hefei, Anhui, at the Sheraton Hotel [14][20]. - It will feature over 20 industry experts discussing advanced lithography technologies, including EUV, electron beam lithography, and nanoimprint techniques [16]. - The event will cover the current state of domestic lithography materials, including photoresists and wet electronic chemicals, and explore the challenges in achieving higher self-sufficiency and quality [15][21]. Keynote Speakers and Topics - Professor Luo Feng from Nankai University will present on "Low-cost multi-scenario application potential of nanoimprint/electron beam/DSA technology direction" [11][12]. - Other notable speakers include representatives from leading companies such as BOE Technology Group and Ningbo Tianxuan New Materials Technology Co., discussing various aspects of lithography technology and materials [11][12]. Industry Challenges - The domestic high-end photoresist supply rate is low, and there is a significant gap in R&D and production technology compared to international standards [21]. - The reliance on imports for high-purity and specialty wet electronic chemicals poses a supply risk [21]. - The high-precision manufacturing of masks and the dominance of foreign companies in high-end lithography machines, such as EUV lithography machines, are critical bottlenecks for the domestic semiconductor industry [21]. Strategic Importance - The conference aims to foster collaboration among academia, research institutions, and industry players to accelerate technological innovation and enhance the competitiveness of the lithography industry [22]. - It will serve as a platform for resource integration and synergy among upstream and downstream enterprises in the lithography supply chain [22].

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference will be held on July 9-10, 2025, in Hefei, focusing on advancements in lithography technology and materials, as well as challenges in the domestic supply chain [2][21]. Summary by Sections Conference Overview - The conference will feature over 20 speakers from various sectors of the lithography industry, including academia and enterprises, discussing advanced lithography technologies and materials [13][21]. - The event aims to enhance collaboration between research institutions, universities, and enterprises to accelerate technological innovation and promote the upgrading of the lithography industry [21][22]. Participating Organizations - Notable participants include: - BOE Technology Group: A leading global semiconductor display product company [3]. - Jiageng Laboratory: Focused on high-end lithography materials and semiconductor cleaning materials [3]. - Bomi Technology: Engaged in the development of photosensitive polyimide and related semiconductor materials [3]. - Xingtai Technology: Specializes in the research and production of high-end lithography resins [3]. - Other participants include universities and research institutes such as Nankai University and Shanghai Institute of Measurement and Testing Technology [3][4]. Conference Agenda - The agenda includes discussions on: - EUV lithography, electron beam lithography, and nanoimprint technologies [12]. - The current state and challenges of domestic lithography materials, including photoresists and wet electronic chemicals [12]. - Key issues in the domestic production of lithography equipment and solutions to enhance self-sufficiency [12]. Key Highlights - The conference will feature three specialized sessions covering advanced lithography technologies, photoresists and wet electronic chemicals, and lithography equipment, providing a comprehensive view of the industry [13][21]. - Academic discussions will be held to establish a theoretical foundation for industry development [14]. Registration and Fees - Registration fees are set at RMB 2600 if paid by June 30, 2025, and RMB 2800 thereafter, which includes access to conference materials and meals [16][15]. Background and Industry Context - The lithography technology is crucial for semiconductor manufacturing, impacting chip performance and production costs [20]. - The domestic lithography industry faces challenges such as low self-sufficiency in high-end photoresists and reliance on imports for critical materials and equipment [20][21].

Core Viewpoint - The article emphasizes the significance of the 3Sheng Integration Platform developed by Silicon Chip Technology for the design and testing of 2.5D/3D stacked chips, highlighting its innovative features and capabilities in enhancing reliability and performance in chip systems [3][34]. Group 1: 3Sheng Integration Platform - The 3Sheng Integration Platform integrates system-level planning, physical implementation, analysis, testability, and reliability design for 3D stacked chips, supporting agile development and customizable collaborative design optimization [3][34]. - The platform features a unified data foundation and combines five engines: system, test, synthesis, simulation, and verification, showcasing originality in multiple functionalities and performance [3]. Group 2: Importance of DFT in Stacked Chips - Design for Testability (DFT) is crucial in stacked chip systems due to the unique interconnect testing requirements arising from multiple chiplets, necessitating specific testing before and after interconnection [6][10]. - The interconnect interfaces in stacked chips introduce new testing demands, including compatibility, connectivity integrity, and defect detection, which are not present in conventional chips [10][12]. Group 3: Testing Processes and DFT Requirements - The testing process for stacked chips includes pre-bond, mid-bond, post-bond, and final tests, with the accuracy and completeness of these tests being vital for product quality and cost-effectiveness [13][15]. - DFT plays a significant role in ensuring testability, controllability, and self-repair capabilities within the stacked chip systems, addressing various reliability concerns [15][16]. Group 4: Cross-Die Testing Solutions - The SiChip DFT technology offers a mixed testing solution that includes scan chains, boundary scan, built-in self-test (BIST), and diagnostic channels, adhering to various IEEE standards [17][19]. - The architecture design phase must consider DFT testing access mechanisms to ensure compatibility and universality across different manufacturers' dies [19][20]. Group 5: Diagnostic Testing and Functional Simulation - The 3Sheng Ocean EDA testing solution integrates fault diagnosis, functional simulation, and adaptive repair technologies, covering wafer-level circuit testing and final functional testing [25][27]. - The solution aims to optimize testing resources and reduce testing time while enhancing fault coverage, achieving a 50% reduction in testing costs and a 99.99% fault coverage rate [27]. Group 6: Fault Tolerance Design - The SiChip EDA DFT solution supports comprehensive redundancy and fault tolerance, utilizing eFPGA technology to create a full-process redundancy solution from top-level planning to physical implementation [29][31]. - The design allows for dynamic routing and protocol conversion, enhancing interconnect channel utilization and addressing thermal coupling and signal interference issues [31].

Core Viewpoint - The article discusses the current state and future potential of the mask and blank mask industry in China, particularly in the semiconductor and display panel sectors, highlighting the gaps in technology and production capabilities compared to international players [2][3][4]. Industry Overview - The mask plays a crucial role in the production of semiconductors and display panels, with domestic companies primarily focusing on 8.5 generation lines and below, lacking capabilities for high-generation and high-precision masks [2]. - In the semiconductor sector, while some domestic manufacturers can produce masks for 90nm and above processes, only a few can develop products for 65nm and 55nm nodes, indicating significant room for localization in the market for masks below 90nm [2]. Key Players and Product Layout - Major players in the mask industry include: - Qingyi Optoelectronics, which has achieved mass production of 180nm node masks and is developing 130nm-65nm node products [3]. - Huazhong Dishi Microelectronics, aiming for 90nm mass production in 2024 and 40nm by 2025 [4]. - Other notable companies include Longtu Photomask, Jinan Quanyi, and Shanghai Toppan, each focusing on various segments of the mask market [4][5]. Upcoming Events - The 2025 TrendBank (Fifth) Lithography Materials Industry Conference will be held from July 8 to 10 in Hefei, focusing on new applications, trends, and the supply chain in the lithography materials sector [8].