Core Viewpoint - The article highlights the upcoming Bay Area Semiconductor Industry Ecosystem Expo (Bay Chip Expo 2025), emphasizing its role in showcasing the entire semiconductor industry chain and facilitating international collaboration in technology and innovation [2][11][17]. Group 1: Event Overview - The Bay Chip Expo 2025 will take place from October 15-17 at the Shenzhen Convention Center, covering an exhibition area of 60,000 square meters and featuring over 600 semiconductor companies [2][5]. - The expo aims to integrate the semiconductor industry chain, focusing on wafer manufacturing as a core link, and will present cutting-edge technologies and solutions from IC design to packaging and testing [5][9]. Group 2: Industry Collaboration - The expo will feature a significant international presence, with the number of international exhibitors increasing by over 50% compared to previous years, showcasing the event's growing global appeal [11][13]. - Domestic companies will have the opportunity to engage with international industry leaders, facilitating deep technical exchanges and accelerating the localization and innovation processes in key areas [14][16]. Group 3: Technological Focus - The wafer manufacturing exhibition area will be one of the largest, featuring top companies like ASML, AMAT, and Lam Research, which will demonstrate their strengths and innovations in wafer manufacturing [7][16]. - The event will cover a complete technology display matrix from "equipment - materials - manufacturing," promoting a shift from "single-point innovation" to "system collaboration" within the industry [9][10]. Group 4: Future Initiatives - TrendBank plans to host a heterogeneous integration annual meeting from November 17-19, 2025, focusing on advanced packaging technologies and aiming to establish Ningbo and the Yangtze River Delta as a hub for the advanced electronic information industry [25].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 8月29日，厦门恒坤新材料科技股份有限公司（以下简称"恒坤新材"）科创板IPO上会顺利通过。本次募集资金将投资于集成电路前驱体二期项 目、集成电路用先进材料项目。 恒坤新材对原计划用于"SiARC 开发与产业化项目"实施的场地用途进行了调整，因此"SiARC开发与产业化项目"不再作为募投项目，拟募资总额 降低至100,669.50万元。其中4亿元用于大连恒坤的前驱体二期项目，6.07亿元用于安徽恒坤的先进材料项目。 01 SOC和BARC占比自产光刻材料营收92.81% 报告期内，恒坤新材主营业务分为自产产品（含光刻材料、前驱体材料）和引进产品（含光刻材料、前驱体材料、电子特气和其他），自产产品中 光 刻材料近三年销售收入分别为 1.22亿元、1.72亿元和3亿元，整体保持逐年增长态势。其中SOC营收占比第一，20 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 在 AI存算芯片制程不断微缩，晶体管和互联密度翻倍增长，先进封装技术应运而生，三维异构集成技术成为提升芯片性能的一个重要方向。尽管 三维堆叠技术带来了算力密度提升，但同时也在增加功率密度，尤其是引入更多的垂直堆叠芯片和铜铜混合键合工艺，使得散热方案成为芯片封 装设计必须重点考虑的点。 本次会议紧密围绕多材料异质异构集成、光电融合等核心技术，聚焦三维异构集成、光电共封装、晶圆级键合、晶圆级光学、半导体材料与装备、 TGV（玻璃通孔）与 FOPLP（扇出型面板级封装）等前沿先进封装技术维度，邀请产业界与科研界专家学者，开展深度科研交流与产业话题分 享，推动技术创新与产业应用深度融合。 实现高效热扩散的最佳方案是沿垂直方向高效散热。对于三维异构存算芯片而言，如何将内部热点高效的向垂直上方或下方传导是现在需要解决 的难题。 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 近日，工业和信息化部与市场监督管理总局联合印发《电子信息制造业 2025 - 2026 年稳增长行动方案》。 《方案》明确提出，将大力支持人工智能、先进存储、三维异构集成芯片等前沿技术方向的基础研究，为我国电子信息制造业的持续创新发展注 入了强大动力。 以下为《方案》全文—— 电子信息制造业 2025-2026年稳增长行动方案 电子信息制造业是国民经济的战略性、基础性、先导性 产业,是稳定工业经济增长、维护国家政治经济安全的关键 领域。为全面贯彻落实党的二十大和二十届二中、三中全会 精神,深入贯彻中央经济工作会议精神,坚持稳中求进工作 总基调,把稳增长摆在首要位置,推动质的有效提升和量的 合理增长,努力实现工业经济发展主要预期目标,制定电子 信息制造业 2025-2026年稳增长行动方案。 一、总体要求 以习近平新 ...

Core Viewpoint - The article discusses the advancements in photonic chip technology as a promising solution to the challenges posed by the "post-Moore era" in semiconductor manufacturing, emphasizing the potential for significant improvements in computing power and energy efficiency [3][4][5]. Group 1: Industry Trends - The demand for enhanced intelligent computing capabilities is growing at an exponential rate, surpassing the performance improvements described by Moore's Law [2]. - The traditional electronic computing systems face significant challenges, including the "von Neumann bottleneck," slowing of Moore's Law, and the "power wall" [2]. Group 2: Photonic Chip Technology - Photonic chips utilize light as a carrier to replace electricity, offering higher bandwidth, greater parallelism, and lower energy consumption compared to electronic chips, which can lead to exponential increases in computing power [3]. - The Shanghai Jiao Tong University Wuxi Photonic Chip Research Institute (CHIPX) is a leader in the field, focusing on the development of high-end photonic chips and their industrial applications [4]. Group 3: Technological Advancements - CHIPX has established the first domestic pilot line for photonic chips, achieving low-loss and high-bandwidth performance in lithium niobate photonic chip production, with plans for large-scale production services by the end of the year [4][5]. - The research team at CHIPX has overcome technical bottlenecks in writing speeds, enabling ultra-high-density and large-capacity permanent storage using glass-based media [4]. Group 4: Future Vision - CHIPX aims to drive the fourth industrial revolution through advancements in photonic chips and quantum computing, aspiring to become a world-class center for the photonic industry [5]. - The institute has developed various advanced technologies, including DUV lithography and dry etching processes, to ensure complete control over the photonic chip manufacturing process [5]. Group 5: Industry Collaboration and Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference in November 2025, focusing on advanced packaging technologies and fostering collaboration between industry and academia [14]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced semiconductor materials and equipment [14].

Core Viewpoint - Heterogeneous integration is crucial for modern electronic devices, allowing for smaller, more powerful systems by combining various components into a single package without compromising performance [1][2][3]. Group 1: Importance of Heterogeneous Integration - Heterogeneous integration reduces the size of electronic devices while enhancing functionality by integrating multiple components into a single chip [2]. - It improves data speed and system throughput, which are essential for high-performance computing in AI and 5G systems [3]. - Optimizing individual functions lowers overall power consumption, minimizing power loss, which is vital for battery-powered consumer devices and data centers [4]. - Engineers can now combine specialized components like GaN and integrated photonics, adapting integration requirements for different use cases [5]. - Although initial setup is complex, advanced packaging technologies can reduce manufacturing and assembly costs in the long run [6]. Group 2: How Heterogeneous Integration Works - Each device (CPU, GPU, memory) is manufactured separately using the most suitable processes (e.g., CMOS, GaN), enhancing yield and allowing customization [8]. - Components are mounted on an intermediary layer (passive silicon or organic substrate) that connects chips electrically and mechanically while minimizing latency [9]. - Electrical interconnections between components use techniques like wire bonding, flip-chip, or TSV, ensuring high bandwidth and ultra-fast signal transmission [10]. - Thermal interface materials and signal shielding layers are added to manage heat and reduce interference, ensuring system-level reliability [11]. - The integrated unit is encapsulated in a protective package that meets environmental and mechanical requirements, forming a robust packaging or wafer-level packaging system [12]. Group 3: Key Components in Heterogeneous Integration - Logic and processing units, such as CPUs or SoCs, provide computational control built on advanced nodes for better performance and efficiency [13]. - Memory units like DRAM, SRAM, and HBM are packaged together for high-speed data access, reducing latency and enhancing system performance [14]. - Analog/RF chips manage signal transmission and reception in wireless communication modules, crucial for 5G, radar, and sensor applications [15]. - Integrated photonics is used in data centers and AI to transmit large amounts of data using light instead of electrical signals [16]. - Power management units ensure stable power delivery across devices while minimizing power consumption, especially in battery-operated systems [17]. Group 4: Common Materials Used in Heterogeneous Integration - Widely used semiconductor materials for digital logic and memory [18]. - Gallium Nitride (GaN) is utilized for high-speed power and RF components due to its excellent thermal and electrical properties [18]. - Traditional silicon is combined with photonic circuits for on-chip high-speed optical communication [20]. - Materials for intermediary layers and advanced packaging provide flexibility and lower costs [21]. - Key metals are used for wire bonding, micro-bumps, and interconnections, ensuring reliable electrical contact and heat dissipation [22]. Group 5: Heterogeneous Integration Methods and Challenges - 2.5D integration involves multiple chips mounted on a passive intermediary layer, providing high-density routing for applications like GPUs and AI accelerators [23]. - 3D integration uses TSV or micro-bumps for vertical stacking, minimizing signal delay and improving power efficiency, particularly in high-end processors [23]. - Fan-out wafer-level packaging (FO-WLP) embeds chips into a restructured wafer, allowing for slim designs in smartphones and wearables [23]. - Flip-chip bonding connects chips directly to substrates, offering better performance than traditional wire bonding [23]. - System-in-package (SiP) integrates multiple ICs into a single module, commonly used in consumer electronics like smartwatches and hearing aids [23]. - Challenges include aligning and bonding materials with different thermal and electrical properties, which can lead to stress and failures, as well as managing heat dissipation in densely packed high-power chips [24]. Group 6: Industries Adopting Heterogeneous Integration - The semiconductor industry is shifting towards advanced packaging and heterogeneous integration to overcome the limitations of Moore's Law and push performance boundaries [24]. - Consumer electronics, such as smartphones and AR/VR headsets, require high performance in compact spaces, benefiting from system-level packaging designs [24]. - Implantable and portable diagnostic tools demand minimal power, small size, and high reliability, all supported by heterogeneous integration [25]. - The automotive and electric vehicle sectors utilize multi-functional chip packaging for autonomous vehicles, integrating lidar, radar, AI, and sensors in harsh environments [26]. - Defense and aerospace industries require the integration of analog, RF, and digital logic components for secure, lightweight, and radiation-resistant systems, necessitating specialized expertise [27]. Group 7: Upcoming Events - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [28].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 来源：势银（TrendBank） （算力芯片方向，未收录MEMS、CIS等集成制造能力厂商） 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 国际地缘政治因素以及 AI算力芯片需求居高不下的背景下，中国将AI等数据中心用半导体发展上升到国家战略层面，中国地方政府积极响应到 2027年将逐步实现全面去美化。 例如：北京市指出，目标将力争到2027年把数据中心用半导体自给率提高到100%；上海市计划，到2027年，在面向AI等数据中心使用半导体方 面，中国自主控制比率将提高到70%以上；贵州市也要求正在建设、以AI为中心的数据中心，半导体要求约90%中国本土制造。 国产 AI用芯片机遇与挑战并存，所谓机遇是中国政府和本土客户AI用半导体需求旺盛，转至本土AI芯片订单比例提升；挑战是本土AI芯片产品竞 争力和可靠性相较于英伟达等国际大厂较差，本土半导体尖端制造供应链能 ...

Core Viewpoint - The article emphasizes the growing importance of chiplet integration technology and the shift towards advanced packaging techniques in the semiconductor industry, particularly in China, which holds a significant market share in bonding equipment demand [2][3]. Group 1: Industry Trends - Chiplet integration technology is becoming a strategic focus in semiconductor innovation, with the complexity of processes and equipment evolving alongside traditional scaling methods [2]. - The market for hybrid bonding is projected to grow at a compound annual growth rate (CAGR) of 13.4% over the next five years, with China accounting for 40% of the global demand for bonding equipment [2]. - The hybrid bonding market is expected to reach USD 397 million by 2030, highlighting its critical role in advanced three-dimensional heterogeneous integration technologies [2]. Group 2: Market Dynamics - The hybrid bonding equipment market is currently dominated by companies such as Besi, Applied Materials, and EVG, due to the limited demand and high technical difficulty associated with specific chip hybrid bonding [3]. - Domestic innovative enterprises are accelerating their efforts in this niche market to capture market share and establish brand influence [3]. Group 3: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7].

Core Viewpoint - The article highlights the successful IPO of Xiamen Hengkang New Materials Technology Co., Ltd., which is set to become the first stock of photoresist on the Sci-Tech Innovation Board, emphasizing its role in breaking the foreign monopoly on key materials for 12-inch integrated circuit manufacturing [2][4]. Group 1: Company Overview - Hengkang New Materials was established in 2004 and specializes in the R&D, production, and sales of photoresist materials and precursors, being one of the few companies in China capable of developing and mass-producing key materials for 12-inch integrated circuit wafer manufacturing [4]. - The company's products are essential for the production processes of advanced NAND, DRAM storage chips, and logic chips below the 90nm technology node, indicating its critical role in the semiconductor supply chain [4]. Group 2: Financial Performance - According to the prospectus, Hengkang New Materials reported revenues of 322 million yuan, 368 million yuan, and 548 million yuan for the years 2022 to 2024, with net profits of 101 million yuan, 90 million yuan, and 97 million yuan respectively [4]. - For the first nine months of 2025, the company expects to achieve revenues between 440 million yuan and 500 million yuan, representing a year-on-year growth of 12.48% to 27.82% [4]. Group 3: Fundraising and Projects - Hengkang New Materials plans to raise 1.007 billion yuan for projects including the second phase of the integrated circuit precursor project and advanced materials for integrated circuits [5]. - The total investment for the projects is 1.62158 billion yuan, with 1.2 billion yuan expected to be funded through the IPO [6]. Group 4: Market Context and Future Plans - The current domestic market for photoresist materials has low localization rates, with KrF photoresist at approximately 10%, ArF photoresist below 5%, and i-Line photoresist at around 20% [7]. - The fundraising projects aim to enhance the localization rates of key materials such as precursors, SiARC, KrF, and ArF, thereby expanding the domestic substitution market [7]. - Hengkang New Materials aims to leverage its IPO to enhance technological development and industrial layout, expand its product line, and improve its core competitiveness and brand influence [7]. Group 5: Industry Events - The article mentions an upcoming conference organized by TrendBank, focusing on heterogeneous integration technology, scheduled for November 17-19, 2025, in Ningbo, aimed at fostering the development of the advanced electronic information industry in the Yangtze River Delta region [8].

Core Viewpoint - The article emphasizes the significance of silicon photonics technology in the future of optical chip markets, highlighting its advantages in manufacturing optical transceivers and its expected market growth by 2030 [2][6][4]. Group 1: Market Overview - Silicon photonics technology is projected to dominate the optical chip market, with the market expected to triple by 2030, and the silicon photonics market share anticipated to double, leading to a sixfold market growth [2]. - Currently, InP optical chip products hold the largest market share at 40%, followed closely by silicon photonics at 37% [2]. Group 2: Technological Advantages - Silicon photonics offers high reliability and low failure rates, making it suitable for mass production, while other materials require years to achieve similar reliability [6]. - The integration of multiple optical components on a single chip is facilitated by silicon photonics, enhancing the reliability and linearity of modulators [10]. Group 3: Industry Adoption - Major companies like Cisco, Huawei, and Intel have significantly adopted silicon photonics technology, which took nearly a decade to influence the entire optical transceiver market [4]. - The compatibility of silicon photonics with LPO/CPO optical module packaging technology has driven its widespread penetration, increasing from 30% in 2024 to 60% by 2030 [4]. Group 4: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on cutting-edge technologies in heterogeneous integration and advanced packaging [8][10].