Core Viewpoint - The article discusses the growth and challenges of Through Glass Via (TGV) technology in the glass substrate market, highlighting its applications in various industries and the expected market growth rates over the coming years [3][4]. Group 1: TGV Technology Overview - TGV is a crucial component of glass core substrates, enhancing device compactness and performance by improving interconnection density and signal integrity [2]. - The integration of TGV can simplify manufacturing processes by eliminating the need for separate interconnection layers [2]. Group 2: Market Growth and Projections - The demand for TGV substrates is driven by the increasing need for microelectronic devices, with an estimated 50% of new IoT devices expected to incorporate TGV technology [3]. - The market value for glass VIA (TGV) substrates is projected to reach $129.74 million in 2024, $174.11 million in 2025, and expand to $1.83166 billion by 2033, with a compound annual growth rate (CAGR) of 34.2% from 2025 to 2033 [3]. Group 3: Industry Applications - In the consumer electronics sector, approximately 45% of products utilize TGV technology for compact and efficient designs [4]. - The automotive industry has seen a 30% increase in TGV substrate utilization due to the integration of advanced driver-assistance systems [4]. - The medical field has also experienced a 25% increase in TGV applications [4]. Group 4: Challenges Facing TGV Technology - The inherent brittleness of glass materials poses a risk of breakage during processing, affecting production yield [5]. - High precision is required for creating fine through-hole structures, necessitating advanced laser drilling or chemical etching techniques [5]. - The need for conductive materials to fill the non-conductive glass vias presents challenges in ensuring uniformity and contact quality [5]. - Differences in thermal expansion coefficients between glass and silicon components can lead to structural stress and potential failure [5]. - TGV structures must withstand various environmental conditions, requiring high mechanical strength and stable electrical performance [5]. - The complexity of processing and the need for specialized equipment contribute to high initial investment and production costs, limiting widespread adoption [5]. Group 5: Recent Developments in TGV Industry - Recent collaborations and innovations include the establishment of an integrated circuit substrate innovation center by Chipai Technology and Nanjing University [6]. - SKC's subsidiary Absolics is ramping up glass substrate production, aiming for commercial viability by the end of 2025 [6]. - Corning has developed a new glass specifically for semiconductor substrates, improving thermal expansion and elasticity [6]. - JNTC has unveiled a new TGV glass substrate with a 90% yield rate, utilizing advanced processing techniques [7]. - Various companies, including BOE and Samsung, are investing in TGV technology and establishing production lines to enhance their capabilities in the semiconductor glass substrate market [8].

Core Viewpoint - The 2025 TrendBank Photolithography Industry Conference held in Hefei focused on advanced photolithography technologies and the current state of domestic photolithography materials, discussing innovation and industry upgrades to enhance self-sufficiency and quality levels in China [1][2]. Group 1: Conference Highlights - The conference covered cutting-edge photolithography technologies such as EUV, electron beam lithography, and nanoimprint lithography, along with the latest research progress and application prospects [1]. - Key discussions included the domestic production status and technical bottlenecks of photolithography materials like photoresists, wet electronic chemicals, and masks [1]. - The conference emphasized the importance of breaking barriers and fostering collaboration in the development of domestic photolithography equipment [12]. Group 2: Industry Developments - The domestic photolithography chemical materials industry is developing a complete supply chain, with significant production capacities established, including 4,000 tons/year for display photoresists and 500 tons/year for semiconductor photoresists [14]. - Research on trace gases under DUV light is complex, requiring precise detection methods and monitoring setups to study potential chemical reactions [16]. - Digital lithography, particularly laser direct-write lithography, is gaining traction in specific fields, with optimistic market prospects expected to mature over the next three years [20]. Group 3: Technical Challenges - The application of excimer laser gas technology faces challenges such as gas mixing, impurity removal, and product testing, despite its advantages in resolution and production efficiency [22]. - Trace cations and anions significantly impact downstream products, with various sources of contamination identified [24].

Core Viewpoint - Recently, Haike Group announced that its subsidiary, Zhenjiang Runjing High Purity Chemical Technology Co., Ltd. (Runjing Technology), successfully completed a new round of financing totaling RMB 350 million, led by Haike Group's strategic investment department with participation from several strategic investors [3]. Group 1: Company Overview - Runjing Technology, established in 2008, is a subsidiary of Haike Group, which is listed among the "Top 500 Enterprises in China." The company specializes in the research, production, sales, and service of high-purity wet electronic chemicals for high-end manufacturing industries such as semiconductors and display panels [3][5]. - The company has developed methods and patented technologies for producing electronic-grade tetramethylammonium hydroxide and electronic-grade tetraethylammonium hydroxide, with 94 patents approved [5]. Group 2: Product and Market Position - Wet electronic chemicals, also known as ultra-pure electronic chemicals, are essential liquid chemical materials used in microelectronics and optoelectronics processes, including etching solutions, developing solutions, stripping solutions, cleaning solutions, and dilution solutions [5]. - Runjing Technology has established business or technical partnerships with major clients in the panel and semiconductor industries, including Samsung, BOE, Huaxing Optoelectronics, Huike, TSMC, and Changxin Storage, providing one-stop solutions for electronic chemicals [7]. Group 3: Future Prospects - The company is expanding its product range, including projects related to post-CMP cleaning solutions, color film developing solutions, and silver etching solutions. It has four subsidiaries, with Hefei Xinke Electronic Materials Co., Ltd. focusing on high-purity hydrogen peroxide, ammonia, and isopropanol for semiconductor-grade products [7]. - The acquisition of two Chinese factories from Sumitomo Chemical in April 2024 will enhance Runjing Technology's product offerings in etching solutions, stripping solutions, and CF developing solutions, thereby improving its competitiveness in the Chinese wet electronic chemical market [7]. - The rapid growth of the semiconductor and display panel industries is driving the increasing demand for wet electronic chemicals, positioning Runjing Technology for significant breakthroughs in the industry [7].

Core Viewpoint - The breakthrough in glass substrate technology is attracting significant attention in the global semiconductor industry, with companies like Absolics aiming for commercial production by the end of 2025 [3][5]. Group 1: Company Developments - Absolics, a subsidiary of SKC, is accelerating the production of glass substrates to expand shipment scale and prepare for mass production [3]. - The company has initiated prototype product production at its factory in Georgia, USA, with an annual capacity of 12,000 square meters [3]. - Absolics plans to increase the procurement of materials and components needed for glass substrate processing by over 60% in the second half of the year [6]. Group 2: Financial Support and Investments - In the first quarter, Absolics secured $50 million in loans and received $40 million in initial manufacturing subsidies under the CHIPS and Science Act [6]. - The company is preparing a capital increase plan involving its major shareholders, SKC and Applied Materials, to enhance manufacturing capabilities [6]. Group 3: Industry Trends - Other companies are also advancing in the glass substrate market, with Samsung planning to use glass substrate interlayers for advanced semiconductors by 2028 [6]. - LG Innotek is constructing a pilot production line at its Gimhae factory, aiming to start prototype production by the end of the year [6].

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference held on July 9 in Hefei focused on advanced lithography technologies and the current state of domestic lithography materials, discussing the need for technological innovation and industrial upgrades to enhance self-sufficiency and quality in the domestic market [1][15]. Group 1: Conference Highlights - The conference covered cutting-edge lithography technologies such as EUV, electron beam lithography, and nanoimprint lithography, along with the analysis of domestic lithography materials like photoresists and wet electronic chemicals [1][2]. - Key discussions included the challenges and solutions in the localization of lithography equipment, focusing on equipment R&D, manufacturing processes, performance improvements, and market conditions [2]. Group 2: Expert Insights - Wang Chengqian emphasized the importance of developing next-generation AI as a strategic resource for gaining a competitive edge in global technology [19]. - Luo Feng highlighted the advantages of physical deposition dry photoresists in HNA-EUV technology, including lower dose requirements and better uniformity [21]. - Zhang Wali discussed the benefits of hybrid bonding technology, which allows for smaller pitch and higher I/O density [23]. - Li Zili introduced directed self-assembly (DSA) techniques for contact hole miniaturization, meeting sub-10nm process node requirements [25]. - Sun Fengxia pointed out the challenges in domestic photoresist localization, including technology monopolies and high entry costs [31]. - 应颖 noted the growth in the display and semiconductor photoresist market, driven by government policies and industry chain development [33]. Group 3: Specialized Forums - The forum on photoresists and wet electronic chemicals featured discussions on trends in packaging technology and the need for environmentally friendly solutions [36]. - SAM SUN explained the challenges in the CAR theory related to photoresist performance and defect management [38]. - Du Mengcheng discussed the technical difficulties in developing PSPI for chip interconnections [40]. - Huang Xinyi emphasized the need to enhance photoresist performance and supply chain resilience to meet ESG goals [48]. - The roundtable featured discussions on various topics related to micro-nano platform processes and industry challenges [50].

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference will be held on July 9-10, 2025, in Hefei, focusing on advanced lithography technologies and domestic material production challenges [1][4]. Group 1: Conference Overview - The conference will feature participation from 24 industry, academic, and research institutions, including notable companies and universities [1]. - The event is organized by TrendBank and co-organized by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance, with an expected attendance of 300 people [4]. Group 2: Conference Content - Discussions will cover cutting-edge lithography technologies such as Extreme Ultraviolet Lithography (EUV), electron beam lithography, and nanoimprint lithography, along with their latest research advancements and application prospects [5]. - The conference will analyze the current state and technical bottlenecks of domestic lithography materials, including photoresists, wet electronic chemicals, and masks, aiming to enhance self-sufficiency and quality through technological innovation and industrial upgrades [5]. - Key issues and solutions regarding the localization of lithography equipment, which is essential for semiconductor manufacturing, will also be a focal point, including equipment R&D, manufacturing processes, performance improvements, and market conditions [6].

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference will be held on July 9-10, 2025, in Hefei, focusing on advanced lithography technologies and the challenges faced by the domestic lithography materials industry [1][24][34]. Conference Overview - The conference will feature over 20 speakers from the lithography industry, covering topics such as extreme ultraviolet lithography (EUV), electron beam lithography, and nanoimprint technologies [25][26]. - Discussions will include the current state of domestic lithography materials, including photoresists and wet electronic chemicals, and the challenges in achieving self-sufficiency and quality improvement [25][34]. Agenda Highlights - The agenda includes specialized forums on advanced lithography technology, photoresists, and wet electronic chemicals, as well as discussions on lithography equipment and its domestic production challenges [8][12][15][25]. - Key topics will address the development of high-end photoresists, the challenges in the production of wet electronic chemicals, and the need for domestic lithography equipment to overcome reliance on foreign technology [34][35]. Participation and Registration - The conference is expected to attract around 300 participants, including industry experts, scholars, and representatives from various companies [24][25]. - Registration fees are set at RMB 2600 if paid by June 30, and RMB 2800 thereafter, which includes access to conference materials and meals [28][27]. Industry Context - The lithography technology is critical for semiconductor manufacturing, directly impacting chip performance, integration, and production costs [34]. - The domestic lithography industry faces significant challenges, including low self-sufficiency in high-end photoresists and reliance on imports for key materials and equipment [34][35].

Core Viewpoint - The 2025 TrendBank (Fifth) Lithography Industry Conference will be held on July 9-10, 2025, in Hefei, focusing on advanced lithography technologies and domestic material production challenges [1][4]. Group 1: Conference Overview - The conference will feature participation from 24 industry, academic, and research institutions, including notable companies and universities [1]. - The event is organized by TrendBank and co-organized by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance, with an expected attendance of 300 people [4]. Group 2: Conference Content - Discussions will cover cutting-edge lithography technologies such as Extreme Ultraviolet Lithography (EUV), electron beam lithography, and nanoimprint lithography, along with their application prospects [5]. - The conference will analyze the current state and technological bottlenecks of lithography materials, including photoresists, wet electronic chemicals, and masks, aiming to enhance domestic self-sufficiency and quality [5]. - Key issues and solutions regarding the localization of lithography equipment, including research and development, manufacturing processes, performance improvements, and market conditions, will also be a focal point [6]. Group 3: Conference Schedule - The conference schedule includes an opening ceremony, keynote speeches, breaks, and a roundtable forum on July 9, followed by additional keynote speeches and a closing ceremony on July 10 [12][13].

Core Viewpoint - The article highlights the significant growth and localization of the semiconductor equipment market in China, emphasizing the upcoming 2025 TrendBank Lithography Industry Conference and the increasing demand for domestic semiconductor manufacturing equipment due to geopolitical tensions [1][3]. Group 1: Industry Overview - In 2024, the global semiconductor equipment market reached a sales scale of $116.1 billion, with China's market share at 36.7%, indicating a dominant position [1]. - The expansion of wafer fabrication equipment is driven by downstream technological iterations and market demand growth, with global revenue from wafer fabrication equipment consistently accounting for 10%-20% of the total semiconductor equipment market [2]. Group 2: Market Dynamics - The global wafer fabrication equipment market is still largely occupied by international companies, but China is the largest demand region, presenting significant opportunities for localization projects [3]. - The article notes that the localization of semiconductor equipment and components is becoming a hot investment area, following semiconductor materials and advanced packaging projects [1]. Group 3: Conference Details - The 2025 TrendBank Lithography Industry Conference will take place on July 9-10, 2025, in Hefei, Anhui, with participation from 24 industry, academic, and research institutions [1]. - The conference will feature various sessions focusing on advanced lithography technologies, domestic production of lithography materials, and the challenges and opportunities in the semiconductor industry [14][24].

Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment within the semiconductor industry, emphasizing the need for domestic innovation and self-sufficiency in light of global supply chain vulnerabilities [26][35][36]. Group 1: Conference Overview - The conference will take place from July 9 to July 10, 2025, in Hefei, Anhui, at the Sheraton Hotel [30][25]. - It will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, and wet electronic chemicals [27]. - The event will include academic discussions and a combination of conference and exhibition formats to foster industry collaboration and resource integration [28][29]. Group 2: Industry Challenges - The domestic high-end photoresist supply rate is low, with significant gaps in research and production technology compared to international standards [34]. - There is a reliance on imports for high-purity and specialty wet electronic chemicals, which poses supply risks [34]. - The manufacturing of high-precision masks is challenging, with key raw materials primarily imported, leading to vulnerabilities in rapid repair and update technologies [34]. Group 3: Conference Agenda Highlights - The agenda includes specialized forums on advanced lithography technology, photoresists, and wet electronic chemicals, as well as discussions on the domestic industrialization of semiconductor lithography equipment [16][17][24]. - Key topics will include the development and application trends of advanced packaging materials and the challenges faced in the domestic production of lithography materials [18][19][22]. Group 4: Importance of Lithography Technology - Lithography technology is crucial for semiconductor manufacturing, directly impacting chip performance, integration, and production costs [34]. - The conference aims to enhance the domestic lithography industry's capabilities and competitiveness through expert discussions and collaborative efforts [35].