Core Insights - The article discusses the growing demand for AI computing power and the continuous upgrade of optical communication networks, highlighting silicon photonics technology as a mainstream solution for 1.6T high-speed optical modules. The global silicon photonics semiconductor market is projected to reach $7.86 billion by 2030, with a compound annual growth rate (CAGR) of 25.7% [2][3]. Group 1: Industry Trends - Silicon photonic chips, which are essential components of optical modules, consist of four key elements: light sources, waveguides, modulators, and detectors. Their high integration, low cost, and high transmission bandwidth make them favored in core applications such as 5G communication, AI data centers, and autonomous driving [2][3]. - Major chip manufacturers like Intel and NVIDIA are actively investing in silicon photonics technology, driving technological breakthroughs and practical applications [2][3]. Group 2: Technical Challenges - The performance of silicon photonic devices is highly sensitive to manufacturing precision. Any minor processing errors can severely degrade device performance, necessitating targeted optimization of silicon photonics manufacturing processes to enhance signal transmission quality and device reliability [3]. Group 3: Upcoming Events - TrendBank plans to host the "Frontier Forum on Heterogeneous Integration" on November 18-19, 2025, in Ningbo, focusing on advanced packaging and heterogeneous integration technologies [3][30]. - The forum will feature discussions on optical chip technology, with confirmed speakers from leading companies and research institutions [4][30].

Core Insights - The article discusses the growing demand for "big computing power" driven by advancements in AI and high-performance computing, highlighting the need for a transformation in chip manufacturing due to challenges like the "von Neumann bottleneck" and the slowdown of Moore's Law [2][3] - Heterogeneous integration and heterogeneous-hybrid integration technologies are becoming crucial for achieving high-performance, multifunctional electronic systems, supported by national policies promoting foundational research in advanced technologies [2][3] Group 1: Heterogeneous Integration - Heterogeneous integration focuses on integrating different semiconductor materials (e.g., silicon-based chips with gallium nitride and silicon carbide) into a single package to overcome physical limitations of single materials [3] - The main challenges include managing thermal expansion coefficient mismatches, material interface defects, and thermal management [3] Group 2: Heterogeneous-Hybrid Integration - Heterogeneous-hybrid integration combines different process nodes (e.g., 7nm logic chips with 28nm I/O chips) and functional modules (e.g., CPU, GPU, memory) using advanced packaging technologies to create system-in-package (SIP) solutions [3] - This approach aims to optimize cost and performance while addressing challenges such as interconnect standardization, yield control, and signal integrity [3] Group 3: Upcoming Forum - TrendBank plans to host the "2025 Heterogeneous-Hybrid Integration Frontier Forum" in Ningbo on November 18-19, 2025, focusing on cutting-edge heterogeneous-hybrid integration technologies [4] - The forum will feature discussions on various topics related to heterogeneous-hybrid integration, with confirmed participation from several key industry players and research institutions [4][6] Group 4: Conference Details - The conference is expected to attract 300-500 participants and will include a range of presentations from experts in the field, covering advancements in semiconductor technologies and integration methods [36][37] - Registration details indicate different ticket pricing options, including early bird discounts and student rates [37]

Core Viewpoint - The 2025 Heterogeneous Integration Frontier Forum will be held in Ningbo from November 17 to 19, 2025, focusing on advancements in heterogeneous integration technology and its applications in the semiconductor industry [2][53]. Event Details - The forum is organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, with support from various local organizations [2][53]. - The event will take place at the Pan Pacific Hotel in Ningbo, with the main conference scheduled for November 18-19, and a tour of the Yongjiang Laboratory's 8-inch verification line on November 17 [9][53]. Agenda Highlights - The agenda includes keynote speeches from government leaders and industry experts, discussions on various topics related to heterogeneous integration, and a verification line commissioning ceremony [10][31][33]. - Specific topics will cover advancements in semiconductor technology, including 2.5D/3D integration, optical chip development, and innovative packaging techniques [33][35][40]. Registration and Fees - Registration for the forum is available through a QR code, with ticket prices set at RMB 2500 per person, offering early bird discounts and student rates [54]. - The registration includes access to conference materials, lunch, and a gala dinner on November 18 [54]. Accommodation Information - The Pan Pacific Hotel offers special rates for attendees, with prices ranging from RMB 350 to 600 per night depending on room type [15][17]. - Additional nearby hotels are listed for convenience, providing various options for attendees [18][22].

Group 1 - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, at the Ningbo Pan Pacific Hotel, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][32]. - The forum aims to discuss advancements in heterogeneous integration technologies and will feature various keynote speeches and parallel sessions focusing on micro-nano manufacturing and advanced packaging technologies [14][18][21]. - The event is expected to attract 300-500 participants, with ticket prices starting at RMB 2500, offering early bird discounts and student rates [32]. Group 2 - The forum will include a ribbon-cutting ceremony for the 8-inch verification line of the Yongjiang Laboratory's information materials and micro-nano device preparation platform [2]. - Keynote speakers include industry leaders and experts from various organizations, discussing topics such as MEMS manufacturing, advanced packaging trends, and the future of silicon photonics [17][20][21]. - The event will also feature networking opportunities and a gala dinner on November 18, fostering collaboration among industry professionals [32].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, focusing on advancements and challenges in heterogeneous integration technology within the semiconductor industry [2][22]. Event Details - The forum will take place from November 17 to 19, 2025, at the Pan Pacific Hotel in Ningbo, Zhejiang, with an expected attendance of 300 to 500 participants [22]. - The event aims to facilitate discussions among industry experts, academic institutions, and investment organizations regarding the current state and future trends of advanced packaging technologies [2][22]. Agenda Highlights - The forum will feature keynote speeches, technical presentations, and parallel sessions covering various topics such as micro-nano manufacturing technologies, advanced packaging trends, and the development of optical chips [4][6][10][12]. - Notable speakers include experts from leading institutions and companies, discussing topics like 2.5D/3D advanced packaging, silicon photonic integration, and Micro LED technology [6][10][12][15]. Registration Information - Registration fees are set at RMB 2500 per person, with early bird discounts available for those who register before October 31, 2025 [22]. - Special rates are offered for students, allowing them to attend for RMB 1500 [22]. Participant List - The article lists several companies and their representatives who have registered for the event, including Huawei, Longxin Storage, and various semiconductor technology firms [23][24].

Group 1 - The core viewpoint of the article highlights the recovery of the global IC packaging substrate market, with a forecasted revenue of $15 billion in 2025, representing a 12% year-on-year growth, driven by surging demand in downstream technology products such as data centers and AI servers [2][3]. - The Chinese domestic market is expected to maintain a high growth rate, with projected revenue reaching $1.64 billion, and local companies achieving a global market share exceeding 10% for the first time [3]. - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17-19, 2025, in Ningbo, focusing on advanced packaging and integration technologies [5][29]. Group 2 - The forum will feature a report by a senior analyst from TrendBank on the development trends of advanced packaging technologies such as 2.5D/3D/FOPLP and IC substrates [6]. - The event will include various keynote speeches and parallel forums discussing critical technologies and challenges in heterogeneous integration and advanced packaging [11][15][22]. - The forum is organized by TrendBank and the Yongjiang Laboratory, with support from various industry associations, and is expected to attract 300-500 participants [29].

Core Viewpoint - The global display industry is experiencing complex and diverse development trends, with the new display industry expected to exceed $200 billion in value by 2024, with China accounting for half of this market [2]. Industry Overview - The advancement of new display technologies and increasing user demand are driving the popularity of high-end and large-size display products, leading to a rise in demand for high-value products with superior image quality and aesthetics [2]. - The rapid iteration of downstream display technologies such as Mini-LED, Micro-LED/OLED, quantum dot displays, and AR/VR is contributing to the evolution of the display industry, transitioning from scale leadership to technological leadership in China [2]. MicroLED Technology - MicroLED chip manufacturing typically involves etching and epitaxy processes, including substrate preparation, intermediate layer preparation, step etching, conductive layer preparation, and electrode preparation [3]. - MicroLED features miniaturization (pixel size and spacing reduced from millimeters to micrometers) and integration (device structures include LED display driving circuits and LED matrix arrays) [3]. Manufacturing Challenges - The incompatibility of epitaxial growth processes for different colors (e.g., red MicroLED with AlGaInP materials and blue/green with GaN materials) complicates the integration of RGB colors on a single substrate [4]. - As chip sizes shrink to the micrometer level, sidewall defects during the etching process can affect internal quantum efficiency (IQE), leading to a decrease in external quantum efficiency (EQE) [4]. - Existing full-color solutions face challenges such as brightness loss, oversized modules, or high costs, making them unsuitable for micro-display applications like AR/VR [4]. Detection and Repair Technologies - The difficulty in defect detection and repair for micro-sized chips necessitates the development of high-precision non-destructive testing and repair technologies [5]. Upcoming Forum - TrendBank plans to host the "2025 Heterogeneous Integration Frontier Forum" from November 17-19, 2025, focusing on MicroLED and new display technologies, with participation from several related companies [5].

Core Viewpoint - The article discusses the advancements in optical interconnect technology, specifically the Optical Streaming Links (OSL) proposed by New Silicon Corp. (NSC), which aims to overcome the limitations of traditional electrical interconnects in chiplet architectures, enhancing performance and efficiency in advanced packaging solutions [9][22]. Group 1: Introduction to Optical Streaming Links (OSL) - The trend of chiplet architecture is driven by the slowdown of Moore's Law, necessitating the integration of multiple small chips within a single package to enhance system performance [9]. - Traditional electrical interconnects face challenges such as high power consumption, limited transmission distances (up to 10mm), and susceptibility to crosstalk, which hinder the efficiency of chiplet communication [9]. - NSC proposes OSL as a solution, utilizing in-package LED-based optical interconnects to significantly extend transmission distances and reduce power consumption [9][10]. Group 2: OSL Technology Architecture - OSL replaces traditional silicon interconnects with a direct connection to small chips (e.g., GPUs and HBM) using Through-Silicon Vias (TSVs) [12]. - The data transmission process involves an "electrical-optical-electrical" conversion chain, where electrical signals modulate microLEDs, and the resulting optical signals are transmitted via SiNₓ waveguides [13]. - OSL achieves a single-channel data rate exceeding 12 Gbps, with a lane pitch of less than 5 micrometers, an aggregate bandwidth density over 2 Tbps/mm, and a power consumption below 0.5 pJ/bit, with transmission distances exceeding 25mm [14][16]. Group 3: OSL Manufacturing Process - NSC has developed a wafer-level integration strategy that allows for the simultaneous fabrication of CMOS and GaN LED devices on a 200mm silicon wafer, compatible with existing CMOS manufacturing infrastructure [17]. - The process involves a proprietary two-layer transfer technique, achieving over 95% bonding yield [17]. - The integration minimizes parasitic capacitance and resistance, ensuring stable device performance [19]. Group 4: Conclusion and Future Implications - OSL technology represents a breakthrough in optical interconnects, offering significant improvements in power consumption, transmission distance, and bandwidth density compared to traditional methods [22]. - The ability to remove high-power SERDES modules and expand memory capacity in advanced packaging designs positions OSL as a key enabler for the future of semiconductor technology [22]. - The upcoming 2025 forum organized by TrendBank aims to focus on heterogeneous integration technologies, further promoting advancements in the semiconductor industry [23].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][38] - The forum aims to discuss advancements in heterogeneous integration technology and its applications in micro-nano manufacturing and semiconductor packaging [20][24] Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300 to 500 participants [38] - An 8-inch verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2] Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][9] - Additional nearby hotels are suggested for accommodation, including the Ningbo Radisson Hotel and the Ningbo Yidong Howard Johnson Hotel [8][11] Agenda Highlights - The forum will feature keynote speeches, panel discussions, and specialized forums focusing on topics such as advanced packaging, micro LED technology, and heterogeneous integration processes [20][28] - Notable speakers include experts from Huazhong University of Science and Technology, Zhejiang University, and various semiconductor companies [21][24][30] Ticketing Information - Tickets for the forum are priced at 2500 RMB per person, with early bird discounts available for those who register before October 31 [39]

Core Points - The article discusses the "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, scheduled for November 17-19, 2025, in Ningbo, Zhejiang [2][23]. - The forum aims to address challenges and breakthroughs in heterogeneous integration technology in chip applications, promoting industry collaboration and innovation [2][23]. Event Details - The forum will feature keynotes from industry experts, academic institutions, and emerging companies, focusing on advanced packaging industry trends and the current state of technology [2][23]. - The event will include a series of thematic forums, including discussions on micro-nano manufacturing technologies, advanced packaging, and optical chip innovations [10][21]. Agenda Highlights - The opening ceremony will include speeches from government leaders and representatives from the organizing bodies, followed by a series of thematic reports and discussions on various topics related to heterogeneous integration and advanced packaging technologies [6][10]. - Notable speakers include experts from major companies and academic institutions, discussing topics such as silicon photonic integration and advanced packaging trends [10][11][21]. Registration Information - The forum is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [24][23]. - Participants will receive conference materials, lunch, and access to the evening banquet [24]. Participant List - A partial list of registered participants includes professionals from leading companies such as Huawei, Longxin Storage, and various semiconductor technology firms, indicating strong industry interest [25][26].