Core Points - The article discusses the "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, scheduled for November 17-19, 2025, in Ningbo, Zhejiang [2][23]. - The forum aims to address challenges and breakthroughs in heterogeneous integration technology in chip applications, promoting industry collaboration and innovation [2][23]. Event Details - The forum will feature keynotes from industry experts, academic institutions, and emerging companies, focusing on advanced packaging industry trends and the current state of technology [2][23]. - The event will include a series of thematic forums, including discussions on micro-nano manufacturing technologies, advanced packaging, and optical chip innovations [10][21]. Agenda Highlights - The opening ceremony will include speeches from government leaders and representatives from the organizing bodies, followed by a series of thematic reports and discussions on various topics related to heterogeneous integration and advanced packaging technologies [6][10]. - Notable speakers include experts from major companies and academic institutions, discussing topics such as silicon photonic integration and advanced packaging trends [10][11][21]. Registration Information - The forum is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [24][23]. - Participants will receive conference materials, lunch, and access to the evening banquet [24]. Participant List - A partial list of registered participants includes professionals from leading companies such as Huawei, Longxin Storage, and various semiconductor technology firms, indicating strong industry interest [25][26].

Core Viewpoint - The article emphasizes the rapid growth of the electronic materials industry in China, driven by advancements in artificial intelligence and the increasing demand for intelligent computing capabilities. It highlights the strategic importance of electronic materials in modern electronics and the necessity for continuous innovation in this sector [2][3]. Industry Overview - The electronic materials sector is crucial for the manufacturing of semiconductors, integrated circuits, optoelectronic devices, and new components, serving as the material foundation for modern electronics and technology [2]. - Electronic materials can be categorized into three main types: electronic functional materials, packaging and assembly materials, and process and auxiliary materials. China has developed self-sufficient capabilities in these areas, but still lags in some high-end fields compared to global leaders [2]. Policy Support - Multiple favorable policies have been issued at the national and local government levels to support the development of electronic materials. For instance, the Ministry of Industry and Information Technology released the "Action Plan for the Development of Basic Electronic Components Industry (2021-2023)" to promote the research and production of electronic materials [3]. - The National Development and Reform Commission has also included the development of key electronic chemicals and materials in its 2024 guidance, further setting a positive tone for innovation in the electronic materials sector [3]. Upcoming Forum - TrendBank, in collaboration with Yongjiang Laboratory, is organizing the "2025 Heterogeneous Integration Frontier Forum" from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies [3]. - The forum will feature various topics and presentations from industry experts, including a keynote speech by a researcher from the Chinese Academy of Sciences [3]. Event Details - The forum is expected to attract 300-500 participants and will include a range of activities such as keynote speeches, panel discussions, and networking opportunities [29]. - Early bird registration is available until October 31, with different pricing tiers for general attendees and students [30].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][41]. - The forum aims to discuss advancements in heterogeneous integration technologies and their applications in various sectors, including micro-nano manufacturing and advanced packaging [20][41]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300 to 500 participants [41]. - A verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2]. Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][10]. - Additional nearby hotels are suggested for accommodation, including the Ningbo Radisson and the Ningbo Yidong Howard Johnson Hotel [8][11]. Agenda Highlights - The forum will feature a series of keynote speeches, panel discussions, and specialized forums focusing on topics such as advanced packaging, micro LED technology, and optical chip innovations [14][36]. - Notable speakers include industry leaders and experts from various organizations, discussing trends, challenges, and technological advancements in the semiconductor and micro-nano sectors [20][31][38]. Registration and Fees - Registration for the forum is priced at 2500 RMB per person, with early bird discounts available for those who register before October 31 [42]. - Student discounts are also offered, allowing students to attend for 1500 RMB [42].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, focusing on advancements and challenges in heterogeneous integration technology within the semiconductor industry [2][31]. Group 1: Event Details - The forum will take place from November 17-19, 2025, at the Pan Pacific Hotel in Ningbo, with an expected attendance of 300-500 participants [31]. - The event aims to facilitate discussions among industry experts, academic institutions, and investment organizations regarding the current state and future trends of advanced packaging technologies [2][31]. Group 2: Participants and Speakers - Notable companies and professionals from various sectors, including Huawei, Longxin Storage, and the Chinese Academy of Sciences, are expected to participate, showcasing a diverse range of expertise [2][3]. - The forum will feature keynote speeches and panel discussions led by industry leaders and researchers, addressing critical topics such as micro-nano manufacturing technologies and advanced packaging integration [16][18]. Group 3: Forum Agenda - The agenda includes specialized forums on topics like heterogeneous integration, advanced packaging, and micro LED technology, with sessions dedicated to discussing the latest innovations and challenges in these fields [19][28]. - Specific sessions will cover advancements in chiplet technology, high-performance sensors, and the application of polymer materials in semiconductor packaging [16][18][29]. Group 4: Registration and Fees - Registration for the forum is available, with ticket prices set at RMB 2500 per person, offering various benefits such as access to conference materials and meals [32]. - Early bird discounts are available for those who register before October 31, with student discounts also offered [32].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17-19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][41]. - The forum aims to discuss advancements in heterogeneous integration technologies and will feature various parallel sessions and keynote speeches from industry leaders and experts [20][41]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300-500 participants [41]. - A verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2]. Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][10]. - Additional nearby hotels are suggested for accommodation, including the Ningbo Radisson and the Ningbo Yidong Howard Johnson [8][11]. Agenda Highlights - The forum will include a series of keynote speeches, panel discussions, and workshops focusing on topics such as micro-nano manufacturing, advanced packaging, and optical chip innovations [14][31]. - Notable sessions include discussions on the latest trends in 2.5D/3D chip stacking and the development of high-performance integrated sensors [25][30]. Registration and Fees - Registration for the forum is priced at 2500 RMB per person, with early bird discounts available for those who register before October 31 [42]. - Student discounts are also offered at a reduced rate of 1500 RMB [42].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][41]. - The forum aims to discuss advancements in heterogeneous integration technologies and their applications in micro-nano manufacturing and semiconductor packaging [20][41]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300 to 500 participants [41]. - A verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2]. Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][10]. - Additional nearby hotels include the Ningbo Radisson Hotel and the Ningbo Yidong Howard Johnson Hotel, with varying rates and availability [8][11]. Agenda Highlights - The forum will feature a series of keynote speeches, panel discussions, and workshops focusing on topics such as micro LED technology, advanced packaging, and the latest innovations in semiconductor manufacturing [19][36]. - Notable speakers include industry leaders and researchers from various institutions, discussing trends, challenges, and technological advancements in the field [20][30][36]. Registration and Fees - Registration for the forum is available at a fee of 2500 RMB per person, with early bird discounts and student rates offered [42]. - The registration includes access to conference materials, lunch, and a gala dinner on November 18 [42].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by TrendBank and the Yongjiang Laboratory, focusing on advancements in semiconductor integration technology and its applications in the chip industry [2][27]. Event Overview - The forum will take place from November 17-19, 2025, at the Pan Pacific Hotel in Ningbo, Zhejiang [2][27]. - It aims to gather experts from academic institutions, industry groups, and investment firms to discuss challenges and breakthroughs in heterogeneous integration technology [2]. Agenda Highlights - The opening ceremony will feature speeches from government leaders and key stakeholders, including the CEO of TrendBank [8]. - Various parallel forums will cover topics such as advanced packaging, micro LED integration, and optical chip innovations [10][18][22]. - Notable presentations will include discussions on micro-nano manufacturing technologies, advanced packaging trends, and the latest developments in optical chip technology [11][15][23]. Participation Details - The forum expects to host between 300 to 500 participants, with different ticket options available, including early bird discounts [27][28]. - The ticket prices range from RMB 1,500 for students to RMB 2,500 for general attendees, excluding accommodation [28].

Core Insights - The article discusses the significant transformations occurring in the global electronic materials industry, emphasizing the acceleration of technological iterations and the deepening of supply chain restructuring [4][8]. Group 1: Industry Events - The 2025 Advanced Electronic Materials Industry Development Forum was held in Shanghai, focusing on topics such as semiconductor material localization, packaging process optimization, and AI-driven market trends, with around 130 representatives from various sectors attending [2]. - The 2025 Heterogeneous Integration Frontier Forum is scheduled for November 17-19, 2025, in Ningbo, organized by TrendBank, highlighting the focus on advanced packaging technology [29]. Group 2: Key Industry Leaders' Insights - Shanghai Chemical Zone's leadership emphasized the need for continuous breakthroughs in industrial ecology and the importance of focusing on key links to enhance the electronic materials industry's high-quality development [4]. - The Shanghai Electronic Materials Association aims to act as a bridge between government and enterprises, fostering innovation and collaboration within the industry [6]. Group 3: Market Trends and Challenges - The Chinese semiconductor market accounts for approximately one-third of the global market share, with ongoing growth despite challenges such as insufficient capacity and significant gaps in advanced processes [8]. - Emerging technologies, including nanotechnology and new semiconductor materials like graphene and wide bandgap semiconductors, are expected to drive innovation and overcome limitations of traditional silicon-based materials [9]. Group 4: Technological Innovations - AI and automation are revolutionizing materials science, significantly accelerating the discovery of new materials through high-throughput synthesis techniques [11]. - The development of high-resolution photoresists is facing challenges, with research expanding into new paradigms such as AI-based material design and molecular dynamics simulations [15][19]. Group 5: Strategic Initiatives - The Shanghai Electronic Chemical Products Zone, established in December 2020, aims to create a comprehensive ecosystem for electronic materials, with plans to achieve over 90% localization of key materials in the integrated circuit field by 2030 [24].

Core Viewpoint - The article emphasizes the shift in the semiconductor industry from single-point breakthroughs to system-level collaboration, particularly in advanced packaging and chiplet technologies, driven by the increasing demand for computing power and the need for integrated solutions [4][5][15]. Industry Trends - The demand for computing power is surging, leading to a transition from "process racing" to "system collaboration" in the semiconductor industry [2][4]. - The Bay Area Semiconductor Industry Expo showcased the trend of system-level collaboration, with a focus on Chiplet and advanced packaging ecosystems [2][6]. System Collaboration - Advanced packaging competition is evolving from single-link breakthroughs to full-chain collaboration, necessitating synchronized advancements across design, EDA, manufacturing, and testing [4][14]. - EDA tools are becoming central to connecting design and manufacturing processes, crucial for the successful implementation of Chiplet and advanced packaging technologies [4][5]. Strategic Opportunities for China - China faces a strategic window to leverage its capabilities in packaging, design, and EDA, despite limitations in process technology [5][15]. - The establishment of collaborative mechanisms will define the future of domestic advanced packaging [5][11]. Collaborative Ecosystem - The "Chiplet and Advanced Packaging Ecosystem Zone" at the Bay Area Expo represented a significant step towards creating a visible collaborative framework involving nearly 30 entities [6][11]. - The integration of EDA platforms with real-time collaboration between design and manufacturing is being pursued to enhance system modeling and verification [8][10]. Pathway to Systematic Collaboration - The transition from "small closed loops" to "large systems" reflects a replicable collaborative model, moving from localized validation to systematic implementation [12][14]. - A cross-enterprise, cross-process, and cross-disciplinary collaborative framework is emerging, essential for the self-evolution of China's advanced packaging industry [14][15]. Innovation and Ecological Restructuring - Collaboration is becoming the foundational logic of China's advanced packaging sector, driving innovation and supporting systemic evolution [15][16]. - The redefinition of the innovation order and ecological landscape in the semiconductor industry is underway, led by domestic players like Silicon Core Technology [17][18].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory, focusing on advancements in heterogeneous integration technology and its applications in semiconductor packaging [4][16]. Group 1: Event Details - The 2025 Heterogeneous Integration Annual Conference will be held from November 17-19, 2025, in Ningbo, Zhejiang [4][16]. - The conference aims to gather 300-500 participants and will feature various discussions on hybrid bonding and advanced packaging technologies [16]. - Early bird registration is available until October 31, with ticket prices ranging from RMB 1500 for students to RMB 2500 for general attendees [17]. Group 2: Industry Trends - Heterogeneous integration technology is rapidly evolving, transitioning from 2D to 2.5D and 3D integration, with major companies like Sony, TSMC, Samsung, Intel, and AMD actively developing these processes [2][3]. - The article highlights the advancements in bonding techniques, with C4 bump pitch decreasing from 150-110μm in 2D integration to 8-2μm in 3D stacking, indicating a trend towards finer pitches and higher integration [3]. Group 3: Conference Topics and Speakers - The conference will include discussions on various topics such as AI-driven advanced packaging processes, challenges in multi-dimensional heterogeneous integration, and the future of chiplet interconnect design [12][14]. - Confirmed speakers include industry leaders from companies like Qinghe Crystal, Xinhui Lianxin, and Maiwei Technology, who will present on topics related to semiconductor hybrid bonding and advanced packaging technologies [6][12].