Core Viewpoint - The article emphasizes the growing importance and market activity of optical chips, particularly lithium niobate on insulator (LNOI) technology, in the context of increasing demand for artificial intelligence and data centers [2][3]. Group 1: Optical Chip Market Dynamics - The optical chip sector is experiencing heightened activity in both primary and secondary markets, driven by advancements in optical communication and emerging technologies like quantum computing [2]. - LNOI technology is highlighted as a key material for next-generation optical communication and quantum computing due to its compatibility with CMOS and superior performance characteristics [2][3]. Group 2: LNOI Technology Advantages - LNOI exhibits excellent optoelectronic performance, including a high electro-optic coefficient and strong nonlinear optical effects, making it suitable for high-speed optical modulation and quantum optics applications [3][4]. - The technology allows for significant device miniaturization, with a half-wave voltage-length product of less than 2.5 V·cm, leading to reduced power consumption and enhanced integration capabilities [3]. - LNOI crystals demonstrate high stability and reliability, with a Curie temperature around 1140°C, enabling operation in harsh environments [3]. Group 3: Global Supply Chain and Collaboration - The article outlines the establishment of the first open LNOI photonic chip foundry in Europe, which will enable industrial-scale production of optical-grade LNOI wafers [3][4]. - A list of global suppliers for lithium niobate substrates is provided, showcasing the competitive landscape and potential for collaboration within the industry [4]. Group 4: Upcoming Events and Industry Focus - The company plans to host the 2025 Heterogeneous Integration Annual Conference in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [6].

Group 1 - The article highlights the significance of PCB (Printed Circuit Board) as a core component in modern electronics, essential for electrical interconnection and mechanical support in electronic devices [2][3] - PCB photoresist is identified as a critical consumable for transferring fine circuit patterns onto copper-clad boards, with the global PCB market expected to reach $4.2 billion by 2025, growing at a CAGR of 8.7%, with China accounting for over 50% of the market [3][5] - The article categorizes PCB photoresists into dry film, wet film, and solder mask ink, each with distinct characteristics and applications in ensuring circuit reliability and performance [3][4] Group 2 - The domestic PCB photoresist industry has evolved from reliance on imports to developing competitive local players, driven by increasing demand in automotive electronics, data centers, and aerospace sectors [5][6] - High-end dry film photoresists remain dominated by a few global leaders, while local manufacturers are expected to gain market share due to cost advantages and policy support, with a potential growth phase anticipated between 2026 and 2030 [5][6] - The article lists key players in the PCB photoresist market, including Rongda, Guangxin Materials, and Foster, highlighting their market shares and product focuses [6] Group 3 - An upcoming conference organized by TrendBank will focus on heterogeneous integration technologies, aiming to foster collaboration between industry and academia to drive innovation in advanced packaging technologies [7]

Core Viewpoint - The article emphasizes the importance of heterogeneous integration technology in the semiconductor industry, particularly in the context of new demands from artificial intelligence, smart driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory to address these challenges and promote collaboration between industry and academia [2][19]. Meeting Background - The semiconductor industry is facing new stringent requirements for chip design and manufacturing due to advancements in AI and high-performance computing. Key issues such as power consumption, performance, area, and cost are driving the acceleration of emerging semiconductor technologies [2]. - Heterogeneous integration has emerged as a significant and promising direction in the semiconductor field, especially as traditional Moore's Law approaches physical limits. The conference aims to tackle challenges in 2.5D/3D heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and glass-based packaging [2]. - Ningbo is positioned as a core port city in China with a strong foundation in advanced manufacturing, making it an ideal location for this conference. The Yongjiang Laboratory is a provincial-level innovation platform focusing on electronic information materials and micro-nano device preparation [2]. Meeting Content - The conference will focus on core technologies such as multi-material heterogeneous integration and optoelectronic integration, covering advanced packaging technologies like 3D heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and semiconductor materials and equipment [3]. Basic Information - The 2025 Heterogeneous Integration Annual Conference will be held from November 17-19, 2025, in Ningbo, organized by TrendBank and Yongjiang Laboratory, with an expected attendance of 200-500 participants [4]. Proposed Agenda - The agenda includes closed-door meetings, technical discussions on micro-nano devices, and various forums focusing on advanced packaging technologies and materials [7][9][10]. Conference Features - The conference aims to integrate resources across the heterogeneous integration industry chain, involving all stakeholders from upstream to downstream, and will feature a combination of large and small meetings to facilitate both broad discussions and targeted interactions [8]. - A live supply-demand matching platform will be set up to allow participants to directly engage with cutting-edge technologies and products [8]. Registration and Fees - The registration fee for the conference is RMB 2500 per person, with early bird discounts available. Special rates are offered for students [12].

Group 1 - The article highlights the successful bulk delivery of Panel-level Glass Through Via (TGV) equipment by Dazhu Semiconductor to multiple clients, emphasizing the equipment's high stability and reliability, which supports immediate production and technological advancement [2][4]. - Dazhu Semiconductor's TGV equipment has overcome significant challenges in processing large glass substrates, improving product yield and paving the way for the mass production of the next generation of Chiplet packaging [4]. - The newly developed femtosecond laser-enhanced glass etching technology (FLEE) by Dazhu Semiconductor has increased processing area by 300% and reduced packaging costs by 40%, enhancing efficiency in mass production [4][6]. Group 2 - The FLEE-TGV equipment can process various hole types and sizes, with a maximum processing size of 730mm x 920mm, making it suitable for advanced packaging, display manufacturing, consumer electronics, and life sciences [6]. - The equipment features high precision with a through-hole diameter of ≤5μm and a depth-to-width ratio of ≥50:1, achieving international leading standards in quality and performance [4][6]. - The upcoming 2025 Heterogeneous Integration Annual Conference, organized by TrendBank, aims to focus on cutting-edge technologies in heterogeneous integration and advanced packaging, fostering collaboration between industry and academia [8].

Core Viewpoint - The article discusses the current state and future potential of Panel Level Packaging (PLP) technology in China, highlighting its market size, key players, and the anticipated growth in the industry [2][3][4]. Market Overview - The existing market size for PLP in China is estimated at 38 million USD, accounting for 20% of the global PLP market, with expectations to exceed 100 million USD by 2028 [2]. - The PLP technology is still in the trial-and-error phase, with major companies expressing high expectations for its future applications in storage and computing chip packaging [2]. Key Players - Major global players in the PLP market include Samsung Electronics, ASE Group, STMicroelectronics, Powertech Technology, Hefei Silan Microelectronics, and Chongqing Silan Microelectronics [2]. - Domestic companies like Silan Microelectronics and Yicheng Technology are emerging as significant competitors, with Silan Microelectronics ranking among the top two in market share for power semiconductor PLP solutions [3]. Technological Development - The article emphasizes that domestic companies are accelerating the development of PLP platforms, preparing for a new technological iteration cycle in the packaging industry over the next 2-3 years [4]. - The focus of the upcoming conference will be on advanced packaging technologies, including multi-material heterogeneous integration and optical-electrical co-packaging [6]. Upcoming Events - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, aimed at fostering collaboration and innovation in the advanced electronic information industry [5][6].

Core Insights - The article emphasizes the growing activity in the optical chip market, driven by the booming demand for artificial intelligence and data centers, highlighting the importance of optical chips in heterogeneous integration technology [2] - TrendBank is organizing significant conferences in November 2025 to focus on advanced packaging technologies and the development of the optical chip industry [4][5] Group 1: Market Overview - The optical chip sector is experiencing increased market activity, with a focus on new materials, processes, and structures for applications ranging from optical communication to cutting-edge optical quantum computing and storage [2] - The article provides a list of global suppliers of optical chip substrate materials, indicating a competitive landscape with various companies involved in the supply chain [3][4] Group 2: Upcoming Events - TrendBank is set to host the 2025 Heterogeneous Integration Annual Conference from November 17-19 in Ningbo, aimed at fostering collaboration and resource pooling in the advanced electronic information industry [4] - The conference will cover core technologies such as multi-material heterogeneous integration and optoelectronic co-packaging, inviting experts from both industry and academia for in-depth discussions [5]

Core Viewpoint - The article emphasizes the significance of heterogeneous integration technology in the semiconductor industry, particularly in response to the increasing demands from artificial intelligence, smart driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference as a platform for collaboration between industry and academia to address key challenges and drive innovation in advanced packaging technologies [2][3][4]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of new semiconductor technologies. Heterogeneous integration is identified as a vital and promising direction in the semiconductor field, especially in the context of the traditional Moore's Law nearing its physical limits [2]. - Ningbo is positioned as a key city for advanced manufacturing, with the Yongjiang Laboratory serving as a provincial-level innovation platform focusing on electronic information materials and micro-nano device preparation [2]. Conference Content - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic integration, 3D heterogeneous integration, and advanced packaging techniques. Experts from both industry and academia will engage in deep research exchanges and discussions on industry topics [3]. Basic Information - The 2025 Heterogeneous Integration Annual Conference is organized by TrendBank and Yongjiang Laboratory, scheduled for November 17-19, 2025, in Ningbo, with an expected attendance of 200-500 participants [4]. Proposed Agenda - The agenda includes closed-door meetings, government speeches, and various forums focusing on topics such as optical communication chip integration, 2.5D/3D chip integration, and advanced packaging technologies [5][7]. Resource Integration - The conference aims to create a collaborative ecosystem that integrates technology, industry, and capital, facilitating discussions among all stakeholders in the semiconductor supply chain [6]. Participation and Services - The conference will feature a combination of large and small meetings to ensure broad discussions on common industry topics while providing private, efficient interaction spaces for specific fields. High-quality services will be emphasized to enhance the overall experience for participants [6].

Core Viewpoint - The article highlights the upcoming Bay Area Semiconductor Industry Ecosystem Expo (Bay Chip Expo 2025), emphasizing its role in showcasing the entire semiconductor industry chain and facilitating international collaboration in technology and innovation [2][11][17]. Group 1: Event Overview - The Bay Chip Expo 2025 will take place from October 15-17 at the Shenzhen Convention Center, covering an exhibition area of 60,000 square meters and featuring over 600 semiconductor companies [2][5]. - The expo aims to integrate the semiconductor industry chain, focusing on wafer manufacturing as a core link, and will present cutting-edge technologies and solutions from IC design to packaging and testing [5][9]. Group 2: Industry Collaboration - The expo will feature a significant international presence, with the number of international exhibitors increasing by over 50% compared to previous years, showcasing the event's growing global appeal [11][13]. - Domestic companies will have the opportunity to engage with international industry leaders, facilitating deep technical exchanges and accelerating the localization and innovation processes in key areas [14][16]. Group 3: Technological Focus - The wafer manufacturing exhibition area will be one of the largest, featuring top companies like ASML, AMAT, and Lam Research, which will demonstrate their strengths and innovations in wafer manufacturing [7][16]. - The event will cover a complete technology display matrix from "equipment - materials - manufacturing," promoting a shift from "single-point innovation" to "system collaboration" within the industry [9][10]. Group 4: Future Initiatives - TrendBank plans to host a heterogeneous integration annual meeting from November 17-19, 2025, focusing on advanced packaging technologies and aiming to establish Ningbo and the Yangtze River Delta as a hub for the advanced electronic information industry [25].

Core Insights - Hengkun New Materials Technology Co., Ltd. successfully passed the IPO meeting on August 29, with a total fundraising amount reduced to 1,006.695 million yuan, allocating 400 million yuan for the second phase of precursor projects and 607 million yuan for advanced materials projects [2][3] Group 1: Business Overview - Hengkun New Materials' main business includes self-produced products (including photoresist materials and precursor materials) and introduced products, with self-produced photoresist sales revenue showing a steady growth from 122 million yuan in 2021 to 300 million yuan in 2023 [3] - The main revenue sources are SOC and BARC, with SOC expected to account for 77.46% of revenue in 2024, while BARC is projected to contribute 15.35% [3] Group 2: Product and Market Dynamics - The KrF photoresist is primarily sourced from imports, with a projected revenue of 129 million yuan in 2024, accounting for 87.78% of the introduced products [5] - The demand for semiconductor photoresists in mainland China is expected to exceed 2,316 tons by 2025, driven by the rapid growth of AI and high-performance computing [9] Group 3: Supply Chain and Raw Materials - Hengkun New Materials relies heavily on imported raw materials, with procurement amounts for 2022, 2023, and 2024 being 252 million yuan, 173 million yuan, and 79 million yuan respectively [8] - The top five suppliers for key raw materials are expected to account for 66.03% of procurement in 2024, indicating a need for improved supply chain stability through R&D and partnerships [8] Group 4: Industry Events and Future Outlook - An upcoming conference on heterogeneous integration technology is scheduled for November 17-19, 2025, aimed at fostering collaboration and innovation in advanced electronic information industries [10]

Core Viewpoint - The article discusses the advancements in three-dimensional heterogeneous integration technology for chips, emphasizing the importance of thermal management solutions in enhancing chip performance and addressing challenges related to heat dissipation [2][6]. Group 1: Three-Dimensional Heterogeneous Integration - The continuous miniaturization of AI computing chips and the doubling of transistor and interconnect density have led to the emergence of advanced packaging technologies, with three-dimensional heterogeneous integration becoming a key direction for improving chip performance [2]. - The introduction of vertical stacking of chips and copper-copper hybrid bonding processes has increased power density, making thermal management a critical consideration in chip packaging design [2][6]. Group 2: Thermal Interface Materials (TIMs) - Current commonly used TIMs include thermal grease and thermal pads, each with its advantages and limitations. Thermal grease has good flowability and filling capacity but limited thermal conductivity and can suffer from "pump-out effect" over time. Thermal pads are easier to install but are typically thicker and have higher contact thermal resistance due to limited elastic deformation [4]. - Innovative TIMs such as liquid metal TIMs (e.g., indium and gallium alloys) and nanostructured TIMs (e.g., carbon nanotubes, graphene) are being explored. Liquid metal TIMs offer significantly higher thermal conductivity (20-80 W/(m·K)) compared to traditional TIMs, while nanostructured TIMs exhibit excellent thermal performance but come with higher costs and reliability concerns [5]. Group 3: Upcoming Conferences and Industry Collaboration - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on cutting-edge technologies in heterogeneous integration and advanced packaging, aiming to foster collaboration between industry and academia [6]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging technologies like TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [6]. Group 4: Advanced Cooling Solutions - The article highlights the limitations of air cooling for high-performance components, leading to the adoption of liquid cooling solutions, including immersion cooling and microfluidic cooling systems, which provide more efficient heat dissipation [8]. - Microfluidic cooling involves the use of internal microchannels to circulate coolant, enhancing heat absorption from components like CPUs, which is particularly important for three-dimensional stacked silicon wafers [8]. Group 5: Material Innovations - The use of glass-based packaging substrates and SiC ceramic substrates is being explored as alternatives to organic IC substrates, offering better thermal conductivity and reduced thermal accumulation, which could improve heat dissipation capabilities [8]. - The potential for industrial application of these materials is projected for around 2030, with ongoing assessments of process compatibility [8].