"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 添加文末微信，加 异质异构集成产业 群 当AI算力浪潮席卷全球，芯片设计的边界正延伸至封装层面。政策层面频频强调要加快关键工艺、装备与工业软件的协同创新，推动核心环节自 主可控。 算力需求激增、制程红利趋弱，产业焦点正在从"制程竞速"转向"系统协同"。 Chiplet与2.5D/3D先进封装成为算力持续增长的关键路径， 而 支撑其落地的"跨层协同"，正成为国产先进封装的新命题。 国际巨头早已展开布局——NVIDIA、AMD、Intel等通过STCO实现系统级优化，竞争焦点已从"谁的设备更先进"，转向"谁协同得更快、更准、 更高效"。 对中国而言，这正是一扇战略窗口：我们在制程上受限，但在封装、设计与EDA环节拥有同步起跑的机会。 谁能率先建立协同机制，谁就能定 义国产先进封装的未来。 展区中的协同样本 从"单点突破"到"系统协同" 湾芯展的热度背后，折射出一个行业共识：先进封装的竞争，正从单环节突破走向全链条协同。 在AI驱动的算力时代 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 添加文末微信，加 异质异构集成产业 群 随着高性能计算、光通信以及传感器行业技术与市场需求快速扩张，异构集成技术正在加速迭代，从 2D异构集成到2.5D芯粒集成，再到3D堆叠 集成，并向3.5D系统集成拓展，索尼、台积电、三星、英特尔以及AMD等芯片大厂都在竞相开发异构集成工艺。 同时，会中设置了混合键合相关议题，且目前已有 青禾晶元、芯慧联芯、 迈为科技、拓荆键科、 EVG Group 五家混合键合相关企业确认出席本次大 会并将发表相关演讲。 母凤文 青禾晶元半导体科技(集团) 有限责任公司 创始人兼董事长 演讲主题: 先进封装时代的半导体混合键合集 成技术 2025异质异构集成年会 ◎ 浙江·宁波 扫描二维码报名 左右滑动查看更多 会 议 日 程 在 2D异构集成路线中，倒装芯粒直接并排键合至RDL/有机IC载板封装，通过回流焊工艺，C4 Bump间距在150～110μm，随着集成技术精进， 通过热压键合及毛细填充工艺，C4 Bum ...

Core Viewpoint - The establishment of testing standards for extreme ultraviolet (EUV) photoresists is crucial for the development of China's semiconductor industry, particularly as the country aims for self-sufficiency in advanced chip manufacturing [2][3]. Group 1: Standards and Testing Methods - The National Standardization Administration has announced three key standards related to photoresists, including methods for testing EUV photoresists, which are essential for semiconductor manufacturing at nodes of 3 nm and below [2][3]. - The EUV photoresist testing standard will systematically integrate material characteristics and performance parameters, focusing on critical performance indicators such as purity, etch resistance, line edge roughness, and sensitivity [3]. Group 2: Industry Implications - The development of these standards is significant as China's current domestic production rate of EUV photoresists is nearly zero, and the R&D efforts are still in the early stages [3]. - Establishing a unified testing methodology will not only fill the technical standard gap in the EUV photoresist field but also provide an objective benchmark for performance evaluation, promoting innovation in the domestic photoresist industry [3]. Group 3: Upcoming Events - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [4][5].

Core Insights - Xi'an Yiswei Materials Technology Co., Ltd. has officially listed on the STAR Market, marking a significant milestone as the first company to go public under the new "growth tier" and the first hard tech company to successfully IPO with an "unprofitable" status after the release of the "STAR Market Eight Policies" [2][4] - The company raised a total of 4.636 billion yuan, the largest fundraising amount among new listings on the STAR Market this year and the second largest among all new A-share listings [2] - Xi'an Yiswei specializes in the research, development, manufacturing, and sales of 12-inch electronic-grade silicon wafers, which are essential for various applications in electronics and new energy vehicles [6][7] Company Overview - Xi'an Yiswei is a leading provider of 12-inch silicon wafers, with a monthly shipment volume accounting for approximately 6% of the global market and 30% of the domestic market, ranking sixth globally and first in China [9] - The funds raised from the IPO will be used entirely for the second phase of the Xi'an Yiswei silicon industry base project, aimed at expanding production capacity and enhancing technological capabilities [9] - By 2026, the company expects to achieve a production capacity of 1.2 million wafers per month, with a projected global market share exceeding 10% [9] Industry Context - The silicon wafer is considered the "foundation" of chip manufacturing and is the most demanded material in wafer production, resonating with the global semiconductor market [7] - The successful listing of Xi'an Yiswei represents a significant breakthrough in the localization process of semiconductor materials in China [7] - The upcoming 2025 Heterogeneous Integration Annual Conference, organized by TrendBank, aims to focus on advanced packaging technologies and foster collaboration between industry and academia to drive innovation [10]

Core Insights - Jiangsu Yingsu Integrated Circuit Equipment Co., Ltd. focuses on addressing technical shortcomings in China's electronic industry, particularly in PCB and semiconductor lithography equipment, achieving significant results in these areas [2][4] - The FEM series of FPD laser direct writing exposure equipment plays a crucial role in panel manufacturing, enhancing quality and yield while reducing production costs, thus contributing to China's competitiveness in the global high-end market [2][6] Company Overview - Established in 2014, Jiangsu Yingsu has received national recognition as a specialized and innovative small giant and high-tech enterprise, with over 100 patents [2] - The FEM series covers full-size exposure technology from G4 to G10.5 generation lines, significantly increasing market recognition through deep collaborations with leading domestic panel manufacturers [4] Technological Advancements - The FEM series addresses the "bottleneck" issues in upstream panel equipment, previously reliant on international giants, by providing stable performance and precise exposure capabilities [6][7] - Key applications include micro-level line width engraving on ultra-thin glass, improving yield rates for flexible OLED mask plates, and supporting large-size panel mass production [6][7] R&D Achievements - The development team overcame challenges such as limited technical resources and experimental conditions, achieving breakthroughs in technology and optimizing design solutions [8] - The FEM series not only matches international counterparts in performance but also offers competitive pricing and after-sales service, breaking the monopoly of foreign equipment [8] Future Outlook - Jiangsu Yingsu aims to become a global leader in microelectronics equipment, focusing on R&D in integrated circuit lithography and measurement equipment, while enhancing strategic partnerships with leading panel manufacturers [9] - The company is positioned to transition China's microelectronics equipment industry from a "follower" to a "leader" in the global market [9] Strategic Initiatives - The company emphasizes 100% independent research and development of core components to eliminate reliance on imports and ensure supply chain security [14] - It offers customized services that combine equipment and process solutions to meet diverse customer needs, enhancing innovation capabilities [14]

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [10][12]. Event Details - The conference will take place from November 17 to 19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, aiming to create a high ground for advanced electronic information industry in Ningbo and the Yangtze River Delta region [10][13]. - The event will feature a series of discussions and presentations on cutting-edge topics related to heterogeneous integration and advanced packaging technologies [12][13]. Conference Agenda - The agenda includes a closed-door meeting on heterogeneous integration, government speeches, and various technical discussions on topics such as advanced packaging trends, optical chip innovations, and the challenges of heterogeneous integration technology [3][5][6]. - Notable speakers include experts from various organizations, including Alibaba Cloud, COMSOL, and Zhejiang University, discussing topics like optical interconnect solutions and advanced semiconductor manufacturing techniques [5][6][10]. Industry Context - The conference is positioned against the backdrop of increasing demands for chip performance, power consumption, and cost efficiency driven by applications in artificial intelligence and high-performance computing [10]. - Heterogeneous integration is highlighted as a crucial direction for the semiconductor industry, especially in the context of 2.5D/3D integration and optical-electrical co-packaging [10][12]. Participation and Costs - The conference is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [13][14].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on advanced packaging technologies in the semiconductor industry, particularly heterogeneous integration and multi-material integration [14][18]. Conference Overview - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, with an expected attendance of 300-500 participants [18]. - The event aims to gather industry and academic experts to discuss cutting-edge technologies in heterogeneous integration and advanced packaging [16]. Key Topics and Presentations - COMSOL's China Technical Manager, Zhong Zhenhong, will present on "The Application of COMSOL Multiphysics® in Advanced Packaging of Semiconductors" [2]. - The conference will cover various topics including 2.5D/3D heterogeneous integration, optical-electrical co-packaging, and wafer-level bonding technologies [16][14]. Industry Context - Heterogeneous integration is becoming a crucial direction in the semiconductor field, especially as traditional Moore's Law approaches physical limits [14]. - The conference aims to address the challenges and opportunities presented by new semiconductor technologies driven by applications in artificial intelligence, smart driving, and high-performance computing [14]. Supporting Organizations - The conference is supported by the Ningbo Electronic Industry Association and other local organizations, highlighting the collaborative effort to enhance the semiconductor industry in the Ningbo and Yangtze River Delta regions [14][18]. Registration and Fees - Registration fees are set at RMB 2500 per person, with early bird discounts available [19].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Conference, focusing on the theme of "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" to promote the development of the advanced electronic information industry in Ningbo and the Yangtze River Delta region [5][15]. Summary by Sections Conference Overview - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, with an expected attendance of 300-500 participants [18]. - The event is co-hosted by TrendBank and the Yongjiang Laboratory, with support from the Ningbo Electronic Industry Association [18]. Keynote Speakers and Topics - Ma Weidong, Deputy General Manager of Wuhan Guangxun Technology Co., will present on "Development Trends and Challenges of Optical Chips for CPO" [1]. - Various topics will be covered, including heterogeneous integration processes, advanced packaging trends, and challenges in micro-nano devices [10][11]. Industry Context - The conference aims to address the challenges posed by artificial intelligence, smart driving, and high-performance computing applications, which demand new semiconductor technologies [14]. - Heterogeneous integration is highlighted as a significant and promising direction in the semiconductor field, particularly in 2.5D/3D integration and optical-electrical co-packaging [14]. Event Activities - The event will include a closed-door meeting for industry stakeholders, a ribbon-cutting ceremony for the Yongjiang Laboratory's micro-nano platform verification line, and various forums discussing advanced packaging technologies [9][10][16]. Registration and Fees - The registration fee is set at RMB 2500 per person, with early bird discounts available [17]. Students can obtain a discounted rate of RMB 1500 [17].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference, focusing on the theme of "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" to promote the development of the advanced electronic information industry in Ningbo and the Yangtze River Delta region [18][20]. Group 1: Conference Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [22]. - The event is organized by the Yongjiang Laboratory and TrendBank, with support from the Ningbo Electronic Industry Association [22]. - The expected attendance is between 300 to 500 participants [22]. Group 2: Key Themes and Topics - The conference will cover core technologies related to multi-material heterogeneous integration and optoelectronic fusion, focusing on advanced packaging technologies such as 2.5D/3D heterogeneous integration, optical-electrical co-packaging, and wafer-level bonding [20]. - Notable topics include the challenges and trends in heterogeneous integration processes, materials equipment, and the development of advanced packaging solutions [14][20]. Group 3: Featured Speakers and Presentations - Dr. Dustin Ho, Technical Project Director at Applied Materials, will present on "The Application of New Optical Waveguide Technology in Silicon Photonics/CPO" [2]. - Various industry experts will discuss topics such as AI-driven opportunities in chip integration, micro-nano device applications, and the latest advancements in optical technology [14][15][16]. Group 4: Background and Industry Context - The conference aims to address the stringent requirements for chip design and manufacturing driven by applications in artificial intelligence, smart driving, and high-performance computing [18]. - As traditional Moore's Law approaches its physical limits, heterogeneous integration is identified as a crucial and promising direction in the semiconductor field [19].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [7][8]. Event Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [8]. - The event aims to gather industry and research experts to discuss advanced packaging technologies and promote collaboration between the semiconductor industry and research institutions [9]. Conference Agenda - The agenda includes various sessions on topics such as CIS heterogeneous integration processes, 2.5D/3D chip integration, and the impact of artificial intelligence on chip interconnects [3][4]. - Keynote speeches will be delivered by government leaders and representatives from the organizing bodies [3]. Focus Areas - The conference will emphasize multi-material heterogeneous integration, optoelectronic integration, and advanced packaging technologies, including TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [9]. - Discussions will also cover challenges and innovations in semiconductor materials and equipment [9]. Registration and Fees - The registration fee is RMB 2500 per person, with early bird discounts available for those who register before October 31 [10]. - Special pricing is offered for students at RMB 1500 [10].