Core Insights - The article discusses the advancements in thin-film lithium niobate (TFLN) and thin-film lithium tantalate (TFLT) as leading materials in integrated photonics, highlighting their unique properties such as low optical loss and high electro-optic coefficients, enabling modulation bandwidths exceeding 100 GHz [2] - A new silicon (Si) Mach-Zehnder modulator (MZM) based on heterogeneous integration of TFLT is proposed, showcasing competitive characteristics compared to devices using single-chip TFLT technology [2][3] Technical Developments - The device consists of a hybrid SiN/LT MZM, designed using a standard process design kit (PDK) on a Si photonic chip, with LT integrated via micro-transfer printing [3] - The measured insertion loss and propagation loss in the 7 mm long arm of the modulator total 2.9 dB, with a low half-wave voltage (Vπ) of 3.5 V achieved in push-pull configuration [3] - The modulator demonstrates a working bandwidth exceeding 70 GHz, validated through data transmission experiments using arbitrary waveform generators and photodiodes [3][5] Industry Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration in the electronic information industry [6][7] - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging technologies like TGV and FOPLP [7]

Core Viewpoint - The article discusses the acquisition plan of Huada Technology to purchase assets from Huayi Microelectronics, highlighting the potential for synergy in the power semiconductor sector and the expected growth in the semiconductor market driven by AI technologies [2][6][7]. Group 1: Acquisition Details - Huada Technology is planning to issue shares and cash to acquire Huayi Microelectronics, a subsidiary of its controlling shareholder, Tianshui Huada Electronics Group [4]. - The acquisition is expected to enhance Huada Technology's capabilities in the power semiconductor market, potentially positioning it among the top players in China [6]. Group 2: Financial Performance - Huayi Microelectronics reported revenues of 847 million, 1.16 billion, and 1.157 billion yuan from 2020 to 2022, with net profits of 41.63 million, 88.13 million, and a loss of 43.21 million yuan during the same period [6]. - The R&D investment of Huayi Microelectronics was relatively low, accounting for 3.98%, 3.94%, and 5.03% of revenue from 2020 to 2022, raising questions about the potential for achieving synergies post-acquisition [6]. Group 3: Market Outlook - Huada Technology's revenue for the first half of the year reached 7.78 billion yuan, a year-on-year increase of 15.81%, with net profit growing by 1.68% to 226 million yuan [7]. - The semiconductor market is expected to see significant demand recovery, driven by advancements in AI and related technologies, with a positive growth outlook for the global semiconductor market [7]. Group 4: Upcoming Events - An annual conference focusing on heterogeneous integration technology will be held from November 17-19, 2025, in Ningbo, aimed at fostering collaboration and innovation in the semiconductor industry [2][8].

Core Viewpoint - The article discusses the advancements and market potential of glass substrates in semiconductor packaging, highlighting their advantages over traditional materials and the expected growth in the market size from $213 million in 2024 to over $400 million by 2030 [3]. Group 1: Market Overview - The global semiconductor packaging glass substrate market is projected to reach approximately $213 million in 2024, with expectations to exceed $400 million by 2030, indicating a penetration rate of over 2% [3]. - Transitioning substrate sizes from 200mm to 300mm can save about 25% in costs, while moving from 300mm to board-level can achieve over 60% cost reduction [2]. Group 2: Advantages of Glass Substrates - Glass substrates offer superior surface flatness and low roughness, making them suitable for high-precision lithography and micro-line processing [3]. - They exhibit low warpage and high resistance to deformation due to adjustable thermal expansion coefficients, which can be aligned closely with silicon chips [3]. - The electrical performance of glass substrates is enhanced, reducing signal loss during transmission, which is crucial for high-speed applications [3]. - Glass substrates have better thermal conductivity compared to organic substrates, improving heat management in electronic systems [3]. - They possess excellent chemical stability, resisting moisture and environmental corrosion [3]. Group 3: Industry Developments - Several companies are actively developing glass substrate technologies, including Beijing BOE Sensor Technology, Jiangxi Woge Optoelectronics, and Wuhan Xinchengyuan Semiconductor, each focusing on different aspects of glass substrate applications [4][5][6]. - Shenzhen Deep Light Valley Technology has successfully established a production line for glass-based 3D optical waveguide chips, indicating advancements in the field [6]. - The industry is witnessing a trend towards integrating glass substrates in high-end semiconductor packaging, with companies like Xiamen Yuntian Semiconductor and Chongqing Glass Core Semiconductor planning significant production expansions [5][6]. Group 4: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7].

Core Viewpoint - The establishment of the AIC Fund marks a significant breakthrough in the investment landscape of Ningbo, focusing on strategic emerging industries such as digital industry, artificial intelligence, new energy vehicles, high-end manufacturing, biomedicine, and new materials [4][6]. Group 1: AIC Fund and Investment - The AIC Fund has a total scale of 2 billion yuan, successfully completing its first investment in Shanghai Tongchuang Purun New Materials Co., Ltd., which specializes in ultra-high purity metal materials for semiconductor applications [4][6]. - The invested company, Tongchuang Purun, is a subsidiary of Jiangfeng Electronics, a leading global supplier of sputtering targets, and aims to address the domestic supply chain issues for target materials [4][6]. - The successful investment lays a solid foundation for the fund's future operations, with nearly ten quality projects currently in reserve [6]. Group 2: Ningbo's Innovation and Development Strategy - The Ningbo Jiangdong Science and Technology Innovation Zone is a major strategic area aimed at becoming a world-class innovation center, focusing on talent aggregation and innovation-driven development [6][8]. - The zone covers an area of 197 square kilometers and is designed to foster a robust innovation ecosystem, housing 51% of the city's provincial and ministerial-level innovation platforms and 84% of top talents [8]. - The zone is actively promoting emerging industries and planning future industries, with a focus on new materials, industrial internet, and intelligent manufacturing [8]. Group 3: Upcoming Events and Industry Focus - The TrendBank plans to hold the Heterogeneous Integration Annual Conference from November 17-19, 2025, to discuss advanced packaging technologies and foster collaboration between industry and academia [9][10]. - The conference will focus on core technologies such as multi-material heterogeneous integration and optoelectronic integration, inviting experts for in-depth discussions [10].

Core Viewpoint - The article discusses the advancements and competitive landscape in the glass substrate market, particularly focusing on glass core substrates and interposers used in semiconductor packaging, highlighting the transition towards panel-level forms and the implications for supply chain dynamics [2][4][5]. Group 1: Technology and Market Dynamics - Glass core substrates are primarily competing with organic IC substrates, while glass interposers are competing with organic and silicon interposers, with both technologies showing similar manufacturing processes [2][4]. - PLP (Panel Level Packaging) technology is an early commercial advanced packaging direction that allows for finer metal wiring compared to metal substrates, indicating a trend towards more sophisticated packaging solutions [2][4]. - The interconnectivity of processes between glass core substrates and PLP technology is expected to alter the supply chain dynamics and increase demand for related products [4][5]. Group 2: Future Trends and Industry Players - As demand and penetration rates grow, the need for advanced lithography equipment in glass core substrates and PLP technology is anticipated to rise, with a focus on materials like ABF or PI dielectric layers [5]. - Major international players such as Intel and Samsung are investing in both glass core substrates and PLP technology, alongside domestic companies like Yicheng Technology and Guanzhi Semiconductor [6]. - A significant event, the 2025 Heterogeneous Integration Annual Conference, is planned to focus on advanced packaging technologies, aiming to foster collaboration and innovation within the industry [7].

Core Insights - The global IC substrate market is expected to grow moderately at a rate of 3.6%, reaching a revenue scale of $13.489 billion in 2024, with demand for ABF substrates and high-end BT substrates driven by AI data center and edge AI product upgrades, projected to reach $14.837 billion in 2025 [2] - The Chinese IC substrate market is rapidly emerging, with a revenue scale of $1.038 billion, reflecting a year-on-year growth of 34.9%. However, local companies mainly focus on MEMS, RF, and storage substrates, while high-end FCBGA substrates using ABF film are still dominated by international manufacturers [2][4] Industry Developments - ABF film, a high-performance insulating film in semiconductor packaging, consists of a PET substrate film and ABF resin, which includes epoxy resin or polyimide, curing agents, and special fillers [3] - Domestic companies have made progress in the localization of ABF film but are still in a catch-up phase [4] Company Progress - Major companies are advancing in the development of ABF film products: - Ajinomoto holds over 95% of the global market share and continues to innovate ABF film products to meet higher-end chip packaging demands [6] - Sekisui Chemical is developing self-researched insulating film materials for FC-BGA substrates [6] - Tainan Build-up Film (TBF) by Jinghua Technology has passed validation from multiple domestic and international packaging substrate manufacturers [6] - Panasonic is producing layered materials for semiconductor packaging substrates [6] - Wuhan Sanxuan Technology is one of the early domestic players in the research and development of dielectric materials for chip packaging [6] - Guangdong Yipas New Materials is entering the high-end packaging field with EBF and TPF films [6] - Other companies like Guangdong Shengyi Technology and Xi'an Tianhe Defense are also making strides in developing ABF-like films and have begun small-scale production [6] Upcoming Events - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7]

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 在封装技术的发展历程中 ，晶圆级封装 (WLP) 和倒装芯片技术 是近十年来应用的主流技术手段。 然而，随着器件尺寸越来越小、越来越复 杂，这些方法在可扩展性和成本效益方面已开始达到极限 ， 开发 更为先进或局限性更小的技术路线已成为了当下亟待突破之事 。 其中， PLP 是一种先进的自动化芯片封装和测试工艺技术，可提高生产效率并降低成本，是打造下一代更小、更强大、更具成本效益的电子 设备的关键技术。 且 PLP 中的大面积载体（用大尺寸矩形晶圆代替圆形晶圆）可提高生产吞吐量，使其成为更高效的大批量生产解决方 案。 而 面板级封装 (PLP-DCI) 是一种将多个 IC 封装在单个更大的矩形基板上，而不是单个圆形晶圆上的方法。这种方法可以同时处理更多 IC，从而降低成本并提高产量。 同时 PLP-DCI 还允许在高 ...

Core Viewpoint - The article discusses the rapid development and market potential of silicon photonics technology, highlighting its significance in high-speed optical modules and its projected growth in the semiconductor market by 2030 [2][3]. Group 1: Market Potential and Growth - The global silicon photonics semiconductor market is expected to reach $7.86 billion by 2030, with a compound annual growth rate (CAGR) of 25.7% [2]. - Silicon photonic chips are favored in key applications such as 5G communication, AI data centers, and autonomous driving due to their high integration, low cost, and high transmission bandwidth [2]. Group 2: Components of Silicon Photonic Chips - Silicon photonic chips consist of four key components: - Light source, typically using lasers or LEDs, which generates photons through specific doping or III-V compound materials [3]. - Waveguides, which direct the light along specific paths for efficient data transmission [3]. - Modulators, which alter the light signal's intensity, frequency, or phase to encode electrical signals into optical signals [3]. - Detectors, which convert received light signals back into electrical signals [3]. Group 3: Manufacturing Challenges - The performance of silicon photonic devices is sensitive to manufacturing precision, with minor errors potentially leading to significant performance degradation [4]. - There is a need for targeted optimization of silicon photonic manufacturing processes to enhance waveguide edge smoothness and improve device performance and reliability [4]. Group 4: Upcoming Events and Initiatives - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on advanced packaging technologies and fostering collaboration between industry and academia [5].

Core Viewpoint - The article emphasizes the growing demand for advanced packaging materials in the semiconductor industry, particularly focusing on the evolution of molding compounds and the challenges posed by new technologies and applications [2][6]. Group 1: Advanced Packaging Applications - The shift from traditional wire bonding packaging to advanced packaging methods such as wafer-level packaging, panel-level packaging, 2.5D/3D heterogeneous integration, and system-level packaging requires molding compounds to have higher flatness, lower warpage, and better fine-pitch filling capabilities [2]. - The increasing frequency and speed requirements from applications like 5G and AI necessitate low dielectric constant and low dielectric loss molding compounds to minimize signal transmission delays and losses [3]. Group 2: Thermal Management and Reliability - Power devices, such as IGBTs used in electric vehicles, generate significant heat, leading to a need for ultra-high thermal conductivity molding compounds [4]. - Industries like automotive electronics and aerospace demand components that can operate in extreme environments for over 15 years, placing extreme reliability requirements on materials [5]. Group 3: Environmental Considerations - There is a push towards developing more environmentally friendly formulations, such as halogen-free, antimony-free, and bio-based materials, in response to sustainability concerns [6]. Group 4: Market Landscape - China, as a leading player in the global packaging and testing manufacturing industry, has the largest demand for epoxy molding compounds, yet local supply capabilities are limited, particularly for mid-to-high-end products like wafer-level packaging materials, which still rely on imports or foreign enterprises' production bases in China [6]. - Currently, there are 18 major enterprises competing in the packaging molding materials market in China, with total annual production capacity exceeding 210,000 tons [6]. Group 5: Industry Events and Collaboration - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on cutting-edge heterogeneous integration technologies and aiming to foster collaboration within the advanced electronic information industry [7][8].

Core Viewpoint - The article discusses the commercialization and development stages of panel-level packaging (PLP) technology, highlighting its potential advantages over traditional wafer-level packaging (WLP) and the challenges it faces in the industry [2][3][6]. Group 1: Panel-Level Packaging Development - Panel-level packaging is currently in the industry cultivation stage, focusing on application scenario development, with the first phase targeting discrete devices and power SiP adopting PLP technology [3]. - The second phase involves the integration of mixed-signal multi-chip packaging into PLP technology, primarily for consumer electronics and IoT products [3]. - The final phase will see the introduction of memory-compute integrated chips using PLP technology, expected to commence in 3-5 years, marking the competitive phase against wafer-level 2.5D/3D packaging [3]. Group 2: Technical and Operational Challenges - Panel-level packaging faces high operational costs, poor technical stability, and an incomplete industrial ecosystem, which are significant barriers to its widespread adoption [6]. - The large size of the panels complicates the chip placement and bonding processes, increasing the difficulty of controlling displacement, line width, and stress [6]. - Establishing a panel-level packaging ecosystem requires new equipment and material supply chains, which necessitates substantial investment, particularly in high-end memory-compute integrated chip sectors [6]. Group 3: Upcoming Events and Industry Collaboration - TrendBank plans to host the Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7]. - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced packaging techniques like TGV and FOPLP [7].