Group 1 - The article highlights the successful bulk delivery of Panel-level Glass Through Via (TGV) equipment by Dazhu Semiconductor to multiple clients, emphasizing the equipment's high stability and reliability, which supports immediate production and technological advancement [2][4]. - Dazhu Semiconductor's TGV equipment has overcome significant challenges in processing large glass substrates, improving product yield and paving the way for the mass production of the next generation of Chiplet packaging [4]. - The newly developed femtosecond laser-enhanced glass etching technology (FLEE) by Dazhu Semiconductor has increased processing area by 300% and reduced packaging costs by 40%, enhancing efficiency in mass production [4][6]. Group 2 - The FLEE-TGV equipment can process various hole types and sizes, with a maximum processing size of 730mm x 920mm, making it suitable for advanced packaging, display manufacturing, consumer electronics, and life sciences [6]. - The equipment features high precision with a through-hole diameter of ≤5μm and a depth-to-width ratio of ≥50:1, achieving international leading standards in quality and performance [4][6]. - The upcoming 2025 Heterogeneous Integration Annual Conference, organized by TrendBank, aims to focus on cutting-edge technologies in heterogeneous integration and advanced packaging, fostering collaboration between industry and academia [8].

Core Viewpoint - The article discusses the current state and future potential of Panel Level Packaging (PLP) technology in China, highlighting its market size, key players, and the anticipated growth in the industry [2][3][4]. Market Overview - The existing market size for PLP in China is estimated at 38 million USD, accounting for 20% of the global PLP market, with expectations to exceed 100 million USD by 2028 [2]. - The PLP technology is still in the trial-and-error phase, with major companies expressing high expectations for its future applications in storage and computing chip packaging [2]. Key Players - Major global players in the PLP market include Samsung Electronics, ASE Group, STMicroelectronics, Powertech Technology, Hefei Silan Microelectronics, and Chongqing Silan Microelectronics [2]. - Domestic companies like Silan Microelectronics and Yicheng Technology are emerging as significant competitors, with Silan Microelectronics ranking among the top two in market share for power semiconductor PLP solutions [3]. Technological Development - The article emphasizes that domestic companies are accelerating the development of PLP platforms, preparing for a new technological iteration cycle in the packaging industry over the next 2-3 years [4]. - The focus of the upcoming conference will be on advanced packaging technologies, including multi-material heterogeneous integration and optical-electrical co-packaging [6]. Upcoming Events - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, aimed at fostering collaboration and innovation in the advanced electronic information industry [5][6].

Core Insights - The article emphasizes the growing activity in the optical chip market, driven by the booming demand for artificial intelligence and data centers, highlighting the importance of optical chips in heterogeneous integration technology [2] - TrendBank is organizing significant conferences in November 2025 to focus on advanced packaging technologies and the development of the optical chip industry [4][5] Group 1: Market Overview - The optical chip sector is experiencing increased market activity, with a focus on new materials, processes, and structures for applications ranging from optical communication to cutting-edge optical quantum computing and storage [2] - The article provides a list of global suppliers of optical chip substrate materials, indicating a competitive landscape with various companies involved in the supply chain [3][4] Group 2: Upcoming Events - TrendBank is set to host the 2025 Heterogeneous Integration Annual Conference from November 17-19 in Ningbo, aimed at fostering collaboration and resource pooling in the advanced electronic information industry [4] - The conference will cover core technologies such as multi-material heterogeneous integration and optoelectronic co-packaging, inviting experts from both industry and academia for in-depth discussions [5]

Core Viewpoint - The article emphasizes the significance of heterogeneous integration technology in the semiconductor industry, particularly in response to the increasing demands from artificial intelligence, smart driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference as a platform for collaboration between industry and academia to address key challenges and drive innovation in advanced packaging technologies [2][3][4]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of new semiconductor technologies. Heterogeneous integration is identified as a vital and promising direction in the semiconductor field, especially in the context of the traditional Moore's Law nearing its physical limits [2]. - Ningbo is positioned as a key city for advanced manufacturing, with the Yongjiang Laboratory serving as a provincial-level innovation platform focusing on electronic information materials and micro-nano device preparation [2]. Conference Content - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic integration, 3D heterogeneous integration, and advanced packaging techniques. Experts from both industry and academia will engage in deep research exchanges and discussions on industry topics [3]. Basic Information - The 2025 Heterogeneous Integration Annual Conference is organized by TrendBank and Yongjiang Laboratory, scheduled for November 17-19, 2025, in Ningbo, with an expected attendance of 200-500 participants [4]. Proposed Agenda - The agenda includes closed-door meetings, government speeches, and various forums focusing on topics such as optical communication chip integration, 2.5D/3D chip integration, and advanced packaging technologies [5][7]. Resource Integration - The conference aims to create a collaborative ecosystem that integrates technology, industry, and capital, facilitating discussions among all stakeholders in the semiconductor supply chain [6]. Participation and Services - The conference will feature a combination of large and small meetings to ensure broad discussions on common industry topics while providing private, efficient interaction spaces for specific fields. High-quality services will be emphasized to enhance the overall experience for participants [6].

Core Viewpoint - The article highlights the upcoming Bay Area Semiconductor Industry Ecosystem Expo (Bay Chip Expo 2025), emphasizing its role in showcasing the entire semiconductor industry chain and facilitating international collaboration in technology and innovation [2][11][17]. Group 1: Event Overview - The Bay Chip Expo 2025 will take place from October 15-17 at the Shenzhen Convention Center, covering an exhibition area of 60,000 square meters and featuring over 600 semiconductor companies [2][5]. - The expo aims to integrate the semiconductor industry chain, focusing on wafer manufacturing as a core link, and will present cutting-edge technologies and solutions from IC design to packaging and testing [5][9]. Group 2: Industry Collaboration - The expo will feature a significant international presence, with the number of international exhibitors increasing by over 50% compared to previous years, showcasing the event's growing global appeal [11][13]. - Domestic companies will have the opportunity to engage with international industry leaders, facilitating deep technical exchanges and accelerating the localization and innovation processes in key areas [14][16]. Group 3: Technological Focus - The wafer manufacturing exhibition area will be one of the largest, featuring top companies like ASML, AMAT, and Lam Research, which will demonstrate their strengths and innovations in wafer manufacturing [7][16]. - The event will cover a complete technology display matrix from "equipment - materials - manufacturing," promoting a shift from "single-point innovation" to "system collaboration" within the industry [9][10]. Group 4: Future Initiatives - TrendBank plans to host a heterogeneous integration annual meeting from November 17-19, 2025, focusing on advanced packaging technologies and aiming to establish Ningbo and the Yangtze River Delta as a hub for the advanced electronic information industry [25].

Core Insights - Hengkun New Materials Technology Co., Ltd. successfully passed the IPO meeting on August 29, with a total fundraising amount reduced to 1,006.695 million yuan, allocating 400 million yuan for the second phase of precursor projects and 607 million yuan for advanced materials projects [2][3] Group 1: Business Overview - Hengkun New Materials' main business includes self-produced products (including photoresist materials and precursor materials) and introduced products, with self-produced photoresist sales revenue showing a steady growth from 122 million yuan in 2021 to 300 million yuan in 2023 [3] - The main revenue sources are SOC and BARC, with SOC expected to account for 77.46% of revenue in 2024, while BARC is projected to contribute 15.35% [3] Group 2: Product and Market Dynamics - The KrF photoresist is primarily sourced from imports, with a projected revenue of 129 million yuan in 2024, accounting for 87.78% of the introduced products [5] - The demand for semiconductor photoresists in mainland China is expected to exceed 2,316 tons by 2025, driven by the rapid growth of AI and high-performance computing [9] Group 3: Supply Chain and Raw Materials - Hengkun New Materials relies heavily on imported raw materials, with procurement amounts for 2022, 2023, and 2024 being 252 million yuan, 173 million yuan, and 79 million yuan respectively [8] - The top five suppliers for key raw materials are expected to account for 66.03% of procurement in 2024, indicating a need for improved supply chain stability through R&D and partnerships [8] Group 4: Industry Events and Future Outlook - An upcoming conference on heterogeneous integration technology is scheduled for November 17-19, 2025, aimed at fostering collaboration and innovation in advanced electronic information industries [10]

Core Viewpoint - The article discusses the advancements in three-dimensional heterogeneous integration technology for chips, emphasizing the importance of thermal management solutions in enhancing chip performance and addressing challenges related to heat dissipation [2][6]. Group 1: Three-Dimensional Heterogeneous Integration - The continuous miniaturization of AI computing chips and the doubling of transistor and interconnect density have led to the emergence of advanced packaging technologies, with three-dimensional heterogeneous integration becoming a key direction for improving chip performance [2]. - The introduction of vertical stacking of chips and copper-copper hybrid bonding processes has increased power density, making thermal management a critical consideration in chip packaging design [2][6]. Group 2: Thermal Interface Materials (TIMs) - Current commonly used TIMs include thermal grease and thermal pads, each with its advantages and limitations. Thermal grease has good flowability and filling capacity but limited thermal conductivity and can suffer from "pump-out effect" over time. Thermal pads are easier to install but are typically thicker and have higher contact thermal resistance due to limited elastic deformation [4]. - Innovative TIMs such as liquid metal TIMs (e.g., indium and gallium alloys) and nanostructured TIMs (e.g., carbon nanotubes, graphene) are being explored. Liquid metal TIMs offer significantly higher thermal conductivity (20-80 W/(m·K)) compared to traditional TIMs, while nanostructured TIMs exhibit excellent thermal performance but come with higher costs and reliability concerns [5]. Group 3: Upcoming Conferences and Industry Collaboration - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on cutting-edge technologies in heterogeneous integration and advanced packaging, aiming to foster collaboration between industry and academia [6]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging technologies like TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [6]. Group 4: Advanced Cooling Solutions - The article highlights the limitations of air cooling for high-performance components, leading to the adoption of liquid cooling solutions, including immersion cooling and microfluidic cooling systems, which provide more efficient heat dissipation [8]. - Microfluidic cooling involves the use of internal microchannels to circulate coolant, enhancing heat absorption from components like CPUs, which is particularly important for three-dimensional stacked silicon wafers [8]. Group 5: Material Innovations - The use of glass-based packaging substrates and SiC ceramic substrates is being explored as alternatives to organic IC substrates, offering better thermal conductivity and reduced thermal accumulation, which could improve heat dissipation capabilities [8]. - The potential for industrial application of these materials is projected for around 2030, with ongoing assessments of process compatibility [8].

Core Viewpoint - The article emphasizes the importance of the "2025-2026 Action Plan for Stable Growth in the Electronic Information Manufacturing Industry," which aims to support advanced technologies and enhance the industry's resilience and innovation capabilities [2][3][4]. Overall Requirements - The plan is guided by Xi Jinping's thoughts and aims to enhance supply chain resilience, promote high-quality development, and balance government and market roles [4][5]. Main Goals - The expected average growth rate for the manufacturing value-added of computers, communications, and other electronic devices is around 7%, with an overall revenue growth rate of over 5% for the electronic information manufacturing industry by 2026 [5][6]. Work Measures Industry Transformation and Upgrade - Focus on high-end electronic products and promote the integration of AI in consumer electronics, enhancing product reliability and quality [6][7]. Optimize Industry Layout - Promote differentiated and characteristic development in line with national strategies, and improve the quality of solar and lithium battery industries [8][9]. Strengthen Upstream and Downstream Coordination - Encourage collaboration between leading enterprises and SMEs, enhancing the reliability of products and services [10][11]. Standardization and Quality Improvement - Accelerate the establishment of industry standards and improve quality management capabilities [12][13]. Intellectual Property Protection - Develop a quality evaluation system for intellectual property and support overseas layout of key technologies [14][15]. Domestic and International Market Circulation Expand New Scenarios - Promote consumer demand through innovative marketing strategies and enhance the consumption of traditional electronic products [16][17]. Cultivate New Business Formats - Strengthen the application of electronic information in various industries, promoting smart products and solutions [18][19]. Encourage Enterprises to Go Global - Utilize international cooperation mechanisms to help electronic information manufacturing enterprises expand into international markets [20][21]. Promote International Resource Introduction - Enhance cooperation with foreign enterprises and improve the business environment for foreign investments [22][23]. Address International Trade Barriers - Leverage domestic market advantages to help enterprises cope with international trade challenges [24][25]. Technology and Industry Innovation Integration Accelerate Major Project Construction - Promote the construction of major projects in the electronic information manufacturing sector to drive high-end and intelligent development [26][27]. Strengthen Integrated Research - Focus on enhancing the safety and stability of supply chains through integrated applications [28][29]. Enhance Basic Technology Research - Support research in key areas such as integrated circuits and advanced computing to maintain a competitive edge [30][31]. Empower Enterprises in Technology Commercialization - Encourage enterprises to take the lead in technology innovation and facilitate collaboration with research institutions [32][33]. Promote Digital Transformation - Implement digital transformation strategies to enhance the competitiveness of the electronic information manufacturing industry [34][35]. Strengthen Talent and Capital Support - Focus on talent development and financial support to foster innovation in the electronic information sector [36][37]. Guarantee Measures - The plan includes various policy implementations and monitoring mechanisms to ensure the effective execution of the action plan [38][39].

Core Viewpoint - The article discusses the advancements in photonic chip technology as a promising solution to the challenges posed by the "post-Moore era" in semiconductor manufacturing, emphasizing the potential for significant improvements in computing power and energy efficiency [3][4][5]. Group 1: Industry Trends - The demand for enhanced intelligent computing capabilities is growing at an exponential rate, surpassing the performance improvements described by Moore's Law [2]. - The traditional electronic computing systems face significant challenges, including the "von Neumann bottleneck," slowing of Moore's Law, and the "power wall" [2]. Group 2: Photonic Chip Technology - Photonic chips utilize light as a carrier to replace electricity, offering higher bandwidth, greater parallelism, and lower energy consumption compared to electronic chips, which can lead to exponential increases in computing power [3]. - The Shanghai Jiao Tong University Wuxi Photonic Chip Research Institute (CHIPX) is a leader in the field, focusing on the development of high-end photonic chips and their industrial applications [4]. Group 3: Technological Advancements - CHIPX has established the first domestic pilot line for photonic chips, achieving low-loss and high-bandwidth performance in lithium niobate photonic chip production, with plans for large-scale production services by the end of the year [4][5]. - The research team at CHIPX has overcome technical bottlenecks in writing speeds, enabling ultra-high-density and large-capacity permanent storage using glass-based media [4]. Group 4: Future Vision - CHIPX aims to drive the fourth industrial revolution through advancements in photonic chips and quantum computing, aspiring to become a world-class center for the photonic industry [5]. - The institute has developed various advanced technologies, including DUV lithography and dry etching processes, to ensure complete control over the photonic chip manufacturing process [5]. Group 5: Industry Collaboration and Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference in November 2025, focusing on advanced packaging technologies and fostering collaboration between industry and academia [14]. - The conference will cover topics such as multi-material heterogeneous integration, optoelectronic co-packaging, and advanced semiconductor materials and equipment [14].

Core Viewpoint - Heterogeneous integration is crucial for modern electronic devices, allowing for smaller, more powerful systems by combining various components into a single package without compromising performance [1][2][3]. Group 1: Importance of Heterogeneous Integration - Heterogeneous integration reduces the size of electronic devices while enhancing functionality by integrating multiple components into a single chip [2]. - It improves data speed and system throughput, which are essential for high-performance computing in AI and 5G systems [3]. - Optimizing individual functions lowers overall power consumption, minimizing power loss, which is vital for battery-powered consumer devices and data centers [4]. - Engineers can now combine specialized components like GaN and integrated photonics, adapting integration requirements for different use cases [5]. - Although initial setup is complex, advanced packaging technologies can reduce manufacturing and assembly costs in the long run [6]. Group 2: How Heterogeneous Integration Works - Each device (CPU, GPU, memory) is manufactured separately using the most suitable processes (e.g., CMOS, GaN), enhancing yield and allowing customization [8]. - Components are mounted on an intermediary layer (passive silicon or organic substrate) that connects chips electrically and mechanically while minimizing latency [9]. - Electrical interconnections between components use techniques like wire bonding, flip-chip, or TSV, ensuring high bandwidth and ultra-fast signal transmission [10]. - Thermal interface materials and signal shielding layers are added to manage heat and reduce interference, ensuring system-level reliability [11]. - The integrated unit is encapsulated in a protective package that meets environmental and mechanical requirements, forming a robust packaging or wafer-level packaging system [12]. Group 3: Key Components in Heterogeneous Integration - Logic and processing units, such as CPUs or SoCs, provide computational control built on advanced nodes for better performance and efficiency [13]. - Memory units like DRAM, SRAM, and HBM are packaged together for high-speed data access, reducing latency and enhancing system performance [14]. - Analog/RF chips manage signal transmission and reception in wireless communication modules, crucial for 5G, radar, and sensor applications [15]. - Integrated photonics is used in data centers and AI to transmit large amounts of data using light instead of electrical signals [16]. - Power management units ensure stable power delivery across devices while minimizing power consumption, especially in battery-operated systems [17]. Group 4: Common Materials Used in Heterogeneous Integration - Widely used semiconductor materials for digital logic and memory [18]. - Gallium Nitride (GaN) is utilized for high-speed power and RF components due to its excellent thermal and electrical properties [18]. - Traditional silicon is combined with photonic circuits for on-chip high-speed optical communication [20]. - Materials for intermediary layers and advanced packaging provide flexibility and lower costs [21]. - Key metals are used for wire bonding, micro-bumps, and interconnections, ensuring reliable electrical contact and heat dissipation [22]. Group 5: Heterogeneous Integration Methods and Challenges - 2.5D integration involves multiple chips mounted on a passive intermediary layer, providing high-density routing for applications like GPUs and AI accelerators [23]. - 3D integration uses TSV or micro-bumps for vertical stacking, minimizing signal delay and improving power efficiency, particularly in high-end processors [23]. - Fan-out wafer-level packaging (FO-WLP) embeds chips into a restructured wafer, allowing for slim designs in smartphones and wearables [23]. - Flip-chip bonding connects chips directly to substrates, offering better performance than traditional wire bonding [23]. - System-in-package (SiP) integrates multiple ICs into a single module, commonly used in consumer electronics like smartwatches and hearing aids [23]. - Challenges include aligning and bonding materials with different thermal and electrical properties, which can lead to stress and failures, as well as managing heat dissipation in densely packed high-power chips [24]. Group 6: Industries Adopting Heterogeneous Integration - The semiconductor industry is shifting towards advanced packaging and heterogeneous integration to overcome the limitations of Moore's Law and push performance boundaries [24]. - Consumer electronics, such as smartphones and AR/VR headsets, require high performance in compact spaces, benefiting from system-level packaging designs [24]. - Implantable and portable diagnostic tools demand minimal power, small size, and high reliability, all supported by heterogeneous integration [25]. - The automotive and electric vehicle sectors utilize multi-functional chip packaging for autonomous vehicles, integrating lidar, radar, AI, and sensors in harsh environments [26]. - Defense and aerospace industries require the integration of analog, RF, and digital logic components for secure, lightweight, and radiation-resistant systems, necessitating specialized expertise [27]. Group 7: Upcoming Events - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [28].