"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 来源：势银（TrendBank） （算力芯片方向，未收录MEMS、CIS等集成制造能力厂商） 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 国际地缘政治因素以及 AI算力芯片需求居高不下的背景下，中国将AI等数据中心用半导体发展上升到国家战略层面，中国地方政府积极响应到 2027年将逐步实现全面去美化。 例如：北京市指出，目标将力争到2027年把数据中心用半导体自给率提高到100%；上海市计划，到2027年，在面向AI等数据中心使用半导体方 面，中国自主控制比率将提高到70%以上；贵州市也要求正在建设、以AI为中心的数据中心，半导体要求约90%中国本土制造。 国产 AI用芯片机遇与挑战并存，所谓机遇是中国政府和本土客户AI用半导体需求旺盛，转至本土AI芯片订单比例提升；挑战是本土AI芯片产品竞 争力和可靠性相较于英伟达等国际大厂较差，本土半导体尖端制造供应链能 ...

Core Viewpoint - The article emphasizes the growing importance of chiplet integration technology and the shift towards advanced packaging techniques in the semiconductor industry, particularly in China, which holds a significant market share in bonding equipment demand [2][3]. Group 1: Industry Trends - Chiplet integration technology is becoming a strategic focus in semiconductor innovation, with the complexity of processes and equipment evolving alongside traditional scaling methods [2]. - The market for hybrid bonding is projected to grow at a compound annual growth rate (CAGR) of 13.4% over the next five years, with China accounting for 40% of the global demand for bonding equipment [2]. - The hybrid bonding market is expected to reach USD 397 million by 2030, highlighting its critical role in advanced three-dimensional heterogeneous integration technologies [2]. Group 2: Market Dynamics - The hybrid bonding equipment market is currently dominated by companies such as Besi, Applied Materials, and EVG, due to the limited demand and high technical difficulty associated with specific chip hybrid bonding [3]. - Domestic innovative enterprises are accelerating their efforts in this niche market to capture market share and establish brand influence [3]. Group 3: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7].

Core Viewpoint - The article highlights the successful IPO of Xiamen Hengkang New Materials Technology Co., Ltd., which is set to become the first stock of photoresist on the Sci-Tech Innovation Board, emphasizing its role in breaking the foreign monopoly on key materials for 12-inch integrated circuit manufacturing [2][4]. Group 1: Company Overview - Hengkang New Materials was established in 2004 and specializes in the R&D, production, and sales of photoresist materials and precursors, being one of the few companies in China capable of developing and mass-producing key materials for 12-inch integrated circuit wafer manufacturing [4]. - The company's products are essential for the production processes of advanced NAND, DRAM storage chips, and logic chips below the 90nm technology node, indicating its critical role in the semiconductor supply chain [4]. Group 2: Financial Performance - According to the prospectus, Hengkang New Materials reported revenues of 322 million yuan, 368 million yuan, and 548 million yuan for the years 2022 to 2024, with net profits of 101 million yuan, 90 million yuan, and 97 million yuan respectively [4]. - For the first nine months of 2025, the company expects to achieve revenues between 440 million yuan and 500 million yuan, representing a year-on-year growth of 12.48% to 27.82% [4]. Group 3: Fundraising and Projects - Hengkang New Materials plans to raise 1.007 billion yuan for projects including the second phase of the integrated circuit precursor project and advanced materials for integrated circuits [5]. - The total investment for the projects is 1.62158 billion yuan, with 1.2 billion yuan expected to be funded through the IPO [6]. Group 4: Market Context and Future Plans - The current domestic market for photoresist materials has low localization rates, with KrF photoresist at approximately 10%, ArF photoresist below 5%, and i-Line photoresist at around 20% [7]. - The fundraising projects aim to enhance the localization rates of key materials such as precursors, SiARC, KrF, and ArF, thereby expanding the domestic substitution market [7]. - Hengkang New Materials aims to leverage its IPO to enhance technological development and industrial layout, expand its product line, and improve its core competitiveness and brand influence [7]. Group 5: Industry Events - The article mentions an upcoming conference organized by TrendBank, focusing on heterogeneous integration technology, scheduled for November 17-19, 2025, in Ningbo, aimed at fostering the development of the advanced electronic information industry in the Yangtze River Delta region [8].

Core Viewpoint - The article emphasizes the significance of silicon photonics technology in the future of optical chip markets, highlighting its advantages in manufacturing optical transceivers and its expected market growth by 2030 [2][6][4]. Group 1: Market Overview - Silicon photonics technology is projected to dominate the optical chip market, with the market expected to triple by 2030, and the silicon photonics market share anticipated to double, leading to a sixfold market growth [2]. - Currently, InP optical chip products hold the largest market share at 40%, followed closely by silicon photonics at 37% [2]. Group 2: Technological Advantages - Silicon photonics offers high reliability and low failure rates, making it suitable for mass production, while other materials require years to achieve similar reliability [6]. - The integration of multiple optical components on a single chip is facilitated by silicon photonics, enhancing the reliability and linearity of modulators [10]. Group 3: Industry Adoption - Major companies like Cisco, Huawei, and Intel have significantly adopted silicon photonics technology, which took nearly a decade to influence the entire optical transceiver market [4]. - The compatibility of silicon photonics with LPO/CPO optical module packaging technology has driven its widespread penetration, increasing from 30% in 2024 to 60% by 2030 [4]. Group 4: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, focusing on cutting-edge technologies in heterogeneous integration and advanced packaging [8][10].

Group 1 - The article highlights the rapid expansion of heterogeneous integration technology driven by the increasing demand in high-performance computing, optical communication, and sensor industries, with major chip manufacturers like Sony, TSMC, Samsung, Intel, and AMD competing in this field [2] - The evolution of integration technology is outlined, progressing from 2D heterogeneous integration to 2.5D chip integration, and further to 3D stacked integration, with future developments aiming towards 3.5D system integration [2][3] - Specific bonding technologies and their advancements are discussed, including C4 bump spacing in 2D integration (150-110μm), μ bump spacing in 2.5D integration (50-25μm), and the focus on W2W hybrid bonding technology in 3D integration with bonding spacings currently at 8-2μm, moving towards 1.6μm and 1μm [3] Group 2 - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and aiming to establish Ningbo and the Yangtze River Delta as a hub for the advanced electronic information industry [4] - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic integration, wafer-level bonding, and advanced packaging techniques, inviting experts from both industry and academia for in-depth discussions [4]

Core Viewpoint - The article emphasizes the significance of heterogeneous integration technology in the semiconductor industry, particularly in the context of the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory, aimed at fostering collaboration between industry and academia to address key challenges in advanced packaging technologies [2][4]. Meeting Background - The conference will address the stringent requirements for chip design and manufacturing driven by applications in artificial intelligence, smart driving, and high-performance computing, highlighting the need for advancements in semiconductor technology [2]. - Ningbo is positioned as a key city for advanced manufacturing, with the Yongjiang Laboratory focusing on electronic information materials and micro-nano device fabrication [2]. Meeting Content - The conference will focus on core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging techniques, inviting experts from both industry and academia for in-depth discussions [3]. Meeting Basic Information - The 2025 Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, in Ningbo, with an expected attendance of 200-500 participants [4]. Proposed Agenda - The agenda includes closed-door meetings, government speeches, and various forums discussing topics like micro-nano device applications, 2.5D/3D heterogeneous integration, and advanced packaging technologies [5][7]. Resource Integration - The conference aims to create a collaborative ecosystem by integrating technology, industry, and capital, facilitating discussions among all stakeholders in the semiconductor supply chain [6]. Diverse Meeting Formats - The event will feature a combination of large conferences and smaller closed-door meetings to enhance interaction quality and facilitate targeted discussions [6]. High-Quality Conference Services - The conference will maintain high standards for guest quality, content, interaction, exhibitors, and overall service to ensure a professional and efficient experience for attendees [6].

Core Viewpoint - The article highlights the significant surge in the stock price of Cambrian Technology, which has become the "new stock king" in the A-share market, driven by its impressive revenue growth and profitability turnaround in the first half of 2025 [2][3]. Company Overview - Cambrian Technology focuses on the research and development of artificial intelligence chips, aiming to create core processing chips in the AI field, often referred to as "China's NVIDIA" [4]. - The main business includes the R&D, design, and sales of AI core chips used in various cloud servers, edge computing devices, and terminal devices, with product lines covering cloud products, edge products, IP licensing, and software [4][7]. Financial Performance - In the first half of 2025, Cambrian achieved a revenue of 2.881 billion yuan, marking a year-on-year increase of 4347.82% [3]. - The company reported a turnaround in profitability, with total profit, net profit attributable to shareholders, and net profit after deducting non-recurring gains and losses all showing significant improvement [3]. R&D Investment - Cambrian maintained a high level of R&D investment, totaling 456.49 million yuan in the first half of the year, a 2.01% increase year-on-year [5][6]. - R&D expenses accounted for 15.85% of total revenue, a decrease of 675.07 percentage points compared to the previous year [6]. Product Lines - The cloud product line includes intelligent chips and boards for cloud servers and data centers, providing high-density and energy-efficient hardware resources for AI applications [4]. - The edge product line addresses the limitations of terminal devices by providing adequate computing power, enhancing data privacy, bandwidth, and latency issues [7]. - The IP licensing and software product line offers licensing of Cambrian's intelligent processor IP and a unified software platform for various AI chips, facilitating efficient application deployment [7]. Market Context - The surge in Cambrian's stock price is attributed to the rising demand for AI chips in China, which has been recognized as a strategic industry by the government, leading to supportive policies for the integrated circuit sector [8]. - Despite progress in domestic semiconductor replacement, challenges remain due to geopolitical influences, technology blockades, and lengthy customer certification cycles, which have previously affected Cambrian's profitability [8]. Future Outlook - Cambrian plans to leverage its core advantages in AI chip products to deepen technical collaborations with leading companies in cutting-edge fields, aiming to enhance market scale through practical technology cooperation [9].

Core Viewpoint - Asahi Kasei announced an investment of approximately 16 billion yen (about 780 million RMB) to expand the production capacity of PIMEL™ photosensitive polyimide (PSPI) at its factory in Fujisawa, Japan, aiming to double its capacity by 2030. This follows the company's earlier announcement in May regarding a supply cut for PSPI, indicating a significant strategic shift in the market [1][2]. Summary by Sections PSPI Overview - PSPI (Photosensitive Polyimide) is a high-performance polymer material that combines photosensitivity with excellent physical and chemical properties, widely used in semiconductor packaging, advanced packaging processes, and OLED displays. It simplifies the manufacturing process of integrated circuits by allowing direct photolithography without complex etching and stripping steps, enhancing precision [2]. Market Size and Competition - The global market for PSPI used in packaging is projected to reach USD 402 million in 2024 and is expected to grow to USD 802 million by 2030. Due to high technical barriers, Japanese and American manufacturers dominate the high-end market, with five major companies (Toray, Fujifilm Electronic Materials, HD Microsystems, Asahi Kasei, and SK Materials) holding approximately 95% of the market share [3]. Domestic PSPI Developments - A review of domestic companies involved in PSPI reveals several key players and their activities: - Hubei Dinglong has developed multiple semiconductor packaging PI products, including non-photosensitive PI and both positive and negative PSPI products, with some already in mass production [4]. - Aisen Co. is actively working on negative PSPI and low-temperature crosslinking PSPI, with plans for mass production in the coming years [4]. - Yuanquan Group has initiated a PSPI industrialization project with a total investment of 2.8 billion RMB, aiming for a production capacity of 2000 tons over three years [4]. - Beijing Bomi Technology has broken a 40-year foreign monopoly in PSPI coating materials, with applications in integrated circuit surface passivation and advanced packaging [4]. - Other companies like Jiangsu Qiangli and Anhui Guofeng are also making strides in PSPI product development and validation [4].

Core Viewpoint - Deep Valley Technology has successfully established a production line for glass-based 3D waveguide chips, marking a significant breakthrough in the industrialization of core technologies for 3D waveguides, which will support multi-core optical interconnects and next-generation data center communications [2][4]. Group 1: Production Line and Technology - The newly built production line utilizes self-developed femtosecond laser direct writing equipment and is equipped with high-precision dual six-axis automatic coupling platforms, enabling rapid processing and efficient testing of 3D waveguide structures [4]. - The chip processing efficiency can reach 10 seconds per chip, with an annual production capacity exceeding 500,000 chips [4]. - The first batch of mass-produced products focuses on four-core and dual four-core waveguide chips, which can be widely applied in multi-core optical fiber fan-in and fan-out devices as well as multi-core optical modules [4]. Group 2: Market Demand and Future Prospects - Compared to traditional parallel transmission solutions, the 3D waveguide solution significantly reduces the complexity and cost of fiber optic wiring, meeting the demand for data centers evolving towards 800G, 1.6T, and 3.2T ultra-large capacities [4]. - The scalable process platform also provides technological support for the mass production of seven-core and more channel chips in the future [4]. - The chairman of Deep Valley Technology, Dr. Du Leping, stated that the glass-based 3D waveguide chip is a core device for the next generation of high-density optical interconnects, and the production line's launch positions the company to gain a competitive edge in the global optical communication market [4]. Group 3: Company Background - Deep Valley Technology is a national high-tech enterprise focused on the research, design, production, and sales of optical communication chips and devices, established by a high-level talent team introduced by Shenzhen [5]. - The core team consists of top global experts in optical communication and semiconductor technology, covering cutting-edge fields such as 3D waveguides, TGV chips, and advanced CPO packaging, achieving key technological breakthroughs [5]. - Team members hail from prestigious institutions such as the University of Science and Technology of China, Nanyang Technological University, Hong Kong University of Science and Technology, and Shanghai Jiao Tong University, possessing extensive experience in high-speed optical communication device design and industrialization [5].

Group 1 - The article discusses the "Ten Chains, Hundred Events, Thousand Enterprises" series of matchmaking activities focused on humanoid robots in Zhejiang Province, highlighting the establishment of the Zhejiang Humanoid Robot Industry Technology Alliance [1] - The event is organized by the Zhejiang Provincial Department of Economy and Information Technology and the Ningbo Municipal People's Government, indicating strong governmental support for the humanoid robotics sector [1] - The event will take place on September 5-6, 2025, at the Pan Pacific Hotel in Ningbo, showcasing the region's commitment to advancing embodied intelligence technology [3]