Core Viewpoint - The article emphasizes the significance of electronic specialty gases, particularly photolithography gases, in the semiconductor industry, highlighting the potential for domestic companies to fill the gap in a market currently dominated by international players [3][4]. Group 1: Electronic Specialty Gases Overview - Electronic specialty gases, also known as electronic gases, are characterized by their high purity and special applications, making them essential materials in industries such as integrated circuits, display panels, and solar cells [1]. - The article categorizes electronic specialty gases into various types based on their applications, including bulk gases, chemical vapor deposition, etching, cleaning, doping, and others [2]. Group 2: Photolithography Gases - Photolithography gases are crucial for the operation of photolithography machines, which directly influence the resolution of these machines. The composition of photolithography gases typically includes argon, neon, krypton, xenon, and fluorides in specific ratios [3]. - Currently, international companies like Linde, Air Liquide, and Taiyo Nippon Sanso dominate over 80% of the global market share for photolithography gases, indicating significant room for domestic alternatives [3]. Group 3: Domestic Companies in Photolithography Gases - The article lists several domestic companies involved in the production of photolithography gases, including their locations and specific products, such as high-purity krypton-neon mixtures and hydrogen [4][5]. - Notable companies mentioned include Huate Gas, KMT Gas, and Qiaoyuan Co., among others, showcasing a diverse range of products aimed at meeting the high purity requirements of the semiconductor industry [4][5]. Group 4: Upcoming Industry Events - The article announces the 2025 TrendBank (5th) Photolithography Materials Industry Conference scheduled for July 8-10 in Hefei, which aims to facilitate discussions on the supply chain and development trends in the photolithography materials sector [6].

Core Viewpoint - The global photoresist market is expected to exceed $15 billion by 2025, with China's market share increasing to 35%, highlighting significant growth potential in the industry [2]. Industry Overview - The photoresist industry is a critical component of high-tech materials, encompassing the entire chain from research and development to production and sales [2]. - In the high-end semiconductor photoresist sector, Japanese companies like JSR and Tokyo Ohka dominate with over 85% market share, while domestic production rates are below 5%, indicating a significant technological and market monopoly [2]. Market Dynamics - The advancement in the photoresist industry is driven by downstream demand, where manufacturers' process improvements necessitate technological iterations in photoresists and raw materials [2]. - Domestic manufacturers are increasingly replacing foreign suppliers and expanding production, creating opportunities for photoresist companies [2]. Supply Chain Components - The upstream of the photoresist supply chain includes raw materials such as resins, monomers, photosensitizers, and solvents; the midstream involves the production and synthesis of photoresists based on formulations; and the downstream includes applications in printed circuit boards, LCDs, and IC chips across various industries [2]. Key Raw Materials - Solvents constitute 50%-90% of photoresist composition, essential for dissolving resins and photosensitizers to create a uniform photoresist solution [3][5]. - Photosensitizers, making up 1%-6% of the composition, are crucial for initiating chemical reactions under specific wavelengths of light, altering the solubility of resins during the development process [3][8]. - Resins account for 10%-40% of photoresist, serving as the inert polymer matrix that binds materials together and determines the basic performance of the photoresist after exposure [3]. Market Players - Domestic companies like Yida Co. hold over 40% market share in electronic-grade PM solvents, while other firms like Xilong Science and Jingrui Electric Materials are also making strides in the solvent sector [7]. - The photosensitizer market is dominated by international players such as BASF and IGM Resins, with a trend of production capacity shifting towards China due to patent expirations and increased domestic demand [10]. Product Types and Applications - Different types of photoresists are used for various exposure wavelengths, with global resin supply primarily monopolized by companies like Sumitomo Chemical and Dow Chemical [11]. - Domestic enterprises such as Shengquan Group and Tongcheng New Materials are making significant advancements in photoresist resin production, with some achieving production capacities exceeding 5,000 tons per year [12]. Upcoming Events - The 2025 TrendBank (Fifth) Photoresist Materials Industry Conference will be held from July 8-10 in Hefei, focusing on new applications, current trends, and in-depth discussions on the photoresist supply chain [13].

势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 来源：势银 (TrendBank) "宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 2025势银（第五届）光刻材料产业大会（ 7月8日-10日，安徽·合肥） 点此报名 添加文末微信，加 光刻胶 群 在高性能计算芯片、智能手机芯片以及车载智能高阶芯片高需求驱动下，2024年全球晶圆代工市场 快速反弹，而其他消费电子、家用及工业物联网芯片需求温和复苏。2025年第一季度全球晶圆代工 业务营收同比增长27%，实现连续第五个季度复苏增长态势，受季节性因素影响环比下滑5%，科 技关税反复调整对第二季度各行业供需变化带来很多不确定因素，或将影响整个科技供应链。 来源：势银 (TrendBank) 中国本土企业—芯联集成表现亮眼，自2024年第三季度起，整体营收超越韩国东部高科，成功跻身 全球晶圆代工业务第11位，2025年第一季度中国大陆本土晶圆代工厂市场份额达11%。 值得一提的是，势银（ TrendBank）于7月8-10日在合肥举办 2025势银（第五届）光刻材料产业大 会 ！以 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 2025势银（第五届）光刻材料产业大会（ 7月8日-10日，安徽·合肥） 点此报名 添加文末微信，加 人形机器人 群 会议背景 加快人工智能技术创新及应用步伐，对促进我国经济高质量发展、经济结构转型升级和现代化产业体系建设具有长远战略意义。我国正处于城市数智 化、新能源化、国际化转型的关键阶段，以科技创新引领新质生产力发展成为重要任务。人形机器人与人工智能技术的发展，能够为我国产业升级提供 强大技术基础，推动企业数字化转型智能化升级，促进形成定制化生产方式，实现经济结构的转型升级。 宁波作 为 我国重要的经济城市 ， 在 新兴产业发展方面具有良好的基础和条件。基于此，在 第四届中国—中东欧国家博览会暨国际消费品博览会 上， 将增设人形机器人与人工智能展区 ，并于 5月23日下午举办" 人形机器人产业创新发展交流会" ，推动人形机器人与人工智能领域的共同发展。 会议主题 具身智能引领未来 会议时间与地点 会议 时 间 ： 202 ...

Core Viewpoint - The semiconductor market is expected to perform better in 2024 compared to 2023, driven by inventory replenishment, advancements in AI and HPC, and increased demand in automotive electronics and new energy sectors [4][5]. Market Overview - The global semiconductor market sales are projected to reach $627.6 billion in 2024, marking a significant growth of 19.1% compared to 2023 [4]. - The global photoresist market is anticipated to grow by 16.15% year-on-year in 2024, with specific growth rates for different types of photoresists: I-line (10.22%), G-line (14.06%), KrF (17.89%), ArF (16.74%), and EUV (21.26%) [5]. Photoresist Market in China - China's semiconductor photoresist market is expected to reach $771 million in 2024, becoming the largest in the world, with a year-on-year increase of 42.25% [5]. - The growth rates for different types of photoresists in China are as follows: G/I-line (29.8%), KrF (42.61%), and ArF (45.84%) [5]. Production Capacity of Photoresist Companies - A survey of 15 companies in mainland China reveals their design production capacities for semiconductor photoresists, with notable capacities including: - Tongcheng New Materials: 1,000 tons/year for G-line, KrF, and ArF [5] - Jingrui Electric Materials: 2,800 tons/year [5] - Feikai Materials: 5,000 tons/year [5] - The continuous investment in new production capacities supports steady growth in the photoresist market [5]. Upcoming Industry Events - The 2025 TrendBank (5th) Photoresist Industry Conference will be held from July 8-10 in Hefei, focusing on new applications, trends, and supply chain discussions [6][7].

Core Viewpoint - The article discusses the advancements and challenges in the 2.5D/3D IC backend design EDA tools, emphasizing the need for collaborative innovation in the heterogeneous integration and advanced packaging sectors to meet the growing demands for AI computing power and overcome existing technological barriers [3][4][5]. Group 1: Event Overview - The "2025 TrendBank Heterogeneous Integration Packaging Industry Conference" was held on April 29, 2025, in Ningbo, co-hosted by TrendBank and Yongjiang Laboratory, with support from Zhuhai Silicon Core Technology Co., Ltd. and Ningbo Electronics Industry Association [1]. - Dr. Zhao Yi, founder and chief scientist of Zhuhai Silicon Core Technology Co., Ltd., delivered a keynote speech focusing on the EDA platform for 2.5D/3D advanced packaging, exploring collaborative innovation in backend design, simulation, and verification [1][3]. Group 2: Industry Insights - The demand for AI computing power has surged, outpacing the growth rate predicted by Moore's Law, leading to a conflict between increasing computational needs and the slow performance growth of chips [4]. - Advanced packaging technologies, such as stacked chips, allow for flexible integration and high-density interconnections, significantly enhancing integration levels and driving improvements in computing speed and storage capacity [4][5]. Group 3: Technical Challenges - The design complexity of stacked chips has increased exponentially, creating a scarcity of comprehensive EDA design toolchains that can address the new challenges in design, testing, and simulation [5]. - Key challenges in the 2.5D/3D Chiplet design field include achieving a cohesive top-level architecture, managing various packaging types, and understanding the benefits of architectural-level analysis [5]. Group 4: Solutions and Innovations - Zhuhai Silicon Core Technology has developed the 3Sheng Integration Platform, which provides a comprehensive solution covering the entire backend design process for Chiplets [5]. - The platform integrates five centers: architecture design, physical design, multi-die testing, analysis simulation, and multi-Chiplet integration verification, facilitating a collaborative design approach that maximizes performance, cost, and testability [5].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 添加文末微信，加 先进封装 群 作为从事新一代 2.5D/3D堆叠芯片EDA软件设计的研发及产业化企业。珠海硅芯科技有限公司拥 有强大的研发团队，创始人团队从2008年开始研究2.5D/3D堆叠芯片设计方法，是世界最早期研 究前沿芯片架构设计方法的研究团队之一，并在堆叠芯片EDA后端布局、布线、可测试、可靠性等 方面均有世界领先成果。 针对 Chiplet堆叠芯片技术，其自研的3Sheng Integration Platform，支持三维异构集成系统的敏 捷开发与可定制化的协同设计优化，涵盖先进封装设计所需环节的全流程工具。目前，硅芯科技系 列产品已通过先进封装产业验证，完成设计制造闭环，并打造首批客户案例，全方位助力 AI,GPU,CPU,NPU,FGPA,硅光等各类芯片及终端应用领域发展。 直面需求 早先在HiPi联盟大会上， 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战 。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 添加文末微信，加 先进封装 群 在全球半导体产业持续演进的当下，先进封装已从幕后走向台前，成为产业竞争的新焦点。随着摩 尔定律渐趋瓶颈，传统芯片制程工艺的推进愈发艰难，成本也水涨船高。在此背景下，先进封装技 术凭借其能够提升芯片性能、降低功耗、缩小尺寸且可灵活集成不同功能芯片的优势，成为延续芯 片 "摩尔定律" 的关键路径，受到行业的广泛关注与大力投入。 尤其在 5G 通信、人工智能、汽车电子等新兴应用领域需求的强劲拉动下，先进封装市场的增长势 头更为迅猛。从市场数据来看，先进封装市场规模正经历着显著扩张。Yole数据显示，2023 - 2029 年全球先进封装市场规模预计从 378 亿美元攀升至 695 亿美元，年复合增长率达 10.7%。 截至4月底，长电科技、通富微电、华天科技、甬矽电子、深科技、颀中科技、汇成股份、苏州固 锝、晶方科技、气派科技、蓝箭电子等布局先进封装业务的上市企业已经公布年报，相较于2023 年，先进封装业务都出 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 添加文末微信，加 先进封装 群 2024 年全球半导体材料市场呈现回暖态势。人工智能快速发展，带动数据中心、智能终端需求上 升，智能手机、可穿戴设备等消费电子产品需求回暖，汽车智能化、电动化促使汽车电子需求增 长，为半导体材料市场提供了发展动力。 根据势银（TrendBank）调研，2023年中国大陆半导体光刻胶市场规模为34.46亿元，同比2022年降 低13.98%。随着2024年市场回暖，需求增加，半导体用光刻胶市场也将扩大。 来源：《2024势银光刻材料产业发展蓝皮书》 同时，目前中国已经成为全球最大的LCD面板生产基地；OLED全球市场份额也在逐渐扩大，显示 光刻胶市场将相对增长，2023年显示光刻胶市场规模达99.42亿元，相较2022年同比增长2.38%。 | | | | 企业名称 | 营业收入(亿) | 营收同比 | | --- | --- | --- | | 彤程新材 | 32.70 | 11.10% | | 晶瑞电材 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 添加文末微信，加 先进封装 群 2025年4月29日，由 势银（TrendBank）与甬江实验室联合 主办 ，珠海硅芯科技有限公司专场冠名 、宁波电子行业协会支持、 势银芯链承办 的 " 2025势银异质异构集成封装产业大会" 在 浙江宁波 · 甬江实验室 召开。 本次会议以" 异质异构集成开启芯片后摩尔时代 "为主题共同探讨先进封装产业发展路径， 抢抓新一代芯片发展战略机遇， 促进供应链上下游企业、 科研单位、投融 资机构之间的交流与合作，为帮助产业上下游产业协同 发展提供解决方案！ 嘉宾签到&展商风采 ▼ 左右滑动查看更多 ▼ 4月29日上午， 2025势银异质异构集成封装产业大会 正式开幕 ， 势银（TrendBank）半导体业务负责人 高占占 担任大会主持人 。 首先进行甬江实验室 功能材料与器件异构集成研究中心成立仪式 ，由甬江实验室副主任 乌学东、甬江实验室异构集成研究中心主任 万青、浙江 厚积科技有 限公司 总经理 殷庆元、 ...