格隆汇9月22日丨长电科技(600584.SH)在互动平台表示，长电科技针对高性能计算等场景推出了一站式 系统级封装解决方案，覆盖了计算，存储，电源及网络相关芯片的封装需求，可以支持多芯片异构、异 质集成，已构建多层次的封装与测试能力，满足多个应用领域。长电科技在工业自动化与智能终端领 域，已布局多项机器人相关封装项目并与机器人控制系统客户联合开发系统级封装方案，提升系统集成 度与可靠性。 ...

Group 1 - Semiconductor chips have seen a strong rally, driven by two major positive news: significant price increases in storage chips and the successful application of self-developed chips by companies like Huawei, Alibaba, and Baidu [1] - The price of DDR4/LPDDR4X storage chips has surged over 200% from the bottom in Q1 2025, with contract prices doubling and some models increasing by over 30%, indicating a tight supply-demand balance influenced by AI-driven demand and production cuts [1] - Alibaba has integrated its self-developed PPU chip into AI model training, partially replacing NVIDIA products, showcasing its potential in training scenarios, while other cloud companies are adapting domestic chips to enhance AI applications [1] Group 2 - As of September 22, 2025, the National Securities Semiconductor Chip Index (980017) rose by 4.46%, with significant gains in constituent stocks such as Haiguang Information (688041) up 13.02% and Longxin Zhongke (688047) up 8.04% [2] - The semiconductor ETF (159813) increased by 4.31%, reflecting the performance of listed companies in the semiconductor industry [2] - The top ten weighted stocks in the National Securities Semiconductor Chip Index account for 70.69% of the index, with companies like Cambricon (688256) and SMIC (688981) among the leaders [2]

Group 1 - The semiconductor ETF Southern (159325) opened down 0.28% at 1.449 yuan [1] - Major holdings in the ETF include: - SMIC down 0.66% - Northern Huachuang down 0.11% - Haiguang Information down 1.68% - Cambrian down 1.57% - OmniVision up 0.69% - Lanke Technology down 0.34% - Zhaoyi Innovation up 1.99% - Zhongwei Company unchanged - Changdian Technology up 0.39% - Unisoc down 0.25% [1] - The ETF's performance benchmark is the CSI Semiconductor Industry Select Index return, managed by Southern Fund Management Co., Ltd. [1] Group 2 - Since its establishment on October 31, 2024, the ETF has returned 45.02% [1] - The ETF has achieved a return of 23.73% over the past month [1]

Core Insights - Longji Technology's storage business revenue surged over 150% year-on-year in the first half of the year, significantly outperforming the industry average, raising questions about the sustainability of this growth [1] Group 1: Market Trends - The storage chip supercycle has begun, driven by three main factors: 1. Explosive demand for AI servers leading to a surge in high bandwidth memory (HBM) demand, with a projected market growth rate of 80% by 2025 [3] 2. Acceleration of domestic substitution as local chip leaders like Yangtze Memory and Changxin Memory ramp up production, with domestic orders for Longji Technology reaching 40% in the first half of 2025 [3] 3. Technological upgrades from DDR4 to DDR5, increasing packaging prices by over 30%, and advancements in 3D NAND stacking from 128 layers to over 200 layers [3] Group 2: Fundamental Analysis - Longji Technology has three strengths and three weaknesses: - Strengths: 1. Strong technical barriers, being one of only three global companies capable of HBM packaging [4] 2. Deep customer relationships with major clients like Apple, Qualcomm, and domestic leaders [4] 3. Leading capacity layout with a monthly production capacity of 82,000 chips and an industry-leading yield rate of 99.5% [4] - Weaknesses: 1. A 24% year-on-year decline in net profit for the first half of 2025 due to increased financial costs from the acquisition of a semiconductor company [5] 2. Operating cash flow decreased by 22.7% year-on-year, indicating pressure from significant expansion investments [5] 3. High valuation with a dynamic PE of 35.3 times for 2025, above the industry average of 28 times [5] Group 3: Valuation Assessment - Short-term valuation is under pressure with a projected PE of 35.3 times for 2025 and 29.0 times for 2026, while long-term valuation could be reasonable if storage business growth continues, potentially lowering PE to 24.3 times by 2027 [6] - If the storage business share increases from the current "mid-teens" to over 30%, the valuation could shift from "packaging factory" to "high-end manufacturing," targeting a PE of 40 times [6] Group 4: Investment Strategy - Ideal buying point is at or below 35 yuan, with current price at 38.73 yuan being slightly high [7] - Position management suggests limiting single stock positions to 8% and total positions in the packaging sector to 15% [7] - Key indicators for monitoring include monthly capacity utilization rates and HBM packaging yield rates [7]

Core Viewpoint - Changdian Technology (600584) reported a significant growth in its storage business, with revenue increasing by over 150% year-on-year in the first half of the year [1] Company Summary - The company provides packaging and testing services for various storage chip products, including DRAM and Flash [1] - The strong performance in the storage business indicates a robust demand for semiconductor packaging and testing services [1]

Group 1 - The core viewpoint of the article highlights that Changdian Technology (600584.SH) has reported significant growth in its storage business, with revenue from this segment increasing by over 150% year-on-year in the first half of the year [1] Group 2 - The company provides packaging and testing services that cover various storage chip products, including DRAM and Flash [1]

Group 1 - The integrated circuit ETF (562820) opened down 1.51% at 2.289 yuan [1] - Major holdings in the ETF include companies like SMIC, which rose 0.70%, and Cambrian, which fell 2.04% [1] - The ETF's performance benchmark is the CSI All Share Integrated Circuit Index return, managed by Harvest Fund Management [1] Group 2 - Since its inception on April 12, 2024, the ETF has achieved a return of 128.02%, with a monthly return of 21.95% [1]

Investment Rating - The industry investment rating is maintained as "Outperform" [3] Core Insights - The semiconductor packaging and testing industry is experiencing significant growth driven by AI and advanced packaging technologies, with major players focusing on creating one-stop solutions for packaging and testing [1][5] - Key companies such as Jiayuan Electronics and Weicai Technology are increasing their capital expenditures and expanding high-end testing capacities, reflecting strong demand across various applications [2][5] - The overall gross margin for the domestic packaging sector has shown a notable increase, with leading companies like Huada Technology and Liyang achieving higher margins compared to the industry average [11][12] Summary by Sections Overview - The gross margin for the semiconductor packaging sector has significantly improved, reaching 21.44% in Q2 2025, which is higher than the average for previous quarters [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - Daylight Technology's advanced packaging revenue has surpassed 10% of its total, with a recovery in general business observed [17] - Anke Technology reported a revenue of 10.779 billion RMB in Q2 2025, with a 14.3% quarter-on-quarter growth, driven by strong demand in various markets [30][31] - Powertech Technology's revenue reached 4.226 billion RMB in Q2 2025, reflecting a 16.56% quarter-on-quarter increase [39] Testing - Jiayuan Electronics has significantly increased its capital expenditure, with a 149.64% quarter-on-quarter growth in Q2 2025 [2][3] - Weicai Technology has seen strong revenue and profit growth in H1 2025, driven by the increasing demand for high-end testing services [5][20] Equipment - AI continues to be the main driver for industry growth, with strong demand for TCB, hybrid bonding, and SoC testing equipment [5][21] - ASMPT reported a 50% year-on-year increase in TCB equipment orders in H1 2025 [5][23] Market Trends - The smartphone market is experiencing regional differentiation, with strong growth in specific areas such as the Middle East and Africa [6][28] - The automotive sector is showing positive trends, particularly in the new energy vehicle segment, while traditional fuel vehicles are stabilizing [6][32] Investment Recommendations - The report suggests focusing on key players in packaging, testing, and equipment sectors, including Daylight Technology, Tongfu Microelectronics, and ASMPT, among others [5][34]

Market Performance - The Tonghuashun Fruit Index concept rose by 0.69%, ranking 8th among concept sectors, with 9 stocks increasing in value, including Wentai Technology, Changying Precision, and Industrial Fulian, which rose by 9.60%, 9.04%, and 5.30% respectively [1] - The leading decliners included Lingyi Technology, Dongshan Precision, and Desay Battery, which fell by 3.27%, 3.03%, and 3.00% respectively [1] Concept Sector Overview - The top-performing concept sectors today included F5G concept (+1.45%), Co-packaged Optics (CPO) (+1.35%), and Copper Cable High-Speed Connection (+1.27%), while the worst performers were Lead Metal (-3.94%), Zinc Metal (-3.88%), and Gold Concept (-3.08%) [2] - The Tonghuashun Fruit Index concept experienced a net outflow of 338 million yuan, with 10 stocks seeing net inflows, and 6 stocks receiving over 100 million yuan in net inflows [2] Fund Flow Analysis - The stocks with the highest net inflow ratios included Wentai Technology (6.21%), Industrial Fulian (4.27%), and Saiteng Co. (4.00%) [3] - Industrial Fulian led the net inflow with 867.34 million yuan, followed by Wentai Technology and Changying Precision with net inflows of 360.55 million yuan and 331.81 million yuan respectively [3][4]

Investment Rating - The report maintains an investment rating of "Outperform the Market" for the semiconductor industry [4]. Core Insights - The semiconductor packaging sector has shown significant improvement in gross margins, with leading companies like Huada and Liyang experiencing notable growth [12][13]. - AI continues to be the primary driving force behind industry growth, with major OSAT players focusing on advanced packaging solutions [6][18]. - The report highlights the strong performance of key companies such as Tongfu Microelectronics and ASE Technology, driven by robust demand in AI and automotive electronics [50][47]. Summary by Sections 1. Overview - The gross margin of the semiconductor packaging sector has significantly increased, surpassing levels seen in 2024. In Q2 2025, the gross margin reached 21.44%, up 4.52 percentage points from the previous quarter [12][13]. 2. OSAT - **ASE Technology**: In Q2 2025, ASE's revenue reached 132.13 billion RMB, with a year-on-year growth of 6.68% and a quarter-on-quarter increase of 9.55%. The advanced packaging and testing business has shown strong growth, accounting for over 10% of total revenue [18][19]. - **Anke Technology**: Reported revenue of 107.79 billion RMB in Q2 2025, with a quarter-on-quarter growth of 14.3% and a year-on-year increase of 3.42%. The company is expanding its testing capabilities and focusing on advanced packaging solutions [31][39]. - **Powertech Technology**: Achieved a revenue of 42.26 billion RMB in Q2 2025, with a quarter-on-quarter growth of 16.56%. The company is set to restart significant capital expenditures to expand its production capacity [40][44]. 3. Testing - **King Yuan Electronics**: Capital expenditures surged to 26.62 billion RMB in Q2 2025, reflecting a 149.64% quarter-on-quarter increase and a 474.34% year-on-year increase. All application segments reported growth [2][29]. - **Weichai Technology**: Continued to enhance its high-end testing capacity, with strong revenue and profit growth in H1 2025, driven by AI and automotive electronics [5][35]. 4. Equipment - AI remains the main driver for industry development, with significant growth in TCB, hybrid bonding, and SoC testing machines. ASMPT reported a 50% year-on-year increase in TCB equipment orders in H1 2025 [5][4]. 5. Market Trends - The smartphone market is experiencing regional differentiation, with strong growth in specific areas such as the Middle East and Africa. The PC market saw an 8.4% year-on-year increase in shipments in Q2 2025 [6][11]. 6. Investment Recommendations - The report suggests focusing on companies involved in packaging, testing, and equipment, including ASE Technology, Tongfu Microelectronics, and ASMPT, as they are expected to benefit from the ongoing advancements in AI and semiconductor technology [6][50].