Core Viewpoint - The semiconductor leading ETF (159665) has shown a positive performance with a 1.51% increase at the opening, reflecting strong market interest in semiconductor stocks [1] Group 1: ETF Performance - The semiconductor leading ETF (159665) opened at 2.013 yuan, marking a 1.51% increase [1] - Since its establishment on December 22, 2022, the ETF has achieved a return of 98.90%, with a monthly return of 15.57% [1] Group 2: Key Holdings Performance - Notable stocks within the ETF include: - Cambrian (寒武纪) up 0.35% - SMIC (中芯国际) up 2.46% - Haiguang Information (海光信息) up 1.08% - Northern Huachuang (北方华创) up 1.24% - Lattice Semiconductor (澜起科技) up 2.14% - GigaDevice (兆易创新) up 1.99% - Zhongwei Company (中微公司) up 1.62% - OmniVision (豪威集团) up 0.82% - JCET (长电科技) up 2.30% - Unisoc (紫光国微) up 6.11% [1]

证券日报网讯 1月15日，长电科技在互动平台回答投资者提问时表示，公司通过与晶圆厂、整车厂、一 级供应商和芯片设计公司紧密合作，已实现各类主流车规产品的大规模量产并被广泛配套应用于国内外 各主要电动智能汽车品牌中。目前，全球已有数百万辆智能汽车装配了由长电科技封装的全自动驾驶芯 片。位于上海临港的公司旗下车规级芯片封测工厂已如期实现通线，它将依托临港新片区新能源汽车产 业与车载芯片相关产业集聚优势，加速形成更具韧性与竞争力的供应链协同体系，为全球客户提供更高 效、更可靠的一站式车规芯片成品制造服务。 （文章来源：证券日报） ...

Core Viewpoint - The demand for high bandwidth memory (HBM) driven by artificial intelligence and high-performance computing continues to rise, leading to active performance in the HBM sector on the secondary market. Company Summaries - **Unisoc (紫光国微)**: Latest stock price is 86.69 CNY with a daily increase of +10.00%. The company's HBM products are in the sample system integration verification stage [1] - **Chipone (芯源微)**: Latest stock price is 209.09 CNY with a daily increase of +10.63%. The company has received high recognition from downstream customers in the HBM and 2.5D/3D packaging fields, with multiple products in mass production [2] - **Zhongke Feimeng (中科飞测)**: Latest stock price is 196.98 CNY with a daily increase of +9.20%. The company's graphic wafer defect detection equipment and 3D morphology measurement equipment have passed verification from multiple domestic HBM customers, achieving mass shipments [3] - **Yake Technology (雅克科技)**: Latest stock price is 92.68 CNY with a daily increase of +6.63%. The company's subsidiary UP Chemical is a core supplier of precursors for SK Hynix, supplying materials needed for HBM [4] - **JCET (长电科技)**: Latest stock price is 43.99 CNY with a daily increase of +4.79%. The company has launched the XDFOI high-performance packaging technology platform, which supports advanced packaging requirements for HBM [5] - **Shannon Microelectronics (香农芯创)**: Latest stock price is 170.53 CNY with a daily increase of +4.29%. The company is one of the distributors for SK Hynix and holds agency qualifications for HBM products, positioned in the core supply chain of the industry [6] - **Semei Shanghai (盛美上海)**: Latest stock price is 204.77 CNY with a daily increase of +5.23%. The company’s wet processing equipment and copper plating equipment can be used in HBM manufacturing processes, and related packaging equipment can be used for its 2.5D packaging technology [7] - **Lianrui New Materials (联瑞新材)**: Latest stock price is 64.65 CNY with a daily increase of +6.74%. The company supplies packaging materials for HBM, including ball silicon and Lowα ball aluminum used in GMC (granular epoxy molding compound) [8] - **Feikai Materials (飞凯材料)**: Latest stock price is 26.19 CNY with a daily increase of +6.94%. The company produces and sells epoxy molding compounds (EMC), which are key materials required for HBM storage chip manufacturing [9]

截至1月15日收盘，存储芯片概念上涨2.33%，位居概念板块涨幅第3，板块内，118股上涨，蓝箭电 子、矽电股份等20%涨停，康强电子、百傲化学、三孚股份等涨停，上海新阳、珂玛科技、芯源微等涨 幅居前，分别上涨16.60%、12.09%、10.63%。跌幅居前的有天奥电子、雷科防务、航宇微等，分别下 跌10.01%、9.99%、8.07%。 今日涨跌幅居前的概念板块 | 概念 | 今日涨跌幅（%） | 概念 | 今日涨跌幅（%） | | --- | --- | --- | --- | | 光刻胶 | 2.83 | 小红书概念 | -5.25 | | 中芯国际概念 | 2.59 | Sora概念(文生视频) | -4.03 | | 存储芯片 | 2.33 | 拼多多概念 | -4.03 | | 国家大基金持股 | 2.30 | Web3.0 | -3.84 | | 草甘膦 | 2.29 | 军工信息化 | -3.82 | | 磷化工 | 2.14 | 快手概念 | -3.72 | | 金属锌 | 2.12 | DRG/DIP | -3.70 | | 光刻机 | 2.05 | 短剧游戏 | -3.54 | | 同 ...

截至1月15日收盘，国家大基金持股概念上涨2.30%，位居概念板块涨幅第4，板块内，33股上涨，南大 光电、江波龙、中科飞测等涨幅居前，分别上涨10.15%、9.39%、9.20%。跌幅居前的有盛科通信、北 斗星通、机器人等，分别下跌7.11%、3.50%、2.53%。 国家大基金持股概念资金流入榜 | 代码 | 简称 | 今日涨跌幅 | 今日换手率 | 主力资金流量（万 | 主力资金净流入比率 | | --- | --- | --- | --- | --- | --- | | | | （%） | （%） | 元） | （%） | | 301308 | 江波龙 | 9.39 | 9.05 | 90860.73 | 12.31 | | 600584 | 长电科 技 | 4.79 | 7.00 | 72079.13 | 13.37 | | 300346 | 南大光 电 | 10.15 | 23.70 | 63058.93 | 6.71 | | 002371 | 北方华 创 | 2.72 | 1.73 | 48827.43 | 7.91 | | 688012 | 中微公 司 | 5.28 | 2.84 | 4462 ...

证券之星消息，1月15日半导体板块较上一交易日上涨1.74%，蓝箭电子领涨。当日上证指数报收于 4112.6，下跌0.33%。深证成指报收于14306.73，上涨0.41%。半导体板块个股涨跌见下表： 从资金流向上来看，当日半导体板块主力资金净流入54.81亿元，游资资金净流出22.98亿元，散户资金净 流出31.84亿元。半导体板块个股资金流向见下表： | 代码 | 名称 | 主力净流入 (元) | | 主力净占比 游资净流入 (元) | | 游资净占比 散户净流入 (元) | | 散户净占比 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 301308 | 江波龙 | | 9.31 G | 12.61% | -5.18 Z | -7.02% | -4.13 Z | -5.59% | | 600584 | 长电科技 | | 6.97 Z | 12.92% | -2.09亿 | -3.88% | -4.87 Z | -9.04% | | 002371 | 北方华创 | | 5.01 亿 | 8.12% | -5.00 亿 | -8.10% ...

数据显示，博时基金旗下1只基金重仓长电科技。博时国证消费电子主题指数发起式A（020983）三季 度增持4.39万股，持有股数6.5万股，占基金净值比例为2.58%，位居第十大重仓股。根据测算，今日浮 盈赚取约13.91万元。 博时国证消费电子主题指数发起式A（020983）成立日期2024年4月23日，最新规模3319.74万。今年以 来收益4.98%，同类排名2593/5525；近一年收益42.02%，同类排名1765/4208；成立以来收益79.27%。 博时国证消费电子主题指数发起式A（020983）基金经理为李庆阳。 截至发稿，李庆阳累计任职时间1年349天，现任基金资产总规模115.88亿元，任职期间最佳基金回报 170.45%， 任职期间最差基金回报-1.28%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 1月15日，长电科技涨5.1%，截至发稿，报44.12元/股，成交40.00亿元，换手率5.23%，总市值789.49亿 元。 资料显示，江苏长电科 ...

Group 1 - The global memory market is entering a "super cycle," with price increases spreading to downstream packaging and testing segments due to rising demand for advanced packaging, increased raw material costs, and tight capacity [1] - Major companies in the memory packaging and testing sector are operating at full capacity, with Taiwanese firms raising prices and A-share listed companies reporting full production status [1] - Companies like Shenzhen Changcheng Development Technology Co., Ltd. and Jiangsu Changdian Technology Co., Ltd. are experiencing significant growth in their memory-related packaging and testing businesses, with revenue in related sectors increasing by nearly 70% year-on-year [1] Group 2 - As traditional chip processes face physical limits, advanced packaging and testing technologies are becoming crucial for enhancing chip performance, prompting A-share listed companies to actively invest in these technologies [2] - Jiangsu Changdian Technology Co., Ltd. plans to increase R&D investment in advanced packaging technologies to align with the growing demand [2] - Shenzhen Baiwei Storage Technology Co., Ltd. offers integrated solutions for storage and wafer-level advanced packaging, aiming to create significant value in the AI era [2] Group 3 - Chinese companies in the memory packaging and testing sector are enhancing their competitiveness through R&D innovation and capacity expansion, with expectations of increasing market share in the future [3]

Group 1: Core Business and Technology - Changdian Technology is the largest OSAT manufacturer in mainland China, possessing advanced and comprehensive chip packaging technologies, including wafer-level packaging, 2.5D/3D packaging, system-in-package, flip-chip packaging, wire bonding packaging, and mainstream advanced packaging solutions [1] - The company is accelerating its transformation and optimizing its product structure, with a focus on high-end manufacturing projects in wafer-level packaging, which is expected to gradually improve gross margins and profitability [1] - The company has launched the XDFOI? chiplet high-density multi-dimensional heterogeneous integration series process, which has entered mass production and is applied in high-performance computing, artificial intelligence, 5G, and automotive electronics [1] Group 2: Automotive Sector - The company's product types cover various applications in the automotive sector, including smart cockpits, intelligent networking, ADAS, sensors, and power devices [2] - Changdian Technology is strengthening its industrial ecosystem partnerships and enhancing its one-stop service capabilities, while deepening cooperation with leading domestic and international clients [2] - The company is building an automated production facility for automotive electronics in Shanghai, which is expected to achieve full-process automation from chip packaging to finished product testing by December 2025 [2] Group 3: Memory Sector - The company has over 20 years of experience in memory packaging and is a leader in high-density 3D packaging and control chip testing [3] - The acquisition of Shengdie Semiconductor, a major flash memory packaging and testing factory, enhances the company's capabilities and market share in the enterprise SSD high-end market [3] - The company is focusing on the development of high-density storage products, leveraging synergies across multiple factories [3] Group 4: Financial Projections - Revenue projections for Changdian Technology are estimated to be 40.256 billion, 44.286 billion, and 48.420 billion yuan for the years 2025, 2026, and 2027, respectively, with net profits of 1.642 billion, 2.007 billion, and 2.424 billion yuan [3]

受AI算力需求爆发影响，存储芯片产能供应吃紧，价格大幅上涨。机构分析师对中国证券报记者表 示，今年第一、第二季度存储芯片及下游产品涨价预计还将延续。近期，多家国产存储芯片企业相继公 布扩大产能项目，计划加大研发投入。 存储价格上涨 1月12日，市场研究机构Counterpoint Research发布报告显示，存储市场行情已经超过2018年的历史高 点，供应商议价能力已达到历史最高水平，预计2026年第一季度市场价格还将上涨40%至50%，第二季 度继续上涨约20%。 存储芯片广泛应用于 服务器 ，以及个人电脑、 智能手机 等电子产品。有媒体近日报道，以256G的 DDR5服务器内存为例，其单条价格已超过4万元，如果按1盒100条计算，一盒产品价格已超过上海部 分房产。 记者了解到，笔记本内存条的价格自2025年四季度以来也已经显著上涨。以三星电子的16G DDR5内存 条为例，该产品2025年9月在京东商城的价格为380多元，到2025年12月涨到了899元，至发稿当天则涨 至1399元。 TrendForce集邦咨询调查报告显示，存储芯片上涨带动下游电子消费品价格上涨。终端产品面临成本考 验，智能手机、个 ...