目 录 | 斯达半导体股份有限公司 2025 年第一次临时股东大会参会须知 3 | | --- | | 斯达半导体股份有限公司 年第一次临时股东大会会议议程 4 2025 | | 议案一： 关于公司符合向不特定对象发行可转换公司债券条件的议案 6 | | 议案二： 关于公司向不特定对象发行可转换公司债券方案的议案 8 | | 议案三： 关于公司向不特定对象发行可转换公司债券预案的议案 18 | | 议案四： 关于公司向不特定对象发行可转换公司债券方案的论证分析报告的议 | | 案 19 | | 议案五： 关于公司向不特定对象发行可转换公司债券募集资金使用可行性分析 | | 报告的议案 20 | | 议案六： 关于公司前次募集资金使用情况的专项报告的议案 21 | | 议案七： 关于公司向不特定对象发行可转换公司债券摊薄即期回报的填补措施 | | 的议案 22 | | 议案八： 关于公司可转换公司债券持有人会议规则的议案 24 | | 议案九： 关于公司未来三年（2025-2027 年）股东回报规划的议案 25 | | 议案十： 关于提请股东大会授权董事会及其授权人士全权办理本次向不特定对 | | 象发行可转换 ...

Core Viewpoint - The company, Sda Semiconductor, plans to issue convertible bonds to unspecified investors, aiming to raise up to RMB 150 million for various projects and working capital [1][2]. Group 1: Convertible Bond Issuance - The convertible bonds will be issued at a face value of RMB 100 each, with a term of six years from the issuance date [1]. - The initial conversion price will not be lower than the average trading price of the company's stock over the previous twenty trading days and the last trading day before the announcement [2]. - The issuance will be authorized by the company's shareholders and will involve negotiations with the lead underwriter regarding the final interest rate and issuance method [1][2]. Group 2: Fund Allocation - The total investment for the projects is RMB 203.43 million, with the following allocations: - Automotive-grade SiC MOSFET module manufacturing project: RMB 100.25 million, with RMB 60 million from the bond issuance - IPM module manufacturing project: RMB 30.08 million, with RMB 27 million from the bond issuance - Automotive-grade GaN module industrialization project: RMB 30.11 million, with RMB 20 million from the bond issuance - Working capital: RMB 43 million, fully funded by the bond issuance [3][2]. Group 3: Previous Fundraising Activities - The company raised a total of RMB 400.96 million from two previous fundraising activities, including an initial public offering and a private placement [5][4]. - The initial public offering raised RMB 50.96 million, with a net amount of RMB 45.95 million allocated to various projects [4]. - In 2021, the company conducted a private placement, raising approximately RMB 3.5 billion, with a net amount of RMB 3.48 billion after expenses [4].

Core Viewpoint - Stada Semiconductor plans to issue convertible bonds totaling up to RMB 150 million to optimize its capital structure, support business development, and enhance market competitiveness [2] Group 1: Convertible Bond Issuance - The proposed convertible bonds will have a face value of RMB 100 each and will be issued at par, with a term of six years from the issuance date [2] - The interest rate for the bonds will be determined based on market conditions and discussions with the lead underwriter prior to issuance [2] - The conversion period for the bonds will start six months after issuance and last until the maturity date, with the initial conversion price set at no less than the average trading price of the company's stock over the last twenty trading days prior to the announcement [2] Group 2: Use of Proceeds - The funds raised will be allocated to several projects, including: 1. Automotive-grade SiC MOSFET module manufacturing project with a total investment of RMB 100,245.26 million, seeking RMB 60 million from the raised funds [3] 2. IPM module manufacturing project with a total investment of RMB 30,080.35 million, seeking RMB 27 million from the raised funds [3] 3. Automotive-grade GaN module industrialization project with a total investment of RMB 30,107.68 million, seeking RMB 20 million from the raised funds [3] 4. Working capital supplementation project with a total investment of RMB 43 million, seeking the full amount from the raised funds [3] Group 3: Financial Performance - The financial reports from 2022 to Q1 2025 show the following: - Revenue figures: RMB 270,549.84 million, RMB 366,296.54 million, RMB 339,062.07 million, and RMB 91,923.04 million [2] - Net profit figures: RMB 82,074.64 million, RMB 92,069.91 million, RMB 51,338.67 million, and RMB 10,485.51 million [2] - Debt-to-asset ratios: 19.45%, 23.44%, 30.09%, and 31.81% [2] - Current ratios: 8.91, 6.31, 3.83, and 3.62 [2] - Quick ratios: 7.70, 4.49, 2.55, and 2.36, indicating strong solvency [2]

Core Viewpoint - The company is issuing convertible bonds to unspecified investors, which may dilute immediate returns for existing shareholders, and outlines measures to mitigate this impact [1][10]. Financial Impact of the Convertible Bond Issuance - The issuance will affect key financial metrics, with scenarios analyzed based on different profit growth rates for 2025 compared to 2024 [3][4]. - The total share capital will increase from 239,469,014 shares in December 2024 to 258,104,401 shares if all bonds are converted [3]. - Under three scenarios for net profit in 2025, the diluted earnings per share (EPS) will vary, with a potential decrease to 1.97 yuan/share if profits decline by 10% [4][5]. Necessity and Reasonableness of Fundraising - The funds raised will be used for projects aligned with the company's core business in power semiconductor chips, enhancing its market position and competitiveness [6][7]. - The company has a strong technical team and market presence, ensuring successful project implementation [8][9]. Measures to Mitigate Dilution of Immediate Returns - The company plans to strengthen fund management and project execution to ensure timely benefits from the raised capital [10]. - It will enhance operational management and internal controls to improve efficiency and profitability [10][11]. - A commitment to a robust profit distribution policy will be maintained to provide stable returns to shareholders [11]. Commitments from Major Stakeholders - The controlling shareholder and management have made commitments to not interfere with company operations and to protect shareholder interests [11][12]. - The board and senior management have pledged to avoid unfair benefit transfers and to ensure compliance with regulatory requirements [12].

Core Viewpoint - The company plans to issue convertible bonds to raise funds for three key projects: the manufacturing of automotive-grade SiC MOSFET modules, IPM modules, and the industrialization of automotive-grade GaN modules, along with supplementing working capital. This initiative aligns with national industrial policies and the company's strategic development direction, aiming to enhance market competitiveness and financial stability [1][17]. Group 1: Fundraising and Investment Plans - The total amount to be raised from the convertible bond issuance is up to RMB 150,000 million, with a total investment plan of RMB 203,433.29 million across various projects [1]. - The company will initially use its own or raised funds to start projects before the bond proceeds are available, ensuring project continuity [1]. Group 2: Project Necessity Analysis - The automotive-grade SiC MOSFET module project aims to leverage industry opportunities and maintain the company's leading position in the automotive semiconductor market, particularly for electric vehicles [2][3]. - The IPM module project responds to the national "dual carbon" strategy and aims to meet the growing market demand for energy-efficient white goods, with a projected domestic demand of 440 million units by 2024, reflecting a 20.8% year-on-year growth [4][10]. - The automotive-grade GaN module project focuses on enhancing technical capabilities and expanding product offerings in the rapidly growing electric vehicle sector, with the GaN power device market expected to reach USD 2.6 billion in 2023 [6][11]. Group 3: Feasibility Analysis of Investment Projects - The rapid development of the new energy vehicle industry provides a broad market space for the SiC MOSFET module project, with projected sales of 1,288.8 million units in China by 2024, a 34.4% increase year-on-year [7][8]. - The company's strong brand image and established customer relationships in the power semiconductor sector provide a solid foundation for the successful implementation of these projects [9]. Group 4: Economic Benefits and Financial Impact - The SiC MOSFET module project has a total investment of RMB 100,245.26 million, with RMB 60,000 million sourced from the bond issuance [12][13]. - The IPM module project requires an investment of RMB 30,080.35 million, with RMB 27,000 million from the bond proceeds, aimed at expanding production capacity [14][15]. - The GaN module project involves an investment of RMB 30,107.68 million, with RMB 20,000 million from the bond issuance, focusing on enhancing production capabilities [16]. Group 5: Overall Impact on Company Management and Financial Status - The issuance of convertible bonds is expected to enhance the company's core competitiveness and risk resistance, aligning with long-term development goals [17]. - The financial structure will improve as the asset scale expands, potentially lowering the debt-to-asset ratio and increasing net assets over time [17][18].

斯达半导体股份有限公司 可转换公司债券持有人会议规则 第一章 总则 第一条 为规范斯达半导体股份有限公司（以下简称"公司"）可转换公司债 券持有人会议的组织和行为，界定债券持有人会议的权利和义务，保障债券持有 人的合法权益，根据《中华人民共和国公司法》《中华人民共和国证券法》、中国 证券监督管理委员会(以下简称"中国证监会")发布的《上市公司证券发行注册管 理办法》、上海证券交易所发布的《上海证券交易所股票上市规则》《上海证券交 易所上市公司自律监管指引第 12 号——可转换公司债券》等法律法规及其他规 范性文件的规定和《斯达半导体股份有限公司章程》(以下简称"《公司章程》") 的规定，并结合公司的实际情况，特制订本规则。 第五条 投资者认购、持有或受让本次可转债，均视为其同意本规则的所有 规定并接受本规则的约束。 第二章 债券持有人的权利与义务 第六条 本次可转债债券持有人的权利： 第二条 本规则所指的可转换公司债券为公司依据《斯达半导体股份有限公 司向不特定对象发行可转换公司债券募集说明书》（以下简称"《可转债募集说明 书》"）约定发行的可转换公司债券（以下简称"可转债"），债券持有人为通过认 购、购买或 ...

斯达半导体股份有限公司 截至 2024 年 12 月 31 日止 前次募集资金使用情况报告及 鉴证报告 目 录 | | | | 一、 | 前次募集资金使用情况报告的鉴证报告 | 1-2 | | --- | --- | --- | | 二、 | 前次募集资金使用情况报告 | 1-7 | 关于斯达半导体股份有限公司 截至2024年12月31日止 前次募集资金使用情况报告的鉴证报告 信会师报字[2025]第ZA14661号 斯达半导体股份有限公司全体股东： 我们接受委托，对后附的斯达半导体股份有限公司（以下简称"斯 达半导"） 截至2024年12月31日止前次募集资金使用情况报告（以下 简称"前次募集资金使用情况报告"）执行了合理保证的鉴证业务。 一、管理层的责任 斯达半导管理层的责任是按照中国证券监督管理委员会《监管规 则适用指引——发行类第7号》的相关规定编制前次募集资金使用情 况报告。这种责任包括设计、执行和维护与前次募集资金使用情况报 告编制相关的内部控制，确保前次募集资金使用情况报告真实、准确、 完整，不存在虚假记载、误导性陈述或重大遗漏。 二、注册会计师的责任 我们的责任是在执行鉴证工作的基础上对前次募 ...

证券代码：603290 证券简称：斯达半导 公告编号：2025-024 斯达半导体股份有限公司 鉴于公司拟申请向不特定对象发行可转换公司债券，按照相关法律法规要求， 为保障投资者知情权，维护投资者利益，公司对最近五年是否被证券监管部门和 交易所处罚或采取监管措施的情况进行了自查，自查结果如下： 一、 公司最近五年被证券监管部门和交易所处罚的情况 经自查，公司最近五年不存在被证券监管部门和交易所处罚的情况。 二、 公司最近五年被证券监管部门和交易所采取监管措施的情况 经自查，公司最近五年不存在被证券监管部门和交易所采取监管措施的情况。 特此公告。 斯达半导体股份有限公司董事会 2025 年 06 月 27 日 关于公司最近五年不存在被证券监管部门和交易所 采取监管措施或处罚情况的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 斯达半导体股份有限公司（以下简称"公司"）自上市以来，严格按照《中 华人民共和国公司法》《中华人民共和国证券法》《上海证券交易所股票上市规 则》等法律、法规和规范性文件的相关规定以及《公司章程》的规定 ...

根据《中华人民共和国公司法》《上市公司监管指引第3号——上市公司现 金分红（2025年修订）》《上海证券交易所上市公司自律监管指引第1号——规 范运作》等法律法规的相关要求以及《公司章程》的相关规定，公司在充分考虑 公司实际经营情况及未来发展需要的基础上，制定了《斯达半导体股份有限公司 未来三年（2025年-2027年）股东回报规划》（以下简称"本规划"），具体内 容如下： 斯达半导体股份有限公司 未来三年（2025年-2027年）股东回报规划 一、制定本规划考虑的因素 本规划着眼于公司长远和可持续的发展，综合考虑公司所处行业特点、公司 实际经营情况及未来发展规划、盈利水平、公司财务及现金流状况、外部融资环 境及股东回报等因素，建立对投资者科学、持续、稳定的股东回报规划和机制， 以保证公司利润分配政策的持续性和稳定性。 二、本规划的制定原则 本规划的制定以符合相关法律法规及《公司章程》关于利润分配的规定为原 则，兼顾公司持续发展需要和投资者合理回报需求，实行持续、稳定的利润分配 政策。 三、未来三年（2025年—2027年）股东回报规划具体内容 （一）利润分配的形式 公司可以采取现金、股票或者现金加股票相结合 ...

斯达半导体股份有限公司 截至 2024 年 12 月 31 日止 前次募集资金使用情况报告 斯达半导体股份有限公司 截至2024年12月31日止 前次募集资金使用情况报告 使用情况报告第1页 根据中国证券监督管理委员会《监管规则适用指引——发行类第 7号》的相关规定，本公司将截至2024年12月31日止前次募集资金使 用情况报告如下： 一、 前次募集资金基本情况 （一）前次募集资金金额、资金到位情况 1、2020年首次公开发行股票 经中国证券监督管理委员会《关于核准嘉兴斯达半导体股份有限公司首次公 开发行股票的批复》(证监许可[2019] 2922号)核准，由主承销商中信证券股份有限 公司采用网下向符合条件的投资者询价配售和网上向持有上海市场非限售A股股 份和非限售存托凭证市值的社会公众投资者定价发行相结合的方式发行人民币普 通股（A股）4,000.00万股，发行价格为每股12.74元。 公司实际已向社会公开发行人民币普通股（A股）4,000.00万股，募集资金总 额人民币50,960.00万元，扣除承销费和保荐费人民币3,500.00万元（含税价）后的 募集资金为人民币47,460.00万元，已于2020年 ...