（来源：嘉兴日报） 本次"春风行动暨就业援助季"新春系列招聘活动由南湖区人力社保局主办，从正月初八持续至正月底， 将在区级零工市场和科技城分市场累计推出14场新春专场招聘会。首场公益招聘会共有39家重点企业携 1463个岗位进场，涵盖了机械制造、半导体、新材料、现代服务等多个行业领域，100余人当场达成初 步就业意向。 昨天上午，科技城零工分市场再次迎来求职高峰。斯达半导体、金石包装、悦声纸业等30余家企业早早 设摊，提供技术工程师、行政文员、普工等各类岗位1000余个。不少求职者手持简历，在企业展位前驻 足咨询；招聘专员则热情介绍岗位要求、薪资待遇等情况，现场交流声此起彼伏。 "年前就听说节后会有好几场招聘会，今天一大早就特地过来看看。"来自安徽阜阳的张师傅去年在一家 机械厂工作，今年想换个工作环境，"今天看到好几家企业在招焊工，工资比去年涨了一些，已经和两 家企业约好了去厂里看看。"大学毕业的本地姑娘小陈则更关注职业发展前景："我学的是电子信息工 程，希望能进一家有技术积累的企业，将来能有更好的个人成长空间。刚刚和一家半导体公司的HR聊 了一下，感觉岗位比较对口。" 区内招聘活动火热进行的同时，南湖区跨省 ...

Core Viewpoint - The 2026 CCTV Spring Festival Gala serves as a cultural feast and a showcase of the global chip industry, highlighting the advancements in China's chip technology from "usable" to "highly usable" [1][29] Group 1: Robotics Showcase - Four humanoid robots, MagicBot Z1, Galbot G1, Unitree H1, and "Little Bumi," showcased at the gala, demonstrating the capabilities of eight chip companies that support these "tech performers" [3][29] - MagicBot Z1 features 100% domestically produced core chips, with Allwinner Technology providing the main SoC chip for overall control and motion planning [4][5] - Galbot G1 relies on NVIDIA's AGX Orin 64GB chip, achieving 275 TOPS of computing power for AI interactions [6][7] - Unitree H1, the most commercially successful model, utilizes multiple chips including Intel's Core i7 for high-performance motion control and NVIDIA's Jetson Orin NX for edge AI inference [8][9][10][11] - "Little Bumi" targets the consumer market with a price under 10,000 yuan, using Rockchip's RK3588 SoC for approximately 6 TOPS of AI computing power [12][13][14] Group 2: Broadcasting Technology - The gala achieved 8K ultra-high-definition wireless broadcasting, supported by four chip companies that built the computational foundation [15][29] - Huawei's Hi3536DV400 chip enabled real-time compression of 8K video, while the Kunpeng 920S chip supported over 1 billion concurrent live requests [16][17] - AMD's EPYC 9004 series chips provided rendering power for real-time graphics during the event [18] Group 3: Communication Infrastructure - The seamless connection between the main venue and four sub-venues relied on three chip companies for communication technology [19][29] - Huawei's Tian Gang 02 base station chip facilitated low-latency transmission of 8K signals, marking the large-scale application of 5G-A technology [19] - ZTE and China Star Network contributed to the 5G-A network and satellite communication, ensuring stable signal transmission in remote areas [20][21] Group 4: Stage Control and Perception - The precise operation of stage lighting, robotic arms, and AR effects depended on three chip companies providing MCU, power chips, and perception chips [22][29] - GigaDevice's GD32H7 series MCU enabled rapid light switching and robotic movement control [23] - STMicroelectronics' IGBT power chips ensured stable operation of high-power stage equipment [24] - Orbbec provided depth perception chips for the Unitree H1 robot, enhancing spatial awareness and obstacle avoidance [25] Group 5: End-User Experience - The viewing experience for audiences was enhanced by three chip companies ensuring high-quality visuals and security [26][29] - Hisense's X9 image quality chip optimized 8K visuals for the gala [27] - Unisoc's financial-grade security chips safeguarded interactive data during the event [28] - BDU's BD960 positioning chip ensured synchronization of devices across different locations [29]

Group 1 - The stock price of Sda Semiconductor (603290) has shown volatility over the past week, closing at 105.12 yuan on February 13, 2026, with a decline of 2.08% on that day and a cumulative increase of 2.36% over the last five days [1] - On February 12, the net outflow of main funds was approximately 28.99 million yuan, accounting for 3.97% of the day's trading volume, and on February 13, there was a continued net outflow of about 14.26 million yuan, indicating short-term capital divergence [1] Group 2 - The power semiconductor industry has recently gained attention, with several companies reporting price increases, and Sda Semiconductor is recognized as a leading domestic IGBT and silicon carbide chip manufacturer [2] - The domestic self-sufficiency rate of silicon carbide chips has increased to 28%, and companies like Sda Semiconductor are accelerating ecosystem integration in emerging fields such as solid-state transformers, potentially benefiting from the growing demand for AI computing infrastructure [2]

Group 1: Mergers and Acquisitions - SpaceX has confirmed its merger with xAI, aiming to integrate AI with rocket technology and space-based internet solutions, highlighting the need for sustainable energy sources for AI development [2] Group 2: Technological Advancements - Tesla has achieved mass production of dry electrode technology, a significant breakthrough in lithium battery production that reduces costs and energy consumption while enhancing scalability [3] - The launch of Step 3.5 Flash by Jiyue Xingchen introduces a powerful open-source model with advanced reasoning capabilities, designed for complex tasks and efficient processing [7] Group 3: Market Developments - Long Fiber announced that the global fiber optic cable market remains stable, despite fluctuations in product prices, and emphasized the minor impact of new data center products on overall demand [8] - TrendForce has revised its projections for memory prices in Q1 2026, anticipating significant increases in DRAM and NAND Flash prices due to heightened demand from AI and data centers [12] Group 4: Investments and Financing - ZTE plans to invest 117 million yuan in the Jianxing Zhanlu Fund, focusing on new information technology, renewable energy, AI, and advanced manufacturing [6] - Zhujijidong has completed a $200 million Series B financing round, with participation from various notable investors, aiming to increase R&D and market investments in 2026 [13] - Wofei Changkong has secured nearly 1 billion yuan in financing to support the certification and commercialization of its AE200 eVTOL aircraft [14]

Core Viewpoint - The Shanghai Stock Exchange's Listing Review Committee approved the refinancing of SIDA Semiconductor Co., Ltd. (603290.SH), confirming that it meets the issuance, listing, and information disclosure requirements [1] Group 1: Issuance Details - SIDA Semiconductor plans to issue convertible bonds to unspecified investors, with a face value of RMB 100.00 per bond, and a total fundraising amount not exceeding RMB 150 million [2][3] - The bonds will have a term of six years from the date of issuance, with the interest rate to be determined based on market conditions and company specifics [2][3] - The initial conversion price for the bonds will be set at or above the average trading price of the company's stock over the previous twenty trading days prior to the announcement [3] Group 2: Fund Allocation - The total investment for the projects funded by the issuance is RMB 203.43 million, with the following allocations: - RMB 60 million for the automotive-grade SiC MOSFET module manufacturing project - RMB 27 million for the IPM module manufacturing project - RMB 20 million for the industrialization of automotive-grade GaN modules - RMB 43 million for working capital [4] Group 3: Credit Rating - The bonds have been rated "AA+sti" by Dagong Global Credit Rating Co., Ltd., with a stable outlook for the company's credit rating [4]

Company Overview - Stada Semiconductor Co., Ltd. was established on April 27, 2005, and is headquartered in Jiaxing, Zhejiang Province. The company specializes in the design, research and development, production, and sales of semiconductor chips and modules, primarily focusing on IGBT technology. Its products cover IGBT, SiC, GaN, and MCU chips and modules, with voltage levels ranging from 100V to 3300V and current levels from 10A to 3600A, widely used in sectors such as new energy vehicles, industrial control, photovoltaics, energy storage, and home appliances [2] Financial Performance - As of the first three quarters of 2025, the company achieved operating revenue of 2.99 billion yuan, a year-on-year increase of 23.82%. However, the net profit attributable to shareholders decreased by 9.80% to 382 million yuan, with a non-recurring net profit decline of 11.58%. The revenue growth was primarily driven by high-demand sectors such as new energy vehicles and AI servers, while net profit was pressured by a significant increase in R&D expenses, which reached 344 million yuan, accounting for 11.5% of operating revenue. The third quarter of 2025 saw a single-quarter revenue of 1.05 billion yuan, indicating a significant quarter-on-quarter growth [3] Fundraising Projects - The company plans to raise up to 1.5 billion yuan through the issuance of convertible bonds for three major manufacturing projects and to supplement working capital. The specific projects include: - Automotive-grade SiC MOSFET module manufacturing project: 600 million yuan investment, expected annual production capacity of 2.8 million units, projected annual sales revenue of 1.8 billion yuan, with an internal rate of return of 18.45% - IPM module manufacturing project: 270 million yuan investment, expected annual production capacity of 30 million units, projected annual sales revenue of 660 million yuan, with an internal rate of return of 16.00% - Automotive-grade GaN module industrialization project: 200 million yuan investment, expected annual production capacity of 1 million units, projected annual sales revenue of 451 million yuan, with an internal rate of return of 18.73% - Supplementing working capital: 430 million yuan [4] Major Clients - The company's core clients are concentrated in the new energy vehicle, industrial control, and power supply sectors. From 2015 to 2019, major clients included Shanghai Electric Drive, Shenzhen Inovance Technology, and Hefei Juyi Power Systems. Recently, the company has deepened cooperation with leading Tier 1 suppliers in Europe, with products entering the supply chains of several international mainstream automotive manufacturers. In 2024, the company has begun sampling for leading global server power supply manufacturers and is actively expanding into the AI server 800V HVDC power supply market, indicating a shift in client structure from traditional industrial control to high-end automotive and AI scenarios [6] Industry Landscape - The power semiconductor market is expanding, driven by high-growth sectors such as new energy vehicles, AI servers, photovoltaics, and industrial automation. Automotive-grade SiC MOSFETs are rapidly replacing traditional IGBTs due to their high-temperature and high-efficiency characteristics. The adoption of 800V high-voltage direct current power supply architecture in AI data centers is further driving the demand for GaN and SiC devices. As of January 30, 2026, the total market value of the semiconductor discrete device industry reached 466.76 billion yuan, with Stada Semiconductor being a leading player in the IGBT/SiC module sector, holding a market value of 26.49 billion yuan, accounting for approximately 5.7% of the industry. The company is expected to achieve a 30% cost reduction and a gross margin increase to over 50% by establishing a 6-inch SiC production line and planning an 8-inch production line, further solidifying its industry-leading position [9]

Company Overview - Stada Semiconductor Co., Ltd. was established on April 27, 2005, and is headquartered in Jiaxing, Zhejiang Province. The company specializes in the design, research and development, production, and sales of semiconductor chips and modules, primarily focusing on IGBT technology. Its products include IGBT, SiC, GaN, and MCU chips and modules, with voltage levels ranging from 100V to 3300V and current levels from 10A to 3600A, widely used in sectors such as new energy vehicles, industrial control, photovoltaics, energy storage, and home appliances [1] Financial Performance - As of the first three quarters of 2025, the company achieved operating revenue of 2.99 billion yuan, a year-on-year increase of 23.82%. However, the net profit attributable to shareholders decreased by 9.80% to 382 million yuan, with a non-recurring net profit decline of 11.58%. The revenue growth was primarily driven by high-demand sectors such as new energy vehicles and AI servers, while net profit was pressured by a significant increase in R&D expenses, which reached 344 million yuan, accounting for 11.5% of operating revenue. In Q3 2025, the single-quarter revenue reached 1.05 billion yuan, showing a significant quarter-on-quarter growth, indicating a continuous recovery in revenue [2] Fundraising Projects - The company plans to raise up to 1.5 billion yuan through the issuance of convertible bonds for three major manufacturing projects and to supplement working capital. The specific projects include: - Automotive-grade SiC MOSFET module manufacturing project: 600 million yuan investment, expected annual production capacity of 2.8 million units, projected annual sales revenue of 1.8 billion yuan, with an internal rate of return of 18.45% - IPM module manufacturing project: 270 million yuan investment, expected annual production capacity of 30 million units, projected annual sales revenue of 660 million yuan, with an internal rate of return of 16.00% - Automotive-grade GaN module industrialization project: 200 million yuan investment, expected annual production capacity of 1 million units, projected annual sales revenue of 451 million yuan, with an internal rate of return of 18.73% - Supplementing working capital: 430 million yuan [3] Major Clients - The company's core clients are concentrated in the new energy vehicle, industrial control, and power supply sectors. From 2015 to 2019, major clients included leading domestic motor controller and inverter manufacturers such as Shanghai Electric Drive, Shenzhen Inovance Technology, and Hefei Juyi Power Systems. In recent years, the company has deepened cooperation with top-tier European suppliers, with products entering the supply chains of several international mainstream automotive manufacturers. By 2024, the company has begun sampling for leading global server power supply manufacturers and is actively expanding into the AI server 800V HVDC power supply market, indicating a shift in client structure from traditional industrial control to high-end automotive and AI scenarios [5] Industry Landscape - The power semiconductor sector is a core component of power electronic systems, benefiting from high-growth areas such as new energy vehicles, AI servers, photovoltaics, and industrial automation. The market space is continuously expanding. Automotive-grade SiC MOSFETs are rapidly replacing traditional IGBTs due to their high-temperature and high-efficiency characteristics, with increasing penetration rates. The adoption of 800V high-voltage direct current power supply architecture in AI data centers further drives the demand for GaN and SiC devices. As of January 30, 2026, the total market value of the semiconductor discrete device industry reached 466.76 billion yuan, with Stada Semiconductor, as a leading domestic IGBT/SiC module manufacturer, having a market value of 26.49 billion yuan, accounting for approximately 5.7% of the industry. The company is expected to achieve a 30% cost reduction and a gross margin increase to over 50% by establishing a 6-inch SiC production line and planning an 8-inch production line, further solidifying its leading position in the industry [7]

Core Viewpoint - The company, Sda Semiconductor Co., Ltd., has received approval from the Shanghai Stock Exchange for its application to issue convertible bonds, aiming to raise funds for strategic projects in the power semiconductor sector [1][5]. Company Overview - Sda Semiconductor is a leading player in the domestic power semiconductor industry, headquartered in Jiaxing, Zhejiang, with subsidiaries in Shanghai, Zhejiang, Chongqing, and Europe. The company focuses on the design, research, production, and sales of power semiconductor chips and modules, particularly IGBT and SiC technologies [4]. - The company ranks fifth globally in the IGBT module market according to Omdia's 2023 report, showcasing its competitive strength [4]. Financial Performance - For the first half of 2025, the company reported operating revenue of 1.935 billion, a decrease from 3.391 billion in 2024 and 3.663 billion in 2023. The net profit for the same period was 279 million, down from 513 million in 2023 [5]. - The company has a stable shareholding structure, with Hong Kong Sda holding 41.66% of the shares, making it the controlling shareholder [5][6]. Fundraising and Project Focus - The company plans to raise 1.5 billion for four core projects, aligning with industry trends and its strategic layout. The projects include: - Manufacturing of automotive-grade SiC MOSFET modules, with an investment of 600 million [7]. - Manufacturing of IPM modules, with an investment of 270 million [7]. - Industrialization of automotive-grade GaN modules, with an investment of 200 million [7]. - Supplementing working capital, with an investment of 430 million [7]. - The demand for power semiconductors is growing, particularly for third-generation semiconductor devices like SiC and GaN in sectors such as new energy vehicles and energy storage [7]. Market Position and Opportunities - The company is a major supplier of high-power automotive-grade IGBT/SiC modules for electric vehicle motor controllers, with plans to supply over 3 million sets in 2024 [4]. - The successful fundraising from the convertible bonds will enhance the company's production capacity and technological competitiveness, allowing it to seize opportunities in the rapidly evolving power semiconductor industry [7].

Core Viewpoint - The Shanghai Stock Exchange's Listing Review Committee has approved the application of Stada Semiconductor Co., Ltd. for issuing convertible bonds to unspecified objects, pending approval from the China Securities Regulatory Commission (CSRC) [1]. Group 1 - The meeting of the Shanghai Stock Exchange's Listing Review Committee took place on January 30, 2026, where the application for issuing convertible bonds was reviewed and deemed to meet the issuance and listing conditions as well as information disclosure requirements [1]. - The issuance of convertible bonds is subject to the approval of the CSRC, and there is uncertainty regarding whether the application will receive the necessary registration approval and the timing of such approval [1]. - The company commits to fulfilling its information disclosure obligations in accordance with relevant laws and regulations as the matter progresses [1].

关于向不特定对象发行可转换公司债券申请 获得上海证券交易所上市审核委员会审核通过的公告 证券代码：603290 证券简称：斯达半导 公告编号：2026-002 斯达半导体股份有限公司 敬请广大投资者注意投资风险。 特此公告。 斯达半导体股份有限公司董事会 2026 年 01 月 31 日 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 上海证券交易所上市审核委员会于 2026 年 01 月 30 日召开 2026 年第 3 次审 议会议（以下简称"会议"），对斯达半导体股份有限公司（以下简称"公司"） 向不特定对象发行可转换公司债券的申请进行了审议。根据会议审议结果，公司 本次向不特定对象发行可转换公司债券的申请符合发行条件、上市条件和信息披 露要求。 公司本次向不特定对象发行可转换公司债券事项尚需获得中国证券监督管 理委员会（以下简称"中国证监会"）作出同意注册的决定后方可实施。公司本 次发行最终能否获得中国证监会同意注册的决定及其时间尚存在不确定性。公司 将根据该事项的进展情况，严格按照有关法律法规的规定和要求及时履行信息 ...