证券代码：688082 证券简称：盛美上海 公告编号：2025-083 盛美半导体设备（上海）股份有限公司 第三届董事会第一次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 2025 年 11 月 17 日，盛美半导体设备（上海）股份有限公司（以下简称"公 司"）第三届董事会第一次会议在中国（上海）自由贸易试验区丹桂路 999 弄 B2 栋会议室举行，本次会议应出席董事 7 名，实际出席会议的董事 7 名。全体董事 认可本次会议的通知时间、议案内容等事项。本次会议的召集和召开程序符合《中 华人民共和国公司法》（以下简称《公司法》）《中华人民共和国证券法》等法律 法规及《盛美半导体设备（上海）股份有限公司章程》（以下简称《公司章程》） 和《盛美半导体设备（上海）股份有限公司董事会议事规则》的相关规定，合法 有效。 本次会议由公司全体董事共同推举 HUI WANG 先生主持。 二、董事会会议审议情况 （一）审议通过了《关于选举公司第三届董事会董事长的议案》 公司董事会同意选举 HUI WA ...

盛美上海公告称，公司第三届董事会第一次会议审议通过议案，同意使用92,234.85万元募集资金向全资 子公司盛帷上海增资，实施"研发和工艺测试平台建设项目"。2025年9月，公司向特定对象发行股票， 实际募资净额44.35亿元。本次增资金额将全部作为注册资本，增资后盛帷上海注册资本将由7亿元增至 16.22亿元，仍为公司全资子公司。本次增资有助于推进募投项目建设，未改变募资用途，符合公司及 股东利益。 ...

Market Overview - The main board saw significant gains with notable stocks such as Yuanlong Yatu (+10.02%), Langchao Software (+10.01%), and Rongji Software (+10.00%) leading the charge [1] - The ChiNext board experienced a surge with Fu Shi Holdings (+20.07%), Xuan Ya International (+20.01%), and Si Chuang Medical (+20.00%) [1] - The Sci-Tech Innovation board also performed well, highlighted by Longxun Co. (+20.00%), Guangyun Technology (+19.99%), and Dongxin Co. (+12.75%) [1] - Active sub-industries included SW Marketing Agency (+5.68%) and SW Semiconductor Equipment (+3.71%) [1] Domestic News - Li Cheng Technology's board approved a resolution to expand advanced packaging capacity, purchasing a factory from AU Optronics for NT$68.98 billion (approximately RMB 15.7 billion) to meet growing demand for panel-level fan-out packaging (FOPLP) [1] - Qingyi Optoelectronics launched a high-end mask production base in Foshan, covering mainstream and next-generation display technologies, including a-Si, LTPS, AMOLED, LTPO, and MicroLED [1] - Lian Micro announced an investment agreement to build a project with an annual output of 1.8 million 12-inch heavily doped substrate wafers, with a total investment of RMB 2.262 billion [1] - Shengmei Shanghai successfully delivered its first panel-level advanced packaging electroplating equipment, Ultra ECP ap-p, to a leading panel manufacturer [1] Company Announcements - Lian Micro completed the cancellation of Jiaxing Kangjing, with all remaining assets distributed among partners [2] - Chipeng Micro announced the early termination of a share reduction plan, reducing its shareholding to 31,711,604 shares (24.15%) [2] - Juguang Technology reported the unfreezing of 430,000 shares held by a major shareholder, accounting for 7.55% of his holdings and 0.48% of the company's total shares [2] - Donghua Software's general manager completed a share reduction plan, selling 1,519,180 shares, which is 0.0474% of the total shares [2] International News - GlobalFoundries acquired AMF, a Singapore-based chip manufacturer focused on silicon photonics, aiming to become the largest silicon photonics manufacturer globally [3] - ROHM launched an analog proximity sensor using VCSEL as the light-emitting element, capable of high-speed and high-precision detection [3] - LG Display reported an increase in panel prices per square meter, rising from $804 in Q1 to $1,365 in Q3, despite a 27.8% year-on-year decrease in shipment area [3] - International DRAM spot prices saw a steady increase, with DDR5 16G (2Gx8) prices rising by 0.27% to an average of $24.833 [3]

Core Insights - Shengmei Shanghai has successfully delivered its first panel-level advanced packaging electroplating equipment, Ultra ECP ap-p, to a leading panel manufacturing customer, marking a significant milestone in the large panel market [2] - The Ultra ECP ap-p system is designed to meet stringent device requirements and offers performance comparable to traditional round wafer processes, enabling manufacturers to efficiently meet growing demands for next-generation devices [2] - The system utilizes patented ACM technology for horizontal electroplating and supports various materials including copper, nickel, tin-silver, and gold, enhancing its versatility in semiconductor manufacturing [2] Company Overview - Shengmei Shanghai provides wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications, with a comprehensive portfolio of semiconductor process equipment [3] - The company has recently launched the Ultra LithKrF, its first KrF process front-end coating and developing equipment, aimed at supporting semiconductor front-end manufacturing, with the first system delivered to a leading logic wafer factory in September [3]

Group 1 - The article emphasizes that the advanced packaging equipment industry is entering a golden era driven by the AI wave and domestic substitution, with significant growth opportunities arising from the demand for advanced packaging technologies [1][8]. - The global advanced packaging market is projected to grow from $46 billion in 2024 to $79.4 billion by 2030, with a compound annual growth rate (CAGR) of 37% for 2.5D/3D packaging technologies from 2023 to 2029 [7][8]. - The Chinese semiconductor packaging equipment market is expected to reach a sales revenue of 28.27 billion yuan in 2024, reflecting an 18.93% year-on-year growth [12]. Group 2 - The article discusses the rapid development of domestic semiconductor packaging equipment manufacturers in China, such as North Huachuang and Shengmei Shanghai, amidst a competitive landscape dominated by international giants [8][9]. - The demand for advanced packaging technologies is driven by the need for high-density integration and improved chip performance, particularly in AI models, data centers, and high-end consumer electronics [7][8]. - The article highlights the evolution of bonding technologies, with a significant shift towards advanced techniques that enhance integration density and performance, such as hybrid bonding and laser debonding [13][16]. Group 3 - The article outlines the critical role of various semiconductor equipment types, including thinning machines, dicing machines, and die bonders, in the advanced packaging process, emphasizing the need for precision and efficiency [27][28]. - It notes that the laser cutting technology is gaining traction due to its advantages in energy efficiency and adaptability to complex packaging requirements, with the global wafer cutting equipment market expected to grow significantly [26]. - The article also mentions the importance of surface functionalization technologies in enhancing the performance of advanced packaging, particularly in applications like chip-on-wafer and fan-out packaging [35][39].

Group 1 - The core point of the news is that Shengmei Shanghai has successfully delivered its first panel-level advanced packaging electroplating equipment, Ultra ECP ap-p, to a leading panel manufacturing customer, marking a significant advancement in the large panel market [1] - The Ultra ECP ap-p system is the first commercial panel-level copper electroplating system designed for large panels, supporting electroplating processes in pillar, bump, and redistribution layer (RDL) technologies, achieving performance comparable to traditional round wafer processes [1] - The system utilizes patented ACM technology for horizontal electroplating and supports multiple materials including copper, nickel, tin-silver, and gold, featuring high-speed electroplating paddles designed for high pillar applications [1] Group 2 - Shengmei Shanghai is a supplier of wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications, with a comprehensive portfolio of semiconductor process equipment [2] - The company reported a third-quarter revenue of 1.881 billion yuan, a year-on-year increase of 19.61%, and a net profit of 570 million yuan, up 81.04% year-on-year [2] - For the first three quarters of 2025, the company achieved a revenue of 5.146 billion yuan, a year-on-year increase of 29.42%, and a net profit of 1.266 billion yuan, up 66.99% year-on-year, driven by significant growth in main business revenue and gross profit [2]

证券代码：688082 证券简称：盛美上海 公告编号：2025-081 盛美半导体设备（上海）股份有限公司 关于选举第三届董事会职工代表董事的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）第二届董事会任期即将届满，根据《中华人 民共和国公司法》（以下简称《公司法》）《上海证券交易所科创板股票上市规则》《上海证券交易所 科创板上市公司自律监管指引第1号一一规范运作》等法律、法规、规范性文件和《盛美半导体设备 （上海）股份有限公司章程》（以下简称《公司章程》）等相关规定，公司于2025年11月13日召开了职 工代表大会，会议经出席本次会议的全体职工代表投票表决，一致同意选举杨霞云女士为公司第三届董 事会职工代表董事（简历详见附件）。 根据《公司章程》的规定，杨霞云女士将与公司股东会选举产生的三名非独立董事和三名独立董事共同 组成公司第三届董事会，任期与第三届董事会任期一致。 上述职工代表董事符合《公司法》等法律、法规、规范性文件和《公司章程》等规定的任职条件。本次 ...

证券日报网讯 11月14日晚间，盛美上海发布公告称，公司于2025年11月13日召开了职工代表大会，会 议经出席本次会议的全体职工代表投票表决，一致同意选举杨霞云女士为公司第三届董事会职工代表董 事。 （文章来源：证券日报） ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-081 盛美半导体设备（上海）股份有限公司 关于选举第三届董事会职工代表董事的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）第二届董事会 任期即将届满，根据《中华人民共和国公司法》（以下简称《公司法》）《上海 证券交易所科创板股票上市规则》《上海证券交易所科创板上市公司自律监管指 引第1号——规范运作》等法律、法规、规范性文件和《盛美半导体设备（上海） 股份有限公司章程》（以下简称《公司章程》）等相关规定，公司于2025年11 月13日召开了职工代表大会，会议经出席本次会议的全体职工代表投票表决，一 致同意选举杨霞云女士为公司第三届董事会职工代表董事（简历详见附件）。 根据《公司章程》的规定，杨霞云女士将与公司股东会选举产生的三名非独 立董事和三名独立董事共同组成公司第三届董事会，任期与第三届董事会任期一 致。 特此公告。 盛美半导体设备（上海）股份有限公司 董事会 2025年11月15日 附件：杨 ...

北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 2025 年第四次临时股东会之法律意见书 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券 监督管理委员会（以下简称中国证监会）《上市公司股东会规则》（以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的，不包括中国香港特别行政区、中国澳门特别行政区和中国台湾省）现行有效 的法律、行政法规、规章和规范性文件和现行有效的公司章程有关规定，指派律 师出席了公司于 2025 年 11 月 14 日召开的 2025 年第四次临时股东会（以下简称 本次股东会），并就本次股东会相关事项出具本法律意见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 本所依据上述法律、行政法规、规章及规范性文件和《公司章程》的有关规 定以及本法律意见书出具日以前已经发生或者存在的事实，严格履行了法定职责， ...