格隆汇12月29日丨东芯股份(688110.SH)公布，公司于近日收到谢莺霞女士出具的《关于股份减持计划 实施完毕的告知函》，在本次减持计划期间，谢莺霞女士累计已减持公司股份14.06万股，占公司总股 本的比例为0.0318%。截至本公告发布日，谢莺霞本次股份减持计划已实施完毕。 ...

格隆汇12月29日丨东芯股份(688110.SH)公布，截至2025年12月26日，回购专用证券账户在减持期间内 出售已回购股份300万股，占总股本的0.6783%，减持均价为120.82元/股，现决定提前终止本次回购股 份减持计划，公司本次回购股份集中竞价减持已实施完毕。 ...

公司于 2025 年 11 月 21 日在上海证券交易所网站（www.sse.com.cn）披露 了《关于回购股份集中竞价减持股份暨董监高减持股份计划公告》（公告编号： 2025-077），公司计划自减持回购股份计划公告披露之日起 15 个交易日后的 3 个 月内，通过集中竞价交易方式，按照市场价格累计减持不超过 3,000,000 股已回 购股份，占公司总股本的 0.6783%。若此期间公司发生送红股、资本公积金转增 股本等导致公司股本总数变动的情形，公司将对减持股份数量进行相应调整。 截至 2025 年 12 月 26 日，回购专用证券账户在减持期间内出售已回购股份 2,999,919 股，占总股本的 0.6783%，减持均价为 120.82 元/股，现决定提前终止 本次回购股份减持计划，公司本次回购股份集中竞价减持已实施完毕。 证券代码：688110 证券简称：东芯股份 公告编号：2025-081 东芯半导体股份有限公司 关于回购股份集中竞价减持股份结果暨股份变动 公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担 ...

证券代码：688110 证券简称：东芯股份 公告编号：2025-082 东芯半导体股份有限公司 关于董事、高级管理人员减持股份结果公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示： 一、减持主体减持前基本情况 1 | | 董事、监事和高级管理人员 | √是 | □否 | | --- | --- | --- | --- | | | 其他：/ | | | | 持股数量 | 562,500股 | | | | 持股比例 | 0.1272% | | | | 当前持股股份来源 | IPO 前取得：562,500股 | | | 上述减持主体无一致行动人。 二、减持计划的实施结果 董事、高级管理人员持有的基本情况 截至 2025 年 11 月 21 日，东芯半导体股份有限公司（以下简称"公司"或"本 公司"）董事、总经理谢莺霞女士持有公司股份 562,500 股，占公司总股本的比 例为 0.1272%。上述股份均来源于公司首次公开发行前持有的股份，且已于 2022 年 12 月 12 日解除限售后上市流通。 ...

Core Manufacturing Segment: The Foundation of Domestic Substitution - The manufacturing segment is the heavy asset core of the storage industry, responsible for key processes such as chip lithography and etching, and is a critical breakthrough area for domestic substitution [3] - Domestic companies have achieved large-scale production in the two main storage fields of 3D NAND and DRAM, forming a "fourth pole" in the global market [3] Key Companies in Core Manufacturing - **Yangtze Memory Technologies Co., Ltd. (YMTC)**: The only domestic IDM company focused on integrated design and manufacturing of 3D NAND flash, with a global NAND market share expected to reach 13% by 2025 [4] - **Changxin Memory Technologies (CXMT)**: The largest and most advanced DRAM manufacturer in China, with a focus on 19nm process technology and significant revenue growth in Q3 [5] - **Fujian Jinhua Integrated Circuit Co., Ltd.**: Focuses on niche DRAM markets, providing cost advantages in mid-to-low-end applications [6] - **Newport Semiconductor**: A leading manufacturer of specialty process storage chips, focusing on NOR Flash and special storage for critical fields [7] - **SMIC**: A leading global integrated circuit foundry, providing core support for storage chip foundry services [8] - **Huahong Semiconductor**: A core enterprise for specialty process storage chip foundry, with leading yield control levels [10] Chip Design Segment: The Core Engine of Technological Innovation - The design segment is the technological core of the industry chain, responsible for storage chip architecture design, circuit layout, and functional definition [12] - Domestic companies have achieved technological breakthroughs in NOR Flash, niche DRAM markets, and storage control chips, with some products reaching international mainstream levels [12] Key Companies in Chip Design - **Lanke Technology**: A leading global memory interface chip design company, with a total market value expected to reach 138.58 billion yuan by 2025 [13] - **GigaDevice Semiconductor**: A leader in NOR Flash and niche DRAM design, with a total market value of 151.58 billion yuan by 2025 [14] - **Unisoc**: A top-tier provider of storage technology products and services, with significant economic benefits from its fourth-generation SeDRAM technology [15] - **Dongxin Technology**: A rare Fabless company providing NAND, NOR, and DRAM design solutions [16] - **Daqin Technology**: A leader in automotive-grade storage and SRAM/DRAM design, benefiting from the explosion of smart automotive storage demand [17] Module Integration Segment: The Key Bridge Connecting Chips and Terminals - The module segment integrates chips with main control and interface components to form products like SSDs, UFS, and eMMC, which are core to meeting terminal demands [26] - Benefiting from the growth of AI smartphones, AI PCs, and AI servers, this segment is crucial for the storage industry [26] Key Companies in Module Integration - **Jiangbolong**: A leading third-party storage module company with significant revenue growth and a total market value of 111.87 billion yuan [27] - **Baiwei Storage**: Focused on embedded storage and PCIe SSD modules, with leading market share in embedded storage products [28] - **Demingli**: An integrated company providing domestic storage main control chips and module solutions [29] - **Langke Technology**: A well-known consumer storage module company with a stable market share [30] - **Jintai Technology**: A company developing both consumer and industrial-grade storage modules [31] Supporting Services and Specialty Fields: Important Support for the Industry Ecosystem - Supporting service companies provide full-chain support for the storage industry, including storage system solutions, testing equipment, and security storage [42] - Specialty field companies focus on niche scenarios, forming differentiated competitive advantages [42] Key Companies in Supporting Services - **Tongyou Technology**: A leading provider of enterprise-level storage system solutions, focusing on data center and cloud computing [43] - **Hangyu Micro**: A provider of storage and computing solutions for aerospace, with products suitable for space scenarios [44] - **Hualan Micro**: A provider of security storage and storage interface chip solutions, making significant progress in domestic security storage interface chip substitution [45] - **Hongshan Technology**: A provider of enterprise-level storage systems and data management solutions [46] - **Zeshi Technology**: A provider of storage chip and module testing equipment, supporting domestic storage enterprises [47] 2025 Storage Industry Development Summary - By 2025, China's storage industry has built a complete ecosystem covering "manufacturing-design-module-support services," with core companies achieving breakthroughs in technology and market share [58] - Leading companies like Yangtze Memory and Changxin Memory are pushing domestic storage to occupy an important position in the global market [58] - The "super cycle" of the storage industry will continue to evolve, with domestic companies accelerating breakthroughs in high-end fields such as HBM, 3D stacking, and secure storage [59]

Group 1 - The core viewpoint of the news highlights the performance and growth of the Sci-Tech Innovation 100 Index and its ETF, indicating a positive trend in the market with a recent increase in both index and ETF values [1][3] - The Sci-Tech Innovation 100 Index ETF has seen a significant increase in its scale, reaching 6.158 billion yuan, marking a new high in the past month [3] - The ETF has experienced a notable inflow of funds, with a net inflow of 8.1815 million yuan recently, and a total of 140 million yuan over the last ten trading days [3] Group 2 - The National Venture Capital Guidance Fund has been launched, focusing on early-stage investments in hard technology sectors such as artificial intelligence, biopharmaceuticals, quantum technology, and 6G, with a long-term investment horizon of 15 to 20 years [1] - A strategic emerging industry development fund of 51 billion yuan has been initiated, targeting sectors like artificial intelligence, aerospace, high-end equipment, and future energy, which are expected to receive dual support from policies and funding [2] - The top ten weighted stocks in the Sci-Tech Innovation 100 Index account for 26.72% of the index, indicating a concentration in key companies such as Huahong Semiconductor and East China Semiconductor [3]

融资方面，东芯股份当日融资买入3.05亿元。当前融资余额32.42亿元，占流通市值的6.06%，融资余额 超过近一年90%分位水平，处于高位。 融券方面，东芯股份12月24日融券偿还1467.00股，融券卖出1133.00股，按当日收盘价计算，卖出金额 13.71万元；融券余量8.06万股，融券余额974.84万元，超过近一年90%分位水平，处于高位。 资料显示，东芯半导体股份有限公司位于上海市青浦区徐泾镇诸光路1588弄虹桥世界中心L4A-F5，成 立日期2014年11月26日，上市日期2021年12月10日，公司主营业务涉及聚焦中小容量通用型存储芯片的 研发、设计和销售。主营业务收入构成为：NAND57.08%，MCP25.88%，DRAM10.43%，NOR6.15%， 其他(补充)0.25%，技术服务0.21%。 截至9月30日，东芯股份股东户数5.13万，较上期增加168.45%；人均流通股8627股，较上期减少 62.75%。2025年1月-9月，东芯股份实现营业收入5.73亿元，同比增长28.09%；归母净利润-1.46亿元， 同比减少12.16%。 12月24日，东芯股份涨2.05%，成交额2 ...

证券代码：688110 证券简称：东芯股份 公告编号：2025-080 东芯半导体股份有限公司 关于 2023 年限制性股票激励计划首次授予及预留授 予第二个归属期、2024 年限制性股票激励计划首次授 予及预留授予第一个归属期归属结果的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示 本次归属股票数量：42.0912 万股。其中，2023 年限制性股票激励计划 首次授予部分第二个归属期第二批次归属 16.632 万股，预留授予部分第二个归 属期归属 6.864 万股；2024 年限制性股票激励计划首次授予部分第一个归属期第 二批次归属 13.936 万股，预留授予部分第一个归属期归属 4.6592 万股。 本次归属股票来源：公司从二级市场回购的本公司 A 股普通股股票。 根据中国证券监督管理委员会、上海证券交易所、中国证券登记结算有限 责任公司上海分公司有关业务规则的规定，东芯半导体股份有限公司（以下简 称"公司"）于 2025 年 12 月 24 日收到中国证券登记结算有限责任公司上海分 公司出具的《 ...

12月23日，东芯股份涨0.88%，成交额21.01亿元。两融数据显示，当日东芯股份获融资买入额3.11亿 元，融资偿还2.17亿元，融资净买入9378.38万元。截至12月23日，东芯股份融资融券余额合计32.72亿 元。 融资方面，东芯股份当日融资买入3.11亿元。当前融资余额32.62亿元，占流通市值的6.22%，融资余额 超过近一年90%分位水平，处于高位。 截至9月30日，东芯股份股东户数5.13万，较上期增加168.45%；人均流通股8627股，较上期减少 62.75%。2025年1月-9月，东芯股份实现营业收入5.73亿元，同比增长28.09%；归母净利润-1.46亿元， 同比减少12.16%。 分红方面，东芯股份A股上市后累计派现1.35亿元。近三年，累计派现5572.35万元。 机构持仓方面，截止2025年9月30日，东芯股份十大流通股东中，嘉实上证科创板芯片ETF（588200） 位居第三大流通股东，持股703.25万股，相比上期减少29.08万股。香港中央结算有限公司位居第五大流 通股东，持股368.08万股，为新进股东。南方中证1000ETF（512100）位居第七大流通股东，持股 2 ...

Core Viewpoint - Dongxin Co., Ltd. focuses on independent research, design, and sales of small-capacity storage chips while innovating in the integrated "storage, computing, and connectivity" field to expand industry applications and optimize business layout [1] Group 1: Company Strategy - The company aims to provide diversified chip solutions for customers [1] - Dongxin Co., Ltd. has invested in Lishan Technology based on recognition of its technology and future market potential, aligning with the company's strategic direction [1] - The company will continue to evaluate investment strategies and optimize asset allocation to create long-term value for itself and its shareholders [1]