证券代码：688110 证券简称：东芯股份 公告编号：2025-079 东芯半导体股份有限公司 关于首次减持回购股份暨回购股份集中竞价减持进展公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示： 回购股份的基本情况 东芯半导体股份有限公司（以下简称"公司"或"本公司"）于 2024 年 7 月 9 日至 2024 年 10 月 8 日期间累计回购公司股份 5,506,814 股，占公司总股本的 1.2452%。前述回购的股份用于维护公司价值及股东权益，将在披露回购结果暨股 份变动公告 12 个月后采用集中竞价交易方式出售。如公司未能在股份回购结果暨 股份变动公告日后三年内出售完毕已回购股份，尚未出售的已回购股份将予以注 销。 减持计划的进展情况 公司于 2025 年 11 月 21 日在上海证券交易所网站（www.sse.com.cn）披露了 《关于回购股份集中竞价减持股份暨董监高减持股份计划公告》（公告编号： 2025-077），公司计划自减持回购股份计划公告披露之日起 15 个交易日后的 3 ...

Group 1 - The automotive chip sector experienced a decline of 2.04%, ranking among the top declines in concept sectors, with companies like Chipone Technology, Dazhong Technology, and Chengdu Huami leading the losses [1] - Among the automotive chip stocks, 18 companies saw their prices increase, with notable gains from Gaoxin Development (up 5.35%), Geer Software (up 4.00%), and Jingfeng Mingyuan (up 2.22%) [1] - The automotive chip sector faced a net outflow of 5.896 billion yuan in main funds, with 108 stocks experiencing net outflows, and 18 stocks seeing outflows exceeding 100 million yuan [2] Group 2 - The top net outflow stock was ZTE Corporation, with a net outflow of 602 million yuan, followed by Heertai, Zhaoyi Innovation, and Dongxin Technology with outflows of 560 million yuan, 494 million yuan, and 402 million yuan respectively [2] - The stocks with the highest net inflows included Aojie Technology, Gaoxin Development, and Hangyu Micro, with net inflows of 146 million yuan, 76 million yuan, and 74 million yuan respectively [2] - The automotive chip concept sector had several companies with significant declines, including Chipone Technology (down 11.70%), Dongxin Technology (down 6.01%), and Chengdu Huami (down 7.07%) [3][4]

Market Performance - The A-share semiconductor sector experienced a significant decline, with notable stocks such as Chipone Technology falling over 10% and Fuxin Technology and Zhongli Group dropping by 9% [1][2] - The semiconductor index (886063) decreased by 1.76%, closing at 7326.63, down 131.03 points [2] - In the Hong Kong market, the Hang Seng Technology Index fell by 2%, with Huahong Semiconductor down over 7% and SMIC down 4% [3][4] Stock Specifics - Chipone Technology (688521.SH) saw a decline of 10.49%, closing at 133.40 [2] - Fuxin Technology (688662.SH) dropped by 9.25%, closing at 53.54 [2] - Zhongli Group (002309.SZ) fell by 9%, closing at 3.64 [2] - Other notable declines included Shengke Communication (-8.22%), Guosheng Technology (-7.12%), and Canxin Technology (-6.24%) [2][3] Broader Industry Trends - The overall trend in the semiconductor industry indicates a bearish sentiment, with multiple companies experiencing significant stock price drops [1][3] - The decline in the semiconductor sector is reflected in both A-share and Hong Kong markets, suggesting a broader industry challenge [3][4]

Core Viewpoint - The financing balance of the Sci-Tech Innovation Board decreased by 1.78 billion yuan compared to the previous day, with 63 stocks seeing an increase in financing balance of over 10 million yuan, led by companies such as Lanke Technology, Xinke Mobile, and Shijia Photon [1][2]. Financing Balance Summary - As of December 11, the total margin financing balance on the Sci-Tech Innovation Board was 260.607 billion yuan, a decrease of 1.71 billion yuan from the previous trading day, with the financing balance specifically at 259.712 billion yuan, down by 1.78 billion yuan [1]. - There are 483 stocks with a financing balance exceeding 100 million yuan, 49 stocks with a balance over 1 billion yuan, 83 stocks with a balance between 50 million and 100 million yuan, and 23 stocks with a balance below 50 million yuan [1]. Net Financing Inflows - The stocks with the highest net financing inflows include Lanke Technology with a financing balance of 6.057 billion yuan, an increase of 199 million yuan, despite a daily drop of 0.93%. Other notable stocks include Xinke Mobile and Shijia Photon with net inflows of 91.741 million yuan and 72.449 million yuan, respectively [2]. - Among the stocks that received net inflows exceeding 10 million yuan, the average daily increase was 0.91%, with top gainers including Moer Thread, Fuxin Technology, and Zhenlei Technology, which rose by 28.04%, 20.00%, and 17.40%, respectively [2]. Industry Preferences - The industries attracting the most interest from financing clients include electronics, power equipment, and machinery, with 24, 9, and 7 stocks respectively [2]. - The average ratio of financing balance to market capitalization for the stocks favored by financing clients is 4.23%, with Zhongke Lanyun having the highest ratio at 11.98% [2].

Core Viewpoint - Dongxin Co., Ltd. is actively matching suitable chip products based on customer needs, focusing on various applications such as personal computers, professional design, AIPC, cloud gaming, cloud rendering, and digital twins [2] Group 1 - Dongxin Co., Ltd. responded to investor inquiries on an interactive platform regarding its chip products [2] - The company's chips are primarily used in personal computers and professional design applications [2] - Additional applications for the chips include AIPC, cloud gaming, cloud rendering, and digital twins [2]

证券日报网讯 12月10日，东芯股份在互动平台回答投资者提问时表示，公司目前聚焦于中小容量存储 芯片的研发、设计和销售，暂不涉及3DNAND业务，但公司在该方面拥有相应的技术储备。公司也将 持续关注主营业务相关领域的新兴技术和行业动态，做好技术及产品研发储备，不断提升公司的核心竞 争力。 （编辑 丛可心 王雪儿） ...

证券日报网讯12月10日，东芯股份在互动平台回答投资者提问时表示，公司目前紧抓存储芯片国产替代 的历史机遇，深耕本土市场，搭建了灵活、高效的研发、生产运营及销售体系，在产品定义、设计开 发、量产出货、售后服务与技术改良等环节为客户提供一站式支持，有效提升合作效率，为客户使用公 司产品及技术提供了有力的保障。公司自成立以来，始终坚持自主研发、持续创新的发展战略，经过多 年的技术积累和研发投入，公司在NAND、NOR、DRAM等存储芯片的设计核心环节均拥有了自主研发 能力与核心技术。 ...

证券日报网讯12月10日，东芯股份在互动平台回答投资者提问时表示，存储器类产品不涉及自研IP核的 相关概念。国产的存储电路设计相关EDA工具，可以提供从电路设计、仿真验证到版图生成等相关服 务，可以助力工程师的研发设计工作，提升产品的市场竞争力。 ...

证券日报网讯12月10日，东芯股份在互动平台回答投资者提问时表示，公司聚焦平面型SLCNANDFlash 的设计与研发，主要产品采用浮栅型工艺结构，存储容量覆盖512Mb至32Gb，可灵活选择SPI或PPI类 型接口，搭配3.3V/1.8V两种电压，可满足客户在不同应用领域及应用场景的需求。 ...

Group 1 - The core point of the article is that Dongxin Co., Ltd. announced a strategic cooperation framework agreement between its subsidiary, Lishuan Technology, and a leading domestic cloud computing service provider [1] - The cooperation will focus on areas such as the development of domestic cloud desktop systems, domestic AIPC, cloud rendering, and digital twin solutions [1] - Currently, only a framework agreement has been signed, and no specific orders or revenue have been generated yet [1]