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晶合集成(688249) - 合肥晶合集成电路股份有限公司信息披露管理制度(草案)
2025-08-28 12:03
合肥晶合集成电路股份有限公司 1 (一)关于公司的、公司股东或高级人员的,或公司上市证券的或该等证券 的衍生工具的; 信息披露管理制度 (草案) (H 股发行并上市后适用) 第一章 总则 第一条 为规范合肥晶合集成电路股份有限公司(以下简称"公司")的信息 披露行为,正确履行信息披露义务,切实保护公司、股东、债权人及其他利益相 关者的合法权益,根据《中华人民共和国公司法》《中华人民共和国证券法》(以 下简称"《证券法》")、中国证券监督管理委员会(以下简称"中国证监会")《上 市公司信息披露管理办法》《上海证券交易所科创板股票上市规则》《香港联合交 易所有限公司证券上市规则》、香港法例第 571 章《证券及期货条例》(以下简称 "《证券及期货条例》")等有关规定,结合《合肥晶合集成电路股份有限公司章 程》(以下简称"《公司章程》"),结合公司具体情况,制定本制度。 第二条 本制度所称"信息"是指将可能对公司证券及其衍生品种价格产生 较大影响或者对投资决策有较大影响、而投资者尚未得知的信息以及公司股票上 市地证券监管规则规定需要及时公开披露的其他信息,包括内幕消息;本制度所 称"披露"是指在规定的时间内、在规定 ...
晶合集成(688249) - 合肥晶合集成电路股份有限公司内部审计制度
2025-08-28 12:03
合肥晶合集成电路股份有限公司内部审计制度 第一章 总则 第一条 为进一步规范合肥晶合集成电路股份有限公司(以下简称"公司") 内部审计工作,提高内部审计工作质量,实现公司内部审计工作规范化、标准化, 发挥内部审计工作在促进公司经济管理、提高经济效益中的作用,根据《公司法》 《证券法》《审计法》《审计署关于内部审计工作的规定》《企业内部控制基本规 范》《上市公司治理准则》等有关法律、法规和其他规范性文件以及《合肥晶合 集成电路股份有限公司章程》的规定,并结合公司实际情况制定本制度。 第二条 本制度适用于公司各内部机构的与财务报告和信息披露事务相 关的所有业务环节所进行的内部审计工作。 第三条 本制度所称内部审计,是指公司稽核室或人员依据国家有关法律 法规和本制度的规定,对本公司各内部机构的内部控制和风险管理的有效性、财 务信息的真实性、完整性以及经营活动的效率和效果等开展的一种评价活动。 第四条 本制度所称内部控制,是指由公司董事会、管理层和全体员工共 同实施的、旨在合理确保实现以下基本目标的一系列控制活动: (一)遵守国家法律、法规、规章及其他相关规定; (二)遵循企业的发展战略; (三)提高公司经营的效率和 ...
晶合集成(688249) - 合肥晶合集成电路股份有限公司募集资金管理制度(草案)
2025-08-28 12:03
合肥晶合集成电路股份有限公司 募集资金管理制度 (草案) (H 股发行并上市后适用) 第一章 总 则 第一条 为了加强对合肥晶合集成电路股份有限公司(以下简称"公司") 募集资金行为的管理,规范募集资金的使用,切实保护广大投资者的利益,根据 《中华人民共和国公司法》《中华人民共和国证券法》《上市公司募集资金监管规 则》《上海证券交易所科创板股票上市规则》《上海证券交易所科创板上市公司自 律监管指引第 1 号--规范运作》《香港联合交易所有限公司证券上市规则》(以 下简称"《香港上市规则》")等相关法律、法规以及《合肥晶合集成电路股份有 限公司章程》(以下简称"《公司章程》")的有关规定制定本制度。 第二条 本制度所称募集资金是指公司通过发行股票或者其他具有股权性 质的证券,向投资者募集并用于特定用途的资金,但不包括公司为实施股权激励 计划募集的资金。本制度仅适用于 A 股募集资金,公司在香港证券市场通过发 行 H 股所募集资金管理按《香港上市规则》的相关规定执行。 第三条 募集资金到位后,公司应及时办理验资手续,由具有证券从业资格 的会计师事务所出具验资报告。公司对募集资金的管理遵循专户存放、规范使用、 如实 ...
晶合集成(688249) - 合肥晶合集成电路股份有限公司股东会议事规则(草案)
2025-08-28 12:03
合肥晶合集成电路股份有限公司股东会议事规则 (草案) (H 股发行并上市后适用) 第一章 总则 第一条 为规范合肥晶合集成电路股份有限公司(以下简称"公司")的 公司治理结构,保证股东依法行使股东权利,确保股东会高效、平稳、有序、规 范运作,根据《中华人民共和国公司法》(以下简称"《公司法》")、《中华人民 共和国证券法》《上市公司股东会规则》《上海证券交易所科创板股票上市规则》 《上市公司治理准则》《香港联合交易所有限公司证券上市规则》等规定及《合 肥晶合集成电路股份有限公司章程》(以下简称"公司章程"),制定本规则。 第二条 公司股东会的召集、提案、通知、召开等事项适用本议事规则。 第三条 公司严格按照法律、行政法规、公司股票上市地证券监管规则、 公司章程及本规则的相关规定召开股东会,保证股东能够依法行使权利。 第四条 公司董事会应当切实履行职责,认真、按时组织股东会。公司审 计委员会应当切实履行职责,必要时召集主持临时股东会。公司全体董事应当勤 勉尽责,确保股东会正常召开和依法行使职权。 第五条 股东会应当在《公司法》和公司章程规定的范围内行使职权。股 东会分为年度股东会和临时股东会。年度股东会每年召开 ...
晶合集成(688249) - 合肥晶合集成电路股份有限公司内部审计制度(草案)
2025-08-28 12:03
合肥晶合集成电路股份有限公司 内部审计制度 (草案) (H 股发行并上市后适用) 第一章 总则 第一条 为进一步规范合肥晶合集成电路股份有限公司(以下简称"公司") 内部审计工作,提高内部审计工作质量,实现公司内部审计工作规范化、标准化, 发挥内部审计工作在促进公司经济管理、提高经济效益中的作用,根据《公司法》 《证券法》《审计法》《审计署关于内部审计工作的规定》《企业内部控制基本 规范》《上市公司治理准则》《香港联合交易所有限公司证券上市规则》等有关 法律、法规和其他规范性文件以及《合肥晶合集成电路股份有限公司章程》的规 定,并结合公司实际情况制定本制度。 第二条 本制度适用于公司各内部机构的与财务报告和信息披露事务相关的 所有业务环节所进行的内部审计工作。 第三条 本制度所称内部审计,是指公司稽核室或人员依据国家有关法律法 规、公司股票上市地证券监管规则和本制度的规定,对本公司各内部机构的内部 控制和风险管理的有效性、财务信息的真实性、完整性以及经营活动的效率和效 果等开展的一种评价活动。 第四条 本制度所称内部控制,是指由公司董事会、管理层和全体员工共同 实施的、旨在合理确保实现以下基本目标的一系列控制 ...
晶合集成(688249) - 合肥晶合集成电路股份有限公司董事、高级管理人员所持公司股份及其变动管理制度
2025-08-28 12:03
合肥晶合集成电路股份有限公司 董事、高级管理人员所持公司股份及其变动管理制度 第一章 总 则 第一条 为加强对合肥晶合集成电路股份有限公司(以下简称"公司")董 事和高级管理人员所持公司股份及其变动的管理,进一步明确相关办理程序,根 据《中华人民共和国公司法》(以下简称"《公司法》")、《中华人民共和国 证券法》(以下简称"《证券法》")、《上市公司董事和高级管理人员所持本 公司股份及其变动管理规则》(以下简称"《管理规则》")、《上海证券交易 所上市公司自律监管指引第 15 号——股东及董事、高级管理人员减持股份》《上 海证券交易所科创板股票上市规则》(以下简称"《股票上市规则》")等相关 法律法规、规范性文件及《合肥晶合集成电路股份有限公司章程》(以下简称"《公 司章程》")的有关规定,制定本制度。 第二条 本制度适用于公司董事和高级管理人员及本制度第二十一条规定 的自然人、法人或其他组织持有及买卖公司股票管理。 第三条 本制度所指高级管理人员指公司总经理、联席总经理、执行副总经 理/资深副总经理/副总经理、董事会秘书、财务负责人和《公司章程》规定的其 他人员。 第七条 因公司向不特定对象或向特定对象发行 ...
晶合集成:筹划发行H股股票并在香港联合交易所上市
人民财讯8月28日电,晶合集成(688249)8月28日晚间公告,公司正在筹划发行境外上市股份(H股)并在 香港联合交易所有限公司上市。 ...
半导体分析手册系列之一:AI驱动下的晶圆代工新纪元:2025投产股份格局、技术突破与中国力量
Dongxing Securities· 2025-08-28 08:18
Investment Rating - The report suggests a positive investment outlook for the semiconductor foundry industry, particularly driven by AI and automotive electronics demand [5]. Core Insights - The semiconductor foundry industry is experiencing a significant growth phase, with global semiconductor sales expected to exceed $1 trillion by 2030, growing at a CAGR of 9% from 2025 to 2030 [4][39]. - TSMC dominates the foundry market with a 60% market share, while SMIC, Hua Hong Semiconductor, and others are emerging as key players in the Chinese market [47][52][58]. Summary by Sections Industry Overview - Wafer foundry refers to the manufacturing of semiconductor wafers for other IC design companies without engaging in design itself. It is a crucial segment of the semiconductor industry [3][10]. - The industry is characterized by high capital and technology intensity, with significant investments required for advanced process nodes [22][23]. Market Dynamics - The global semiconductor wafer capacity is projected to grow from 31.5 million wafers per month in 2024 to 33.7 million in 2025, with a growth rate of 6% and 7% respectively [4][37]. - The demand for chips is driven by sectors such as AI, HPC, and automotive electronics, leading to increased R&D investments in advanced process technologies [29][39]. Key Players in China - SMIC is a leading foundry in China, achieving significant revenue growth and technological advancements, including the production of 14nm FinFET technology [52][54]. - Hua Hong Semiconductor is recognized for its comprehensive specialty process platform, focusing on various technology segments [58]. - Jinghe Integrated Circuit has achieved global leadership in the LCD driver chip foundry market [65]. Competitive Landscape - The foundry market is characterized by a "one strong, many strong" competitive structure, with TSMC as the clear leader, followed by Samsung and SMIC [47]. - The report highlights the increasing market share of SMIC, which has risen to third place in the global foundry rankings [47][49]. Future Trends - The report anticipates continued growth in advanced processes (28nm and below) and specialty processes, driven by the rising demand for high-performance computing and AI applications [5][39]. - The foundry industry is evolving towards a "Foundry 2.0" model, which includes not only wafer manufacturing but also packaging, testing, and other integrated services [24].
半导体公司“ESG账本”:披露率超六成 三类议题受关注
Core Insights - The release of the new generation large language model DeepSeek-V3.1 has heightened market attention on the semiconductor industry [1] - ESG (Environmental, Social, and Governance) disclosure is crucial for the long-term competitiveness of the semiconductor sector, with a 66% disclosure rate among 50 selected companies [1][2] - Leading companies in the semiconductor industry tend to have better ESG ratings, with 9 out of the top 10 companies rated B+ or above [1][2] ESG Disclosure and Ratings - Among the 50 semiconductor companies, 33 disclosed their 2024 ESG reports, with top companies showing superior ESG ratings [1][2] - Chip design companies primarily have B ratings, with 17% rated A, indicating room for improvement in ESG information disclosure [2] - Notable companies with A- ratings include Zhongke Semiconductor, Jinghe Integrated, and Changdian Technology [2] Governance and Management Structures - Good corporate governance is essential for the long-term development of semiconductor companies, with many establishing robust governance structures [2] - For instance, Zhongke Semiconductor has a four-tier governance system led by a board of directors, while Cambrian has a three-tier governance structure [2] R&D Investment and Innovation - Cambrian's R&D investment for 2024 is 1.072 billion yuan, accounting for 91% of its revenue, the highest among the 50 companies [3] - Companies like Huada Jiutian and Jingjia Micro also show significant R&D investment ratios of 71% and 60%, respectively [3] - Cambrian leads in new patent authorizations with 314 in 2024, followed by Haiguang Information with 191 [3] Data Security and Privacy - Cambrian has established a comprehensive information security system focusing on people, technology, and operations [3] - However, many companies lack certification for their information security management systems, indicating a need for improvement [3] Employee Development - Companies like Northern Huachuang and Weir Shares have implemented comprehensive training systems to enhance employee skills [4] - Northern Huachuang conducted over 20 specialized training sessions in 2024, with more than 150 participants [4] Carbon Emissions and Resource Management - The semiconductor industry is energy and resource-intensive, with significant carbon emissions during manufacturing [6][8] - In 2021, semiconductor devices were projected to generate 500 million tons of CO2 equivalent over their lifecycle, with 15% from upstream processes [6] - Companies are increasingly disclosing their greenhouse gas emissions data, with Cambrian reporting 1,314.55 tons of CO2 equivalent for 2024 [5] Renewable Energy and Water Management - Companies like Zhongke Semiconductor and Northern Huachuang are making strides in renewable energy usage, with Zhongke purchasing 61,283 MWh of green electricity in 2024 [7] - Water resource management is also critical, with many companies implementing water-saving measures and monitoring usage [8] Market and Regulatory Pressures - The semiconductor industry faces pressure from downstream markets to reduce carbon footprints, with major companies like Apple and Google committing to supply chain carbon neutrality [8][9] - Regulatory frameworks such as the EU's Carbon Border Adjustment Mechanism are influencing semiconductor companies to enhance their sustainability practices [9] Conclusion - The semiconductor industry's sustainable development is vital for its future, with ongoing pressures from environmental challenges and resource constraints driving the need for transformation [9]
晶合集成申请一种沟槽型MOSFET器件的制备方法及MOSFET器件专利,提高沟槽型MOSFET的耐压性能
Jin Rong Jie· 2025-08-23 09:36
Group 1 - The core viewpoint of the news is that Hefei Jinghe Integrated Circuit Co., Ltd. has applied for a patent for a method of preparing trench MOSFET devices, indicating its focus on innovation in semiconductor technology [1] - The patent application was published under the number CN120529608A, with the application date being July 2025 [1] - The patent describes a method that involves forming a trench in the substrate, creating a first gate dielectric layer, and stacking a first gate electrode layer, followed by a second gate dielectric layer and a second gate electrode layer [1] Group 2 - Hefei Jinghe Integrated Circuit Co., Ltd. was established in 2015 and is located in Hefei City, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of approximately 200.61 million RMB [2] - The company has made investments in 9 enterprises, participated in 630 bidding projects, and holds 1200 patent records along with 41 trademark records [2]