Core Insights - The main point of the news is the net inflow of capital in the Shanghai and Shenzhen stock markets, amounting to 9.527 billion yuan, with a notable outflow in the Sci-Tech Innovation Board [1] Group 1: Market Overview - The total net inflow of capital in the Shanghai and Shenzhen markets was 9.527 billion yuan, with the Sci-Tech Innovation Board experiencing a net outflow of 4.624 billion yuan [1] - A total of 210 stocks saw net inflows, while 377 stocks experienced net outflows [1] Group 2: Stock Performance - On the Sci-Tech Innovation Board, 404 stocks increased in value, with three stocks hitting the daily limit up, including Pinming Technology and Fuzhi Environmental Protection [1] - Among the stocks with net inflows, 9 stocks had inflows exceeding 100 million yuan, with Lanqi Technology leading at 302 million yuan [2] - The stocks with the highest net outflows included Haiguang Information, which saw a net outflow of 1.077 billion yuan, followed by Chip Origin and Crystal Integration with outflows of 297 million yuan and 267 million yuan, respectively [1][2] Group 3: Continuous Capital Flow - There were 39 stocks with continuous net inflows for more than three trading days, with Hanwujing leading at 29 consecutive days [2] - A total of 166 stocks experienced continuous net outflows, with Aibo Medical leading at 15 consecutive days [2] Group 4: Detailed Stock Data - The top stocks by net inflow included: - Lanqi Technology: 301.69 million yuan, 4.29% inflow rate, 7.93% increase [2] - Zhongwei Company: 271.03 million yuan, 4.45% inflow rate, 5.17% increase [2] - Wealth Trend: 155.91 million yuan, 9.66% inflow rate, 7.51% increase [2] - The stocks with the highest net outflows included: - Haiguang Information: 1.077 billion yuan, 1.26% decrease [1] - Chip Origin: 297 million yuan, 2.67% decrease [1] - Crystal Integration: 267 million yuan, 2.67% decrease [1]

格隆汇9月29日丨晶合集成(688249.SH)公布，公司已于2025年9月29日向香港联合交易所有限公司(以下 简称"香港联交所")递交了发行境外上市外资股(H股)并在香港联交所主板挂牌上市(以下简称"本次发行 上市")的申请，并于同日在香港联交所网站刊登了本次发行上市的申请资料。 ...

Core Viewpoint - Hefei Jinghe Integrated Circuit Co., Ltd. has submitted a listing application to the Hong Kong Stock Exchange, with China International Capital Corporation as its sole sponsor [1][4]. Company Overview - Jinghe Integrated is a leading global 12-inch pure wafer foundry established in 2015, focusing on advanced process research and application [4]. - The company offers wafer foundry services covering process nodes from 150nm to 40nm and is steadily advancing its 28nm platform [4]. - According to Frost & Sullivan, Jinghe Integrated has the fastest capacity and revenue growth among the top ten global wafer foundries from 2020 to 2024, projected to be the ninth largest globally and the third largest in mainland China by revenue in 2024 [4]. Technology and R&D - The company has established mass production capabilities for technology nodes from 150nm to 40nm and has developed a diverse range of process platforms, including DDIC, CIS, PMIC, Logic IC, and MCU [7]. - Jinghe Integrated strategically positions itself at the core of the semiconductor value chain, providing specialized platforms for transforming chip designs into low-power, high-performance foundry chips [7]. - The company has made significant progress in developing its 28nm logic chip platform and holds a strong portfolio of intellectual property, with 1,177 patents, including 911 invention patents, as of June 30, 2025 [7]. Financial Performance - The company has demonstrated relative stability in financial performance throughout the industry cycle, with total revenues of RMB 10,025.5 million, RMB 7,182.7 million, RMB 9,119.6 million, RMB 4,331.1 million, and RMB 5,129.8 million for the years 2022, 2023, 2024, and the six months ending June 30, 2024, and 2025, respectively [8]. - The gross profit margins for the same periods were 43.1%, 20.3%, 25.2%, 24.1%, and 24.6% [8]. - Net profits for the years 2022, 2023, 2024, and the six months ending June 30, 2024, and 2025, were RMB 3,156.2 million, RMB 119.2 million, RMB 482.2 million, RMB 194.8 million, and RMB 232.0 million, with net profit margins of 31.5%, 1.7%, 5.3%, 4.5%, and 4.5%, respectively [8].

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 证券代码：688249 证券简称：晶合集成 公告编号：2025-062 合肥晶合集成电路股份有限公司 关于向香港联交所递交 H 股发行上市的申请 并刊发申请资料的公告 需要特别予以说明的是，本公告仅为境内投资者及时了解本次发行上市的相 关信息而作出。本公告以及刊登于香港联交所网站的申请资料均不构成也不得视 1 作对任何个人或实体收购、购买或认购公司本次发行的境外上市外资股（H 股） 的要约或要约邀请。 公司本次发行上市尚需满足多项条件（包括但不限于取得中国证券监督管理 委员会的备案、香港证监会、香港联交所及其他有关监管机构的批准、核准或备 案），并需综合考虑市场情况以及其他因素方可实施，该事项仍存在不确定性。 公司将根据相关事项的进展情况，严格按照相关法律法规的规定与要求，及时履 行信息披露义务，敬请广大投资者注意投资风险。 合肥晶合集成电路股份有限公司（以下简称"公司"）已于 2025 年 9 月 29 日向香港联合交易所有限公司（以下简称"香港联交所"）递交了发行境外上市 ...

智通财经APP获悉，据港交所9月29日披露，合肥晶合集成电路股份有限公司(简称：晶合集成) (688249.SH)向港交所主板提交上市申请书，中金公司为其独家保荐人。 招股书显示，晶合集成是一家全球领先的12英寸纯晶圆代工企业。自2015年成立以来，始终致力于研发 并应用行业先进的工艺，为客户提供覆盖150nm至40nm制程、多种应用的工艺平台晶圆代工业务，并稳 定推进28nm平台发展。 根据弗若斯特沙利文的资料，2020年至2024年期间，全球前十大晶圆代工企业中，晶合集成的产能和营 收增长速度为全球第一。根据同一资料来源，2024年，以营业收入计，晶合集成是全球第九大、中国大 陆第三大晶圆代工企业。 晶合集成已建立150nm至40nm技术节点的量产能力。在工艺平台应用方面，公司已具备DDIC、CIS、 PMIC、Logic IC、MCU等工艺平台的技术能力，形成了全面且多元化的工艺组合，支持其在关键细分市 场的领先地位。 晶合集成战略性立足于半导体价值链的核心，为客户提供将芯片设计转化为低功耗、高性能的代工芯片 的专用平台。通过衔接技术发展与大规模生产，公司提供晶圆代工服务及提供广泛应用于消费电子、汽 车 ...

招股书显示，晶合集成是一家全球领先的12英寸纯晶圆代工企业。自2015年成立以来，始终致力于研发 并应用行业先进的工艺，为客户提供覆盖150nm至40nm制程、多种应用的工艺平台晶圆代工业务，并稳 定推进28nm平台发展。 根据弗若斯特沙利文的资料，2020年至2024年期间，全球前十大晶圆代工企业中，晶合集成的产能和营 收增长速度为全球第一。根据同一资料来源，2024年，以营业收入计，晶合集成是全球第九大、中国大 陆第三大晶圆代工企业。 据港交所9月29日披露，合肥晶合集成电路股份有限公司(简称：晶合集成)(688249.SH)向港交所主板提交 上市申请书，中金公司（601995）为其独家保荐人。 晶合集成已建立150nm至40nm技术节点的量产能力。在工艺平台应用方面，公司已具备DDIC、CIS、 PMIC、Logic IC、MCU等工艺平台的技术能力，形成了全面且多元化的工艺组合，支持其在关键细分市 场的领先地位。 晶合集成战略性立足于半导体价值链的核心，为客户提供将芯片设计转化为低功耗、高性能的代工芯片 的专用平台。通过衔接技术发展与大规模生产，公司提供晶圆代工服务及提供广泛应用于消费电子、汽 车电子 ...

格隆汇9月29日｜利弗莫尔证券显示，合肥晶合集成电路股份有限公司向港交所提交上市申请书，独家 保荐人为中金公司。 ...

合肥晶合集成电路股份有限公司向港交所提交上市申请书，独家保荐人为中金公司。 ...

Core Viewpoint - On September 26, among the 31 primary industries tracked by Shenwan, three industries experienced net financing inflows, with the communication industry leading at a net inflow of 1.053 billion yuan [1] Industry Summary - The communication industry had the highest net financing inflow on September 26, amounting to 1.053 billion yuan [1] - Other industries that saw net financing inflows included media and automotive [1] Company Summary - A total of 1,413 individual stocks experienced net financing inflows on September 26, with 68 stocks having inflows exceeding 50 million yuan [1] - Among these, 25 stocks had net inflows surpassing 100 million yuan [1] - Zhongji Xuchuang topped the list with a net inflow of 597 million yuan, followed by companies such as Sairisi, CATL, Jinghe Integration, Xinyi Sheng, Cambridge Technology, and Goldwind Technology [1]

登录新浪财经APP 搜索【信披】查看更多考评等级 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 合肥晶合集成电路股份有限公司（以下简称"公司"）股票于2025年9月24日、2025年9月25日和2025年 9月26日连续3个交易日内收盘价格涨幅偏离值累计超过30%，根据《上海证券交易所交易规则》等有关 规定，属于股票交易异常波动的情形。 ● 经公司自查，并发函询证公司控股股东，截至本公告披露日，不存在应披露而未披露的重大信息。公 司目前生产经营正常，生产经营未发生重大变化。 ● 截至2025年9月26日，公司股票收盘价为32.90元/股，近期公司股价涨跌幅波动较大，超过大部分同行 业公司股价涨跌幅及上证指数涨跌幅。2025年9月24日、2025年9月25日和2025年9月26日，公司股票换 手率分别为6.18%、9.35%、13.53%，显著高于前期换手率水平。公司郑重提醒广大投资者注意二级市 场交易风险，理性决策，审慎投资。 一、股票交易异常波动的具体情况 公司股票于2025年9月24日、2025年 ...