Investment Rating - The investment rating for the company is "Buy" with a previous rating of "Buy" as well [1] Core Views - The company is expected to report a median revenue of 4.4 billion RMB for H1 2024, representing a year-over-year increase of 48%. The net profit attributable to the parent company is forecasted to be 0.93 billion RMB, indicating a turnaround from losses [3][4] - The company has maintained full capacity utilization in Q2 2024, with a utilization rate of 110%, and this high demand is expected to reflect positively in the second half of the year [3][4] - The OLED platform is progressing steadily, and the company is actively expanding its CIS production capacity [4] Summary by Sections Revenue and Profitability - The company forecasts H1 2024 revenue between 4.3 billion and 4.5 billion RMB, with a median of 4.4 billion RMB, showing a year-over-year growth of 48%. The net profit is expected to be between 0.75 billion and 1.10 billion RMB, with a median of approximately 0.93 billion RMB, indicating a return to profitability [4][5] - For Q2 2024, the revenue is projected at 2.172 billion RMB, reflecting a quarter-over-quarter decrease of 3% but a year-over-year increase of 16% [4] Capacity and Production - The company has been operating at full capacity from March to June 2024, with a utilization rate of 110%. Orders have exceeded production capacity, and prices for some products have been adjusted upwards [4][5] - The company anticipates maintaining full capacity in Q3 2024, with production expected to reflect in Q3 and Q4 results due to the typical 2-3 month lead time from wafer production to delivery [4] Product Development - The company has achieved small-scale production of its 40nm high-voltage OLED process, and the 28nm OLED process is under steady development. The automotive-grade DDIC has also begun gradual production [4] - The CIS segment has become the company's second-largest product line, with full capacity in mid-to-high-end CIS production in H1 2024. The company plans to increase its 12-inch capacity by 30,000 to 50,000 wafers per month in 2024 [4][5] Valuation - The estimated EPS for 2024, 2025, and 2026 is projected to be 0.37 RMB, 0.59 RMB, and 0.73 RMB respectively. As of July 15, 2024, the company's market capitalization is approximately 30.2 billion RMB, corresponding to PE ratios of 40.7, 25.7, and 20.6 for the respective years [4][5]

Financial Performance Expectations - The company expects to achieve operating revenue of between 430 million to 450 million CNY for the first half of 2024, representing a year-on-year increase of 44.80% to 51.53%[2]. - The projected net profit attributable to the parent company for the first half of 2024 is between 150 million to 220 million CNY, reflecting a significant year-on-year growth of 443.96% to 604.47%[2]. - The net profit attributable to the parent company after deducting non-recurring gains and losses is expected to be between 75 million to 110 million CNY, indicating a year-on-year increase of 151.30% to 175.24%[2]. Operational Capacity and Product Development - The company has maintained full capacity utilization since March 2024, leading to rapid growth in overall sales and steady improvement in operating revenue and product gross margin[5]. - The company continues to enhance its product structure in the wafer foundry sector, with CIS becoming the second major product line, while DDIC maintains its competitive advantage[5]. - The company has increased its R&D investment, with 55nm mid-to-high-end single-chip and stacked CIS chip technology platforms already in mass production[5]. - The 40nm high-voltage OLED chip technology platform has achieved small-scale production, and the 28nm chip technology platform is progressing steadily[5]. - Some DDIC chips have been applied in the automotive sector, aligning with the demands of the automotive supply chain[5]. Financial Data and Investment Risks - The financial data in the performance forecast has not been audited by a registered accountant and is based on preliminary calculations by the company's finance department[6]. - Investors are advised to pay attention to investment risks as the forecast data is preliminary and the final financial data will be disclosed in the official half-year report[7].

证券简称：晶合集成 证券代码：688249 合肥晶合集成电路股份有限公司 投资者关系活动记录表 编号：2024-006 ☑特定对象调研 □分析师会议 投资者关系活动类 □媒体采访 □业绩说明会 别 □新闻发布会 □路演活动 □现场参观 □电话会议 □其他 （请文字说明其他活动内容） 参与单位名称及人 共36家机构，参会机构名单详见附表。 员姓名 会议时间 2024年7 月2日-2024年7月3日 会议地点 公司会议室 朱才伟 董事、董事会秘书、财务负责人、副总经理 上市公司接待人员 黎翠绫 企业规划协理室协理 姓名 黄凯全 企业规划室部经理 曹宗野 证券事务代表 问题 1、公司目前的产品结构如何？未来计划如何调整 其产品结构和市场策略？ 答复：公司2023年的产品结构中 DDIC 的营收占比约为 85%，CIS 约为 6%、PMIC 约为 6%，DDIC 占比较高的 原因在于2023年DDIC 市场需求复苏相对较为明显，预 ...

证券代码：688249 证券简称：晶合集成 公告编号：2024-044 合肥晶合集成电路股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 上述回购股份符合相关法律法规的规定及公司回购股份方案的规定。 三、 其他事项 公司将严格按照《上市公司股份回购规则》《上海证券交易所上市公司自律监 管指引第 7 号——回购股份》等相关规定，在回购期限内根据市场情况择机做出 回购决策并予以实施，同时根据回购股份事项进展情况及时履行信息披露义务， 敬请广大投资者注意投资风险。 特此公告。 合肥晶合集成电路股份有限公司董事会 | 回购方案首次披露日 | 2023/12/25 | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 2024 年 3 月 日~2025 年 | | 15 | 3 月 | 14 | 日 | | 预计回购金额 | 元~1,000,000,000 500,000,000 ...

证券代码：688249 证券简称：晶合集成 公告编号：2024-043 合肥晶合集成电路股份有限公司 2023 年年度股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东大会召开的时间：2024 年 6 月 27 日 （二） 股东大会召开的地点：安徽省合肥市新站区合肥综合保税区内西淝河路 88 号公司会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 74 | | --- | --- | | 普通股股东人数 | 74 | | 2、出席会议的股东所持有的表决权数量 | 1,320,720,511 | | 普通股股东所持有表决权数量 | 1,320,720,511 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比例 | 67.3017 | | （%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 67 ...

在线 Call Production Component ING&WODD 上海市徐汇区淮海中路999号 上海环贸广场写字楼一期17层 邮编: 200031 17/F. One ICC. Shanghai ICC 999 Huai Hai Road (M) Shanghai, 200031 P.R. China T +86 21 2412 6000 +86 21 2412 6150 arana kum com 北京市金杜律师事务所上海分所 关于合肥晶合集成电路股份有限公司 2023年年度股东大会 的法律意见书 致：合肥晶合集成电路股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受合肥晶合集成电路股份有 限公司(以下简称公司)委托,根据《中华人民共和国证券法》(以下简称《证券 法》）、《中华人民共和国公司法》(以下简称《公司法》)、中国证券监督管理委 员会《上市公司股东大会规则(2022年修订)》(以下简称《股东大会规则》)等中 华人民共和国境内(以下简称中国境内,为本法律意见书之目的,不包括中国香港特 别行政区、中国澳门特别行政区和中国台湾地区）现行有效的法律、行政法规、规章 和规范性文件和现行有 ...

Investment Rating - The investment rating for the company is maintained at "Buy-A" [1]. Core Views - The company is experiencing full capacity utilization with an upward adjustment in foundry prices, and high-end capacity is set to be released soon [1]. - The company plans to expand production by 30,000 to 50,000 wafers per month in 2024, with current capacity at approximately 115,000 wafers per month [1]. - The company has achieved mass production of 55nm TDDI and is progressing steadily with 28nm OLED technology, expected to start small-scale production by the end of 2024 [1]. - The company is positioned as a leading global foundry for display driver chips, with a recovery in the panel industry expected to drive growth [1]. Financial Data and Valuation - Revenue projections for 2024 to 2026 are estimated at 10,069 million, 12,890 million, and 15,210 million yuan, with growth rates of 39.0%, 28.0%, and 18.0% respectively [3][4]. - Net profit attributable to the parent company is projected to be 880 million, 1,321 million, and 1,594 million yuan for the same period, with growth rates of 315.8%, 50.1%, and 20.7% respectively [3][4]. - The company's P/E ratios are forecasted to be 35.6, 23.7, and 19.7 for 2024, 2025, and 2026 respectively [3][4]. - The gross margin is expected to improve from 26.0% in 2024 to 27.5% in 2026 [3][4]. Production and Market Position - The company has successfully completed the development of a low-power high-speed driver platform and is actively collaborating with leading domestic panel manufacturers to accelerate application deployment [1]. - The demand for OLED driver chips is anticipated to continue growing due to the release of domestic OLED production capacity [1]. - The company is also focusing on the micro-display sector, aiming to ramp up production to 30,000 wafers per month for AR/VR applications [1].

合肥晶合集成电路股份有限公司 2023 年年度股东大会会议资料 证券代码：688249 证券简称：晶合集成 合肥晶合集成电路股份有限公司 2023 年年度股东大会会议须知 2023 年年度股东大会 会议资料 2024 年 6 月 | | | | 2023 | | | 年年度股东大会会议须知 1 | | --- | --- | --- | --- | | 2023 | | | 年年度股东大会会议议程 3 | | 2023 | | | 年年度股东大会会议议案 5 | | | 议案一 | 关于 | 2023 年年度报告及其摘要的议案 5 | | | 议案二 | 关于 | 2023 年度财务决算报告的议案 6 | | | 议案三 | 关于 | 2024 年度财务预算的议案 7 | | | 议案四 | 关于 | 2023 年度利润分配方案的议案 8 | | | 议案五 | 关于 | 2023 年度董事会工作报告的议案 9 | | | 议案六 | 关于 | 2023 年度监事会工作报告的议案 10 | | | 议案七 | 关于 | 2023 年度独立董事述职报告的议案 11 | | | 议案八 | | 关于制定会计师事务 ...

中国国际金融股份有限公司 关于合肥晶合集成电路股份有限公司 核心技术人员离职暨新增认定核心技术人员的核查意见 中国国际金融股份有限公司（以下简称"保荐机构"）作为合肥晶合集成电路 股份有限公司（以下简称"公司"或"晶合集成"）首次公开发行股票并在科创板上 市的保荐机构，根据《证券发行上市保荐业务管理办法》《科创板上市公司持续 监管办法（试行）》《上海证券交易所科创板股票上市规则》等有关规定，对公司 核心技术人员离职暨新增认定核心技术人员的事项进行了认真、审慎的核查，具 体核查情况及核查意见如下： 一、核心技术人员离职的具体情况 公司核心技术人员詹奕鹏先生因个人原因申请辞去所任职务，并已办理完成 离职手续。离职后，詹奕鹏先生不再担任公司任何职务。 （一）核心技术人员的具体情况 詹奕鹏，男，1970 年出生，中国台湾，研究生学历。詹奕鹏先生 1997 年 7 月至 2001 年 8 月，任联华电子股份有限公司主任工程师；2001 年 8 月至 2018 年 5 月，任中芯国际集成电路制造（上海）有限公司资深技术总监；2018 年 5 月 至 2019 年 4 月，任中国科学院上海微系统与信息技术研究所顾问；201 ...

证券代码：688249 证券简称：晶合集成 公告编号：2024-042 合肥晶合集成电路股份有限公司 关于核心技术人员离职暨新增认定核心技术人员 的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 合肥晶合集成电路股份有限公司（以下简称"公司"）核心技术人员詹奕 鹏先生因个人原因申请辞去所任职务并于近日办理完成离职手续。离职后，詹奕 鹏先生将不再担任公司任何职务。 詹奕鹏先生与公司签有《劳动合同》《保密、竞业限制、知识产权保护及 诚信行为协议》等相关协议文件，不存在涉及职务发明等知识产权权属纠纷或潜 在纠纷的情形，其离职不影响公司专利等知识产权权属的完整性。 截至目前，詹奕鹏先生所负责的工作已经平稳交接，其离职不会对公司 技术研发、核心竞争力及持续经营能力产生实质性影响。 1 至 2019 年 4 月，任中国科学院上海微系统与信息技术研究所顾问；2019 年 4 月 加入公司以来，历任本公司研发协理、研发副总经理、顾问。 截至本公告披露日，詹奕鹏先生未直接持有公司股票，通过合肥晶煅企业管 理合伙企业（有 ...