Core Viewpoint - Zhongwei Semiconductor (Shenzhen) Co., Ltd. has submitted a listing application to the Hong Kong Stock Exchange, with CITIC Securities International as the sole sponsor [1] Company Overview - Zhongwei Semiconductor is a leading provider of intelligent control solutions in China, specializing in the design and delivery of integrated circuit chips, with microcontrollers (MCUs) as the core of its products [3] - The company is one of the earliest domestic enterprises to independently develop and design MCUs, maintaining a leading position in the industry due to its first-mover advantage and continuous innovation [3] - By 2024, Zhongwei is projected to be the number one MCU company in China by shipment volume and third by revenue [3] Product and Market Position - Zhongwei's MCU products dominate the Chinese consumer electronics and smart home appliance markets, ranking first in the smart home appliance MCU market and second in the consumer electronics MCU market by revenue in 2024 [4] - The company has successfully entered high-growth sectors such as industrial control and automotive electronics, focusing on brushless direct current motors (BLDC) in industrial control and developing advanced M4 and RISC-V architecture automotive-grade products [4] - The company has also made strides in AI, data centers, and robotics, with ongoing R&D investments aimed at accelerating MCU product penetration in these cutting-edge fields [4] Financial Performance - In the fiscal years 2022, 2023, and 2024, Zhongwei's revenues were approximately 637 million, 714 million, and 912 million RMB, respectively, with net profits of 59.34 million, -21.95 million, and 136.83 million RMB [5][7] - The company reported a revenue of approximately 429 million RMB for the first half of 2024 and 504 million RMB for the first half of 2025, with corresponding net profits of approximately 43 million and 86 million RMB [5][7]

智通财经APP获悉，据港交所9月23日披露，中微半导体(深圳)股份有限公司(简称：中微半导(688380.SH))向港交所主板提交上市申请 书，中信建投国际为独家保荐人。 中微半导以MCU设计及开发能力为核心，旗下产品进一步延伸至各类系统级芯片("SoC")、专用集成电路("ASIC")等，为客户提供智能 控制所需的芯片及底层算法一站式整体解决方案，赋能消费电子、智能家电、工业控制及汽车电子等多元应用场景。于往绩期间，公司 的收益主要来自MCU、SoC及ASIC解决方案的提供，以及其他相关产品的销售。 在泛消费领域，中微半导的MCU芯片产品在中国消费电子及智能家电领域佔据市场领先地位，根据弗若斯特沙利文的研究数据，以 2024年收益计，公司在中国智能家电领域MCU芯片市场排名第一、消费电子领域MCU芯片市场排名第二；在泛消费领域基础上，公司 已成功突破MCU芯片高端化应用壁垒，顺利切入工业控制与汽车电子两大高增长关键赛道，其中工业控制领域重点聚焦无刷直流电机 ("BLDC")，而汽车电子领域则持续研发先进M4及RISC-V架构车规级产品，该等架构为广泛应用的微控制器平台，以其高算力、能源效 益及可扩展性着称。 ...

证券代码：688380 证券简称：中微半导 公告编号：2025-038 中微半导体（深圳）股份有限公司 关于完成法定代表人工商变更登记的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担个别及连带责任。 中微半导体（深圳）股份有限公司(以下简称"公司")于2025年8月22日召开第三届董事会第二次会议， 审议通过了《关于聘任公司总经理的议案》，选举YANG YONG（杨勇）先生为公司总经理。具体内容 详见公司2025年8月26日在上海证券交易所官网www.sse.com.cn披露的《关于聘任高级管理人员的公 告》(公告编号:2025-033)。 根据《公司章程》的规定，总经理为公司的法定代表人。近日，公司完成法定代表人的工商变更登记手 续，并取得当地有关部门换发的《营业执照》,公司法定代表人已变更为YANG YONG（杨勇）先生。 除上述事项外，公司《营业执照》其他登记事项不变。 特此公告。 中微半导体（深圳）股份有限公司董事会 2025年9月20日 ...

证券日报网讯9月19日晚间，中微半导发布公告称，根据《公司章程》的规定，总经理为公司的法定代 表人。近日，公司完成法定代表人的工商变更登记手续，并取得当地有关部门换发的《营业执照》，公 司法定代表人已变更为YANGYONG(杨勇)先生。 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 证券代码：688380 证券简称：中微半导 公告编号：2025-038 中微半导体（深圳）股份有限公司 关于完成法定代表人工商变更登记的公告 特此公告。 中微半导体（深圳）股份有限公司董事会 2025 年 9 月 20 日 中微半导体（深圳）股份有限公司(以下简称"公司")于 2025 年 8 月 22 日召开第三届董事会第二次会议，审议通过了《关于聘任公司总经理的议案》， 选举 YANG YONG（杨勇）先生为公司总经理。具体内容详见公司 2025 年 8 月 26 日在上海证券交易所官网 www.sse.com.cn 披露的《关于聘任高级管理人员的 公告》(公告编号:2025-033)。 根据《公司章程》的规定，总经理为公司的法定代表人。近日，公司完成法 定代表人的工商变更登记手续，并取得当地有关部门换发的《营业执照》,公司 法定代表人已变更为 YANG YONG（杨勇）先生。除上述事项外，公司《营业 执照》其他登记事项不变。 ...

2025年8月22日，中微半导体（深圳）股份有限公司召开第三届董事会第二次会议，审议通过《关于聘 任公司总经理的议案》，选举YANGYONG（杨勇）先生为公司总经理，相关公告于8月26日在上海证 券交易所官网披露。根据《公司章程》，总经理为法定代表人。近日，公司完成法定代表人的工商变更 登记，取得换发的《营业执照》，法定代表人变更为YANGYONG（杨勇）先生，《营业执照》其他登 记事项不变。该公司董事会对公告内容真实性、准确性和完整性负责。公告日期为2025年9月20日。 ...

Industry Development - The automotive industry is transitioning towards electrification and intelligence, with AI technology driving vehicles to evolve into "super intelligent entities" since 2025 [1] - The automotive MCU chip market is experiencing rapid growth, with companies developing automotive electronic chip businesses through open-source collaboration and ecosystem building [1] Market Size and Growth - The global MCU market size is projected to reach $30.9 billion in 2023 and $33.8 billion in 2024, with an expected increase to $37 billion by 2025 due to rising demand from automotive and industrial AIoT sectors [2] - The domestic market for automotive-grade MCUs has a current localization rate of 18%, indicating significant room for growth [2] Company Performance - Companies like Zhaoyi Innovation and Zhongwei Semiconductor reported substantial revenue and net profit growth, with Zhaoyi Innovation achieving a revenue of 4.15 billion yuan (up 15%) and a net profit of 575 million yuan (up 11.3%) in the first half of 2025 [2] - Zhongwei Semiconductor's automotive electronic chip revenue reached 17.35 million yuan, marking an 89.4% increase, with products entering major automotive supply chains [3] - Guoxin Technology also reported a revenue of 49.15 million yuan, up 63.81%, with a focus on developing a comprehensive product line in automotive electronic chips [3] Industry Collaboration - The industry is advocating for multi-party cooperation to accelerate the development of the automotive chip sector, emphasizing the importance of collaborative innovation [4] - The establishment of a unified platform and open-source models is seen as a way to enhance industry collaboration, optimize innovation, and attract more participants [4] Challenges and Recommendations - The automotive chip sector faces challenges such as insufficient ecological collaboration, the need for breakthroughs in core technologies, and the validation of business models [4] - Experts suggest leveraging state-owned enterprises to lead the integration of the industry chain and promote development through a "use-promotes-construction" model [4]

Meeting Overview - The shareholders' meeting was held on September 10, 2025, at the Qianhai Financial Center in Shenzhen [2] - The meeting was convened by the board of directors and chaired by Chairman Yang Yong, utilizing both on-site and online voting methods [2][3] Attendance - All 5 current directors attended the meeting, along with the board secretary and other senior executives [3] Resolutions Passed - The following key resolutions were approved: - Company Articles of Association [4] - Rules of Procedure for Shareholders' Meetings [4] - Rules of Procedure for Board Meetings [4] - Related Party Transaction Management Measures [5] - External Guarantee Management System [5] - Independent Director Work System [5] - External Investment Management System [5] - Draft of Company Articles of Association [5] - Draft of Rules of Procedure for Shareholders' Meetings [5] - Draft of Rules of Procedure for Board Meetings [5] - Related Party Transaction Management Measures applicable after H-share issuance [6] - External Guarantee Management System applicable after H-share issuance [6] - Independent Non-Executive Director Work System applicable after H-share issuance [6] - External Investment Management System applicable after H-share issuance [6] - Election of Independent Non-Executive Directors [6] - Determination of Director Roles [6] - Insurance for Directors, Senior Management, and Prospectus Liability [6] Voting Results - Resolutions 1 and 3 were special resolutions requiring two-thirds majority, while the remaining resolutions were ordinary resolutions requiring a simple majority [7] - Separate counting was conducted for small investors on resolution 5 [7] Legal Verification - The meeting was witnessed by Beijing Yingke (Chengdu) Law Firm, with lawyers confirming the legality of the meeting's procedures and results [7]

2、保荐人已与公司签订保荐协议，该协议已明确了双方在持续督导期间的 权利义务，并报上海证券交易所备案。 3、本持续督导期间，保荐人通过与公司的日常沟通、不定期回访等方式开 展持续督导工作。 中信证券股份有限公司 关于中微半导体（深圳）股份有限公司 2025 半年度持续督导跟踪报告 中信证券股份有限公司（以下简称"中信证券"或"保荐人"）作为中微半 导体（深圳）股份有限公司（以下简称"中微半导"或"公司"或"上市公司"） 首次公开发行股票并在科创板上市的保荐人，根据《证券发行上市保荐业务管理 办法》、《上海证券交易所科创板股票上市规则》等相关规定，中信证券履行持 续督导职责，并出具本持续督导半年度跟踪报告。 一、持续督导工作概述 1、保荐人制定了持续督导工作制度，制定了相应的工作计划，明确了现场 检查的工作要求。 4、本持续督导期间，保荐人根据相关法规和规范性文件的要求履行持续督 导职责，具体内容包括： （1）查阅公司章程、股东会、董事会议事规则等公司治理制度、股东会、 董事会会议材料； （2）查阅公司募集资金管理相关制度、募集资金使用信息披露文件和决策 程序文件、募集资金专户银行对账单、募集资金使用明细账，现 ...

| [205] 盈成 芸字第79月 | 北京盈科(成都)律师事务所 关于中微半导体（深圳）股份有限公司 2025年第二次临时股东会的 法律意见书 r ( 下载 >北京盈科(成都)律师事务所 V Beijing yingke law firm chengdu office 四川省成都市高新区交子大道 177 号中海国际中心 B 座 20-22 层 二〇二五年九月 C ARE MIT THE STERE LAW FIRM 法律意见书 北京盈科（成都）律师事务所 关于中微半导体(深圳)股份有限公司 2025年度第二次临时股东会的法律意见书 致:中微半导体(深圳)股份有限公司 北京盈科(成都)律师事务所（以下简称"本所"）是具有中华人民共和国法律 执业资格的律师事务所。本所接受中微半导体(深圳)股份有限公司(以下简称 "公司")的委托,就公司召开 2025 年第二次临时股东会(以下简称"本次股东会") 的有关事宜,根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中 华人民共和国证券法》(以下简称"《证券法》"）、《上市公司股东会规则》（以 下简称"《股东会规则》")等法律、法规、规章及其他规范性文件(以下简 ...