| 项目 | 人数(人) | 出此 | | --- | --- | --- | | 研发人员 | 1 ୧୦ | 57.97% | | 管理人员 | 53 | 19.20% | | 销售人员 | 60 | 21.74% | 瑞财经 王敏 6月30日，南京沁恒微电子股份有限公司（以下简称"沁恒微"）科创板IPO获受理，保荐机构为华泰联合证券， 保荐代表人为范杰、张晨曦，会计师事务所为立信。 招股书显示，沁恒微专注于连接技术和微处理器（简称"处理器"或"内核"）研究，是一家基于自研专业接口IP、内核IP构建 一体化芯片的集成电路设计企业。 | 序号 | 募集资金投资项目 | 项目投资总额 | 拟用募集资金投入 金额 | | --- | --- | --- | --- | | | USB 芯片研发及产业化项目 | 26,274.62 | 26,274.62 | | 2 | 网络芯片研发及产业化项目 | 30,210.38 | 30,210.38 | | 3 | 全栈 MCU 芯片研发及产业化项目 | 36,668.92 | 36,668.92 | | | 合计 | 93,153.92 | 93.153.92 | 本次 ...

瑞财经 王敏 6月30日，南京沁恒微电子股份有限公司（以下简称"沁恒微"）科创板IPO获受理，保荐机构为华泰联合证券， 保荐代表人为范杰、张晨曦，会计师事务所为立信。 招股书显示，沁恒微专注于连接技术和微处理器（简称"处理器"或"内核"）研究，是一家基于自研专业接口IP、内核IP构建 一体化芯片的集成电路设计企业。 报告期内，所有新研发的芯片均无需从第三方购买处理器或关键接口技术授权。经过多年研发与迭代，发行人按照RISC-V 开放指令集规范自主设计的第五代精简指令集处理器"青稞"系列累计出货超亿颗。 | | | | T L: /// | | --- | --- | --- | --- | | 序号 | 募集资金投资项目 | 项目投资总额 | 拟用募集资金投入 | | | | | 金额 | | | USB 芯片研发及产业化项目 | 26,274.62 | 26,274.62 | | 2 | 网络芯片研发及产业化项目 | 30,210.38 | 30,210.38 | | 3 | 全栈 MCU 芯片研发及产业化项目 | 36,668.92 | 36,668.92 | | | 合计 | 93,153.92 | 9 ...

Core Viewpoint - Nanjing Qingqin Heng Microelectronics Co., Ltd. (referred to as "Qingheng Micro") has released its prospectus for an initial public offering on the Sci-Tech Innovation Board, highlighting its unique approach to integrated circuit design through self-developed IP systems and a focus on core technology research [1][2]. Financial Performance - Qingheng Micro's revenue is projected to grow from 238.26 million yuan in 2022 to 396.80 million yuan in 2024, with net profit increasing from 59.10 million yuan to 103.99 million yuan during the same period [1]. - The company has maintained profitability while many in the industry face losses due to intense competition [1]. Product Overview - The main business of Qingheng Micro includes the research, design, and sales of interface chips and interconnected MCU chips, which are essential for information exchange and connectivity in electronic devices [3][4]. - The company focuses on USB, Bluetooth, and Ethernet interfaces, with USB being its primary revenue source, accounting for 52.38% of total revenue in 2024 [8]. Technology and Innovation - Qingheng Micro has developed a proprietary IP system that includes processor, PHY, controller, and protocol stack technologies, allowing for a more integrated and efficient chip design process [4][17]. - The company’s self-developed "Qingke" series of processors has shipped over 100 million units, demonstrating competitive performance against mainstream foreign processors [6][12]. Market Applications - The primary application areas for Qingheng Micro's products include industrial control and connectivity (52.60% of revenue), IoT networking (25.54%), and computer and mobile peripherals (21.86%) [15]. - The company’s products are designed to meet the growing demand for connectivity and digitalization in various sectors [9][20]. Future Plans and Funding - Qingheng Micro plans to raise funds through its IPO to invest in three key projects: USB chip development, network chip development (including Bluetooth and Ethernet), and full-stack MCU chip development, with a total investment of approximately 931.54 million yuan [28][29]. - The company aims to enhance its core technology and expand its product offerings in high-speed USB, Ethernet, and low-power wireless communication technologies [29][30].

在技术驱动经济发展的新时代，"硬科技"已成为国家竞争力的战略支点与高质量发展的关键引擎。 尤其在中美科技博弈持续加剧、全球供应链深度重塑的背景下，以芯片、人工智能、大数据、云计算 等为代表的新一代信息技术"硬科技"产业，正成为中国高质量发展的关键。 为系统识别中国资本市场中最具成长韧性与技术含量的"硬科技"企业，和讯财经研究院联合至顶智 库推出《2025中国硬科技上市公司价值榜》。榜单聚焦中国A股与港股信息技术板块，通过系统评 估企业在成长潜力、技术创新力、投资价值与ESG表现等多个维度的综合实力，构建"中国硬科技力 量版图"，以增强市场对中国核心科技资产的识别力。 本期发布的为主榜单下的首个子榜单——增长潜力榜。榜单从A股与港股1326家信息技术上市公司 中遴选出前30高成长代表，涵盖半导体、人工智能、信息安全、IT 硬件等关键技术领域，集中呈现 出中国"硬科技"企业在自主可控、系统性国产替代与全球化扩张等方向上冲劲最强、动能最足的新 兴力量。 这些企业不仅在业绩扩张上表现出强劲爆发力，更在研发投入上展现极大决心，代表着中国硬科技赛 道中的"未来新势力"与"产业新坐标"。 发现中国新力量 2025 中国硬科 ...

华宇电子主要从事集成电路封装和测试业务，主营业务包括集成电路封装测试、晶圆测试、芯片成品测 试。公司总部设立于池州，在深圳、无锡、合肥设有子公司，有助于与全球客户保持紧密的合作关系并 提供更高效的产业链支持。 目前，华宇电子封装测试业务主要有SOP、QFN/DFN、SOT、TO、LQFP、LGA、FCLGA、BGA、 FCBGA等多个系列，共计超过130个品种。自成立以来，公司始终专注于集成电路封装测试领域，坚持 以技术创新为核心，已掌握多芯片组件（MCM）封装、三维（3D）叠芯封装、微型化扁平无引脚 （QFN/DFN）封装、高密度微间距集成电路封装、Flip Chip封装等核心技术，在集成电路封装测试领 域具有较强的竞争实力。报告期内，公司封装测试业务以封装+测试为主，部分情况下公司仅为客户提 供封装服务，测试服务由客户自行完成或 客户委托给其他专业测试厂商。 公司在测试领域形成了多项自主核心技术，测试晶圆的尺寸覆盖12吋、8吋、6吋、5吋、4吋等多种尺 寸，包含22nm、28nm及以上晶圆制程；芯片成品测试方面，公司已累计研发出MCU芯片、ADC芯片、 FPGA芯片、GPU芯片、视频芯片、射频芯片、SoC ...

6月30日，上交所正式受理了南京沁恒微电子股份有限公司（简称：沁恒微）科创板IPO申请。 沁恒微专注于连接技术和微处理器研究，是 一家基于自研专业接口IP、内核IP构建一体化芯片的集成 电路设计企业。报告期内，公司主营业务为接口芯片和互连型MCU芯片的研发、设计与销售。 此次IPO，沁恒微拟募资9.32亿元，投建于USB芯片研发及产业化项目、网络芯片研发及产业化项目、 全栈MCU芯片研发及产业化项目。 公司主要产品包括接口芯片和互连型MCU芯片，其中接口芯片是电子设备信息交换、互连互通的窗 口；互连型MCU将处理器技术与连接技术深度融合，是自带信息交换窗口的数据处理中心。上述产品 侧重于连接、联网和控制，主要应用于工业控制与连接、物联组网和互联、计算机及手机周边等领域。 沁恒微表示，上述项目与公司主营业务有着密切关联，未来上市后，公司将继续深耕主业，在连接技术 和微处理器内核上加大研发投入与创新力度，推出更具市场竞争力的接口芯片和互连型MCU芯片产 品。具体而言，上述项目将以公司现有技术积累为基础，开展超高速 USB4、USB 3.x、高速率以太网 和低功耗高性能无线通信等连接技术IP，以及高性能、扩充AI运 ...

| | 中国独角兽所在城市 | | | --- | --- | --- | | | 城市 | 独角兽数量 | | 1- | 北京 | 75 (-3) | | 2- | T 漫 | 64 (-1) | | 3- | 深圳 | 37 (+3) | | 4- | 广州 | 24 (0) | | 21 | 杭州 | 22 (-2) | | 6- | ガ州 | 12 (0) | | 71 | 成都 | 9 (0) | | 7- | 南京 | 9 (-1) | | 71 | 武汉 | 9 (+1) | | 10- | 合肥 | 8 (+2) | | 11 | 블롭 | 6 (0) | | 12 | 音港 | 5 (0) | | 13 | 常州 | 4 (0) | | 13 | 东莞 | 4 (0) | | 13 | 天津 | 4 (0) | | 13 | 长沙 | 4 (-1) | | 17 | 宁波 | 3 (+1) | | 17 | 重庆 | 3 (+2) | | 19 | 济南 | 2 (0) | | 19 | 厦门 | 2 (+1) | | 19 | 石家庄 | 2 (0) | | 19 | 徐州 | 2 (+1 ...

Domestic News - China and Hungary signed a cooperation document to enhance collaboration in the automotive industry, focusing on autonomous driving technology and charging infrastructure [2] - Beijing will allocate 10,000 oil vehicle quotas for the car license plate lottery on June 26, with a total of 2,563,334 valid applications for family cars and 2,568,088 for personal cars [3] - Guangzhou implemented a policy allowing applicants who have not won the lottery for a long time to directly receive license plates, aiming to ease car purchase restrictions [4] - From June 1 to June 22, the national retail sales of passenger cars reached 1.269 million units, a year-on-year increase of 24%, with new energy vehicles accounting for 690,000 units sold [5] International News - In May, European car sales reached 1.11 million units, showing a year-on-year growth of 1.9%, while Tesla's new car registrations in the EU fell by 40.5% [6] Corporate News - Bosch plans to invest over €2.5 billion in artificial intelligence by the end of 2027 [9] - Nissan expects an operating loss of ¥200 billion (approximately RMB 9.9 billion) for Q2 2025, following a significant restructuring plan [10] - GAC Group applied for a patent to improve vehicle communication stability with parking lots [11] - Seres Automotive completed a strategic capital increase of RMB 5 billion, bringing in strategic investors without affecting its status as a subsidiary [12] - XPeng Motors aims for half of its sales to come from overseas markets by 2027, planning to enter over 60 countries [13] - Tesla's first grid-side energy storage project in mainland China is expected to be operational this year, with a storage capacity of 300 MWh [14] - Four-dimensional Map's SoC chip shipments have reached 90 million units, with MCU chip shipments exceeding 70 million units [15]

Group 1: Company Insights - Shenzhen Lingfeng Asset recently conducted research on the listed company Siwei Tuxin, highlighting the trend of intelligent driving equality becoming a key industry focus [1] - The company noted that mid-to-high-level assisted driving functions are gradually being integrated into lower-end models, establishing intelligent driving as a leading business segment [1] - Siwei Tuxin's data compliance business shows a clear growth trend, with AI-enhanced data loops aiding automakers in rapid algorithm iteration and optimization [1] Group 2: Product Development and Market Trends - The world model is being utilized for behavior prediction and trajectory generation, with productization aimed at OEMs and Tier 1 suppliers [1] - The company emphasized the need for intelligent driving orders to achieve certain sales volumes to realize economies of scale, alongside internal cost control and operational efficiency improvements positively impacting profitability [1] - The implementation of new national standards for two-wheeled vehicles is expected to create new market demands for Jiefa Technology's SoC cockpit products, aligning with leading automakers' overseas expansion needs [1] Group 3: Financial Projections and Growth - Jiefa Technology anticipates a revenue growth of over 12% in 2024, with an additional 3 million sets of basic driving point products and 600,000 sets of cockpit products expected to be secured by Q1 2025 [1] - The company is confident in achieving significant loss reduction by 2025, supported by the successful launch of its fifth-generation SoC product, the AC8025AE [1] - Jiefa Technology's automotive-grade MCU chip AC7870 has been successfully launched, meeting ISO 26262 ASIL-D functional safety standards, applicable across various scenarios [1]

芯驰科技国际汽车业务总经理Eugene Wang表示，这些芯片将用于该汽车制造商在欧洲，中东和非洲地 区生产和销售的几款车型，包括轿车和SUV。他补充说，这些车辆预计将采用其X9系列智能座舱处理 器，该SoC集成了高性能CPU、GPU、人工智能（AI）加速器和专为先进驾驶舱应用而设计的视频处理 器。 【文/观察者网 熊超然】为推动全球销售，中国汽车芯片公司芯驰科技（SemiDrive）将于明年年底开始 向一家未透露名称的欧洲汽车制造商供应其智能座舱系统级芯片（SoC），这是该公司首次在欧洲大陆 开展合作。6月17日，香港《南华早报》援引该公司一名高管的消息作出报道。 "这将是我们第一次为外国原始设备制造商（OEM）在海外大规模生产的汽车提供芯片，"Eugene Wang 在为期四天于香港举办的2025国际汽车及供应链博览会间隙说："为了成为全球顶级芯片供应商，我们 需要从中国市场扩展到全球市场。" 根据欧洲汽车制造商协会的数据，去年全球汽车制造商共售出7460万辆汽车，其中中国占据了逾30%的 市场份额。然而，中国乘用车智能座舱SoC市场仍由美国科技巨头高通主导。 总部位于深圳的研究机构高工产业研究院（GGI ...