股票代码：688521 股票简称：芯原股份 芯原微电子（上海）股份有限公司 VeriSilicon Microelectronics (Shanghai) Co., Ltd. （中国（上海）自由贸易试验区春晓路 289 号张江大厦 20A） 2023 年度向特定对象发行 A 股股票 上市公告书 1、发行数量：24,860,441 股 2、发行价格：72.68 元/股 保荐人（主承销商） 中国（上海）自由贸易试验区商城路 618 号 联席主承销商 广东省深圳市福田区中心三路 8 号卓越时代广场（二期）北座 二〇二五年七月 特别提示 一、发行数量及价格 3、募集资金总额：人民币 1,806,856,851.88 元 4、募集资金净额：人民币 1,780,262,125.56 元 二、本次发行股票预计上市时间 本次发行新增股份在其限售期满的次一交易日在上海证券交易所上市交 易（预计上市时间如遇法定节假日或休息日，则顺延至其后的第一个交易 日）。 三、新增股份的限售安排 本次发行对象共有 11 名，均以现金方式参与认购，全部发行对象认购的 股票自发行结束之日起六个月内不得转让。法律法规、规范性文件对限售期 另有规定的 ...

国泰海通证券股份有限公司 关于芯原微电子（上海）股份有限公司 2023 年度向特定对象发行 A 股股票 之 上市保荐书 保荐机构（主承销商） 二〇二五年七月 声 明 本保荐机构及其保荐代表人已根据《中华人民共和国公司法》（以下简称《公 司法》）、《中华人民共和国证券法》等法律法规和中国证券监督管理委员会（以 下简称"中国证监会"）及上海证券交易所的有关规定，诚实守信，勤勉尽责， 严格按照依法制定的业务规则和行业自律规范出具上市保荐书，并保证所出具文 件真实、准确、完整。 如无特殊说明，本上市保荐书中的简称或名词释义与《芯原微电子（上海） 股份有限公司向特定对象发行 A 股股票之募集说明书》一致。 3-2-1 | 声 明 1 | | --- | | 目 录 2 | | 一、发行人基本情况 3 | | 二、发行人本次发行情况 14 | | 三、本次证券发行上市的项目保荐代表人、协办人及项目组其他成员情况 17 | | 四、保荐机构是否存在可能影响公正履行保荐职责情形的说明 18 | | 五、保荐机构承诺事项 19 | | 六、本次证券发行上市履行的决策程序 20 | | 七、保荐机构关于符合国家产业政策和板块定位 ...

证券代码：688521 证券简称：芯原股份 公告编号：2025-025 芯原微电子（上海）股份有限公司 关于 2023 年向特定对象发行股票发行结果暨股本变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 预计上市时间：芯原微电子股份有限公司（以下简称"公司"、"芯原股 份"或"发行人"）本次向特定对象发行 A 股股票（以下简称"本次发行"）对应 的 24,860,441 股已于 2025 年 6 月 30 日在中国证券登记结算有限责任公司上海分 公司办理完毕股份登记手续。 新增股份的限售安排：本次发行新增股份为有限售条件流通股，本次发 行新增股份在其限售期届满的次一交易日起在上海证券交易所科创板上市交易 （预计上市时间如遇法定节假日或休息日，则顺延至其后的第一个交易日）。本 次向特定对象发行的股份自发行结束之日起六个月内不得上市交易。法律法规、 规范性文件对限售期另有规定的，依其规定。 资产过户情况：本次发行的股票全部以现金认购，不涉及资产过户情况。 本次发行对公司股本结构的影响：本次发行前，公司无 ...

Group 1 - Hengbang Co., Ltd. plans to establish a joint venture with Huasheng Development with a registered capital of 10 million yuan, where Hengbang will contribute 8 million yuan (80%) and Huasheng will contribute 2 million yuan (20%) [1] - Hunan Gold's subsidiary Anhua Zhazi Creek Smelting Plant will undergo temporary maintenance starting from the end of June 2025, expected to last no more than 30 days [2] - Defu Technology's subsidiary signed supply agreements for lithium battery copper foil products with two leading global companies, with contract durations of 3 years and 5 years respectively [3] Group 2 - Binjiang Group won the rights to two residential land parcels for a total price of 4.368 billion yuan [5] - Zhong'an Technology announced the resignation of its executive vice president and board secretary due to personal reasons [7] - Changqing Technology's project for special polymer materials and electronic materials has officially commenced production, adding a capacity of 120,500 tons per year [10] Group 3 - Gansu Energy received approval from the China Securities Regulatory Commission to publicly issue bonds totaling up to 2 billion yuan [10] - Shuoshi Biology obtained a medical device registration certificate for an in vitro diagnostic reagent, valid until June 2030 [12] - Yawen Co., Ltd. plans to issue shares to specific investors, with the application accepted by the Shenzhen Stock Exchange [13] Group 4 - Guoyao Modern's subsidiary received approval for the listing of a raw material drug, which is a selective anticholinergic agent [16] - Inner Mongolia First Machinery's subsidiary signed a railway freight car procurement contract worth 130 million yuan [18] - Xining Special Steel plans to raise up to 1 billion yuan through a private placement to its controlling shareholder [39] Group 5 - Huadong Medicine's subsidiary received approval for a clinical trial of a new injectable drug targeting advanced solid tumors [29] - Warner Pharmaceutical's compound potassium hydrogen phosphate injection passed the consistency evaluation for generic drugs [30] - North Special Technology plans to raise up to 300 million yuan through a private placement for a production base project in Thailand [30] Group 6 - Xiangyang Technology is the first candidate for a 533 million yuan Airbus project [45] - Haishun New Materials intends to acquire 100% of Guangdong Zhengyi Packaging [46] - Jida Zhengyuan's shareholder plans to reduce their stake by up to 0.73% due to personal financial needs [47]

Group 1 - The core viewpoint highlights the significant growth and investment interest in the Artificial Intelligence ETF, which has seen a recent increase in trading volume and net inflows [3][7] - As of June 26, the Artificial Intelligence ETF has a total scale of 3.565 billion yuan, with an average daily trading volume of 151 million yuan over the past week [3] - The ETF has experienced a net value increase of 30.13% over the past year, with the highest monthly return reaching 30.38% since its inception [3] Group 2 - The CSI Artificial Intelligence Industry Index, which the ETF closely tracks, comprises 50 representative listed companies selected based on their AI business proportion, growth level, and market capitalization [3] - The top ten weighted stocks in the index account for 49.9% of the total weight, with notable companies including Zhongke Shuguang and Han's Laser [4] - Recent developments in domestic chip technology, such as Huawei Cloud's launch of a large AI computing platform, further enhance the competitiveness of domestic AI technologies [7]

Group 1 - The A-share semiconductor sector is experiencing a significant upward trend, with notable gains in several companies [1] - Longxin Zhongke and Xinhenghui both saw their stock prices increase by over 10%, while Chipone Technology rose by more than 9% [1] - Huada Technology and Guoke Micro also followed the upward trend, indicating a broader positive movement in the semiconductor industry [1]

Fundraising Overview - The company, Chiplet Microelectronics (Shanghai) Co., Ltd., has received approval from the China Securities Regulatory Commission to issue shares to specific investors, raising a total of RMB 1,806,856,851.88 [1][2] Special Account and Supervision Agreement - The company has established a special account for the raised funds, which will only be used for the designated projects and not for any other purposes [2][3] - A tripartite supervision agreement has been signed between the company, the sponsoring institution (Guotai Junan Securities Co., Ltd.), and the banks holding the funds to ensure proper management and usage of the raised capital [2][3] Specific Projects and Fund Allocation - The funds will be allocated to research and development projects in the fields of AIGC (Artificial Intelligence Generated Content) and smart mobility, specifically for the Chiplet solution platform [3][4] - The agreement stipulates that the funds must be used solely for the specified projects, ensuring investor protection and compliance with relevant regulations [4][5] Monitoring and Reporting - The sponsoring institution is responsible for ongoing supervision of the fund usage, conducting at least biannual on-site inspections to verify compliance with the agreement [6][7] - The company is required to notify the sponsoring institution of any significant expenditures from the special account and provide detailed expenditure reports [8][9]

Core Viewpoint - The legal opinion letter issued by Fangda Partners confirms the compliance of the issuance process and subscription objects for Chipone Technology (Shanghai) Co., Ltd.'s A-share issuance, ensuring adherence to relevant Chinese laws and regulations [1][2][3]. Group 1: Issuance Approval and Authorization - The issuance has been approved by the board of directors and the shareholders' meeting, with resolutions passed regarding the conditions for issuing A-shares to specific targets and the feasibility of using the raised funds for technological innovation [5][6][7]. - The approval from the Shanghai Stock Exchange and the China Securities Regulatory Commission (CSRC) has been obtained, confirming that the issuance meets the necessary conditions and requirements [7][8]. Group 2: Issuance Process and Results - The issuance plan was submitted to the Shanghai Stock Exchange, and a total of 600 potential subscription targets were identified, including major shareholders, investment funds, securities companies, insurance institutions, and qualified foreign institutional investors [8][9]. - The final issuance price was set at 72.68 RMB per share, with a total of 24,860,441 shares issued, raising a total of 1,806,856,851.88 RMB [12][14][15]. Group 3: Subscription Objects - The final subscription objects included 11 entities, all of which met the qualifications for participation in the issuance, and the total number of subscription objects did not exceed the limit of 35 as stipulated by regulations [16][20]. - The subscription process adhered to the principles of prioritizing subscription price, subscription amount, and the order of receipt of subscription documents [13][20].

股票代码：688521 股票简称：芯原股份 芯原微电子（上海）股份有限公司 VeriSilicon Microelectronics (Shanghai) Co., Ltd. （中国（上海）自由贸易试验区春晓路 289 号张江大厦 20A） 况报告书 保荐人（主承销商） 中国（上海）自由贸易试验区商城路 618 号 联席主承销商 广东省深圳市福田区中心三路 8 号卓越时代广场（二期）北座 二〇二五年六月 发行人全体董事、监事、高级管理人员声明 本公司全体董事、监事及高级管理人员承诺本发行情况报告书不存在虚假 记载、误导性陈述或重大遗漏，并对其真实性、准确性、完整性承担相应的法 律责任。 全体董事签字： __________________ __________________ __________________ Wayne Wei-Ming Dai Wei-Jin Dai 施文茜 （戴伟民） （戴伟进） __________________ __________________ __________________ 孙国栋 陈晓飞 陈 洪 __________________ _______________ ...

股票代码：688521 股票简称：芯原股份 芯原微电子（上海）股份有限公司 VeriSilicon Microelectronics (Shanghai) Co., Ltd. （中国（上海）自由贸易试验区春晓路 289 号张江大厦 20A） 二〇二五年六月 2023 年度向特定对象发行 A 股股票发行情 况报告书 保荐人（主承销商） 中国（上海）自由贸易试验区商城路 618 号 联席主承销商 广东省深圳市福田区中心三路 8 号卓越时代广场（二期）北座 发行人全体董事、监事、高级管理人员声明 本公司全体董事、监事及高级管理人员承诺本发行情况报告书不存在虚假 记载、误导性陈述或重大遗漏，并对其真实性、准确性、完整性承担相应的法 律责任。 全体董事签字： __________________ __________________ __________________ Wayne Wei-Ming Dai （戴伟民） Wei-Jin Dai （戴伟进） 施文茜 __________________ __________________ __________________ 孙国栋 陈晓飞 陈 洪 __________ ...