证券代码：688521 证券简称：芯原股份 公告编号：2025-062 逐点半导体（上海）股份有限公司控制权的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 关于联合投资人共同对外投资暨收购 重要内容提示： 芯原微电子（上海）股份有限公司（以下简称"公司"）拟联合共同投 资人对特殊目的公司天遂芯愿科技（上海）有限公司（以下简称"天遂芯愿"） 进行投资（以下简称"本次投资"），并以天遂芯愿为收购主体收购逐点半导体 （上海）股份有限公司（以下简称"标的公司"）的控制权（以下简称"本次收 购"，与本次投资合称"本次交易"）。标的公司 100%股份对应的股权价值为 9.5 亿元（指人民币元，下同）。为保障本次收购的顺利实施，天遂芯愿预计将 以不超过 9.5 亿元现金作为交易对价加上交易费用等相关费用收购标的公司的控 制权。2025 年 10 月 15 日，天遂芯愿与标的公司股东、标的公司等相关方签署 《股份购买协议》，约定以 9.3 亿元现金加上交易费用等相关费用收购标的公司 97.89%股份。本次交易完成后，天遂芯愿将持有标的 ...

证券代码：688521 证券简称：芯原股份 公告编号：2025-061 芯原微电子（上海）股份有限公司 第三届董事会第四次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 芯原微电子（上海）股份有限公司（以下简称"公司"）第三届董事会第四次 会议通知已于 2025 年 10 月 1 日发出，会议于 2025 年 10 月 15 日在公司会议室 以现场结合通讯方式召开。本次董事会应出席会议的董事 11 人，实际出席董事 11 人。本次会议由董事长 Wayne Wei-Ming Dai（戴伟民）先生主持。本次会议 召开符合《中华人民共和国公司法》等有关法律、法规和《芯原微电子（上海） 股份有限公司章程》（以下简称"《公司章程》"）的规定，表决形成的决议合法、 有效。 二、董事会会议审议情况 经过与会董事认真审议，形成如下决议： 1、审议通过《关于联合投资人收购逐点半导体（上海）股份有限公司股份的 议案》 董事会同意公司、共同投资人分别按照 40%和 60%的出资比例对特殊目的 公司（以下简称 ...

芯原微电子（上海）股份有限公司 董事会薪酬与考核委员会关于公司《2025 年限制性股票激励 计划（草案）》及其摘要的核查意见 芯原微电子（上海）股份有限公司（以下简称"公司"）董事会薪酬与考核委 员会依据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民共和 国证券法》（以下简称"《证券法》"）、《上市公司股权激励管理办法》（以下简称 "《管理办法》"）、《上海证券交易所科创板股票上市规则》（以下简称"《上市规 则》"）、《科创板上市公司自律监管指南第 4 号—股权激励信息披露》等相关法 律、法规及规范性文件和《芯原微电子（上海）股份有限公司章程》的有关规定， 对公司《2025 年限制性股票激励计划（草案）》及其摘要进行了核查，发表核查 意见如下： 1、公司不存在《管理办法》等法律、法规规定的禁止实施限制性股票激励 计划的情形，包括： （1）最近一个会计年度财务会计报告被注册会计师出具否定意见或者无法 表示意见的审计报告； （2）最近一个会计年度财务报告内部控制被注册会计师出具否定意见或无 法表示意见的审计报告； （3）最近 12 个月内因重大违法违规行为被中国证监会及其派出机构行政处 罚或者采取 ...

标的公司在显示芯片领域拥有20年以上的研发经验，积累了丰富的核心技术储备，并在产品的持续创新 与迭代升级过程中，持续巩固核心技术的先进性。标的公司核心技术的先进性集中体现在显示芯片的电 路设计能力、图像画质算法处理能力及转码方面，目前均处于行业领先水平。标的公司拥有丰富的核心 专利和技术积累，具备动态补偿、色彩校准、HDR映射、TAA抗锯齿等多项图像处理核心技术，部分 技术在DXOMark等评测中表现优异，体现出其在图像质量优化方面的技术领先性。标的公司还构建了 完整的图像处理算法链路，支持多种终端平台和操作系统，具备高度可移植性和定制化能力。 公告显示，标的公司已成功进入全球主流手机品牌供应链并已建立稳定合作关系，公司的AI-ISP芯片定 制方案已在知名企业的智能手机中量产出货。标的公司与公司的客户群体基础高度重合;双方IP和技术 形成互补：公司在图像前处理领域技术领先，标的公司主要擅长图像后处理，其图像后处理IP主要包含 插帧(将GPU渲染的低帧率图像如30帧/秒提升为120/144帧/秒)、超级分辨率(将GPU渲染的低分辨率图像 如720p提升为1440p)和图像增强(将GPU渲染的SDR内容提升为HD ...

芯原股份公告，公司拟联合共同投资人对特殊目的公司天遂芯愿科技（上海）有限公司进行投资，并以 天遂芯愿为收购主体收购逐点半导体（上海）股份有限公司的控制权。标的公司100%股份对应的股权 价值为9.5亿元。天遂芯愿预计将以不超过9.5亿元现金作为交易对价加上交易费用等相关费用收购标的 公司的控制权。2025年10月15日，天遂芯愿与标的公司股东、标的公司等相关方签署《股份购买协 议》，约定以9.3亿元现金加上交易费用等相关费用收购标的公司97.89%股份。本次交易完成后，天遂 芯愿将持有标的公司100%的股份，标的公司将纳入公司合并报表范围。 ...

Core Viewpoint - The stock of Chip Origin Co., Ltd. has shown significant volatility, with a year-to-date increase of 227.43%, but a recent decline of 6.19% over the past five trading days, indicating potential market fluctuations and investor sentiment shifts [1][2]. Company Overview - Chip Origin Co., Ltd. was established on August 21, 2001, and went public on August 18, 2020. The company specializes in providing platform-based, comprehensive, and one-stop chip customization services and semiconductor IP licensing services [2]. - The revenue composition of Chip Origin includes: 41.85% from chip volume business, 28.81% from intellectual property licensing fees, 23.83% from chip design services, 5.21% from royalties, and 0.29% from other sources [2]. Financial Performance - For the first half of 2025, Chip Origin reported a revenue of 974 million yuan, representing a year-on-year growth of 4.49%. However, the net profit attributable to shareholders was a loss of 320 million yuan, a decrease of 12.30% compared to the previous year [2]. Stock Market Activity - As of October 15, 2023, Chip Origin's stock price was 171.67 yuan per share, with a market capitalization of 90.249 billion yuan. The stock experienced a trading volume of 1.685 billion yuan and a turnover rate of 2.00% [1]. - The stock has appeared on the "Dragon and Tiger List" six times this year, with the most recent appearance on September 22, where it recorded a net buying of 523 million yuan [1]. Shareholder Information - As of June 30, 2025, the number of shareholders for Chip Origin was 25,400, a decrease of 3.58% from the previous period. The average number of circulating shares per shareholder increased by 3.71% to 19,656 shares [2][3]. - Major institutional shareholders include 华夏上证科创板50成份ETF and 易方达上证科创板50ETF, both of which have reduced their holdings compared to the previous period [3].

Group 1 - The Shanghai Stock Exchange Sci-Tech Innovation Board Chip Index experienced a slight decline of 0.01% as of October 15, 2025, with mixed performance among constituent stocks [1] - Dongxin Co., Ltd. led the gains with an increase of 7.44%, followed by Chengdu Huami with a rise of 6.68%, and Haiguang Information up by 4.72% [1] - The top ten weighted stocks in the index accounted for 59.69% of the total, with Haiguang Information, Lanke Technology, and SMIC being the most significant contributors [4] Group 2 - The Sci-Tech Chip ETF (588200) saw a trading volume turnover of 5.89% and a transaction value of 2.416 billion yuan, indicating active trading [4] - Over the past month, the ETF's scale increased by 8.994 billion yuan, marking a significant growth and ranking first among comparable funds [4] - The ETF achieved a net inflow of 7.09 billion yuan over the last ten days, with a peak single-day inflow of 2.748 billion yuan [4] Group 3 - Oracle and AMD announced an expansion of their partnership, with Oracle Cloud Infrastructure set to deploy 50,000 AMD GPUs starting in Q3 2026 [5] - Research teams from Peking University developed a high-precision, scalable analog matrix computing chip based on resistive memory, achieving performance comparable to digital processors [5] - Analysts from Guangfa Securities and Galaxy Securities expressed optimism about the AI industry chain and the necessity for domestic chip production, highlighting continued investment in computing power [5]

Group 1 - The collaboration between OpenAI and Broadcom aims to develop a custom AI chip and network system architecture with a scale of 10 gigawatts, set to begin deployment in the second half of 2026 and complete by the end of 2029 [4] - The domestic AI chip market is showing significant strength and potential, with notable achievements in performance and commercialization [4] Group 2 - Huawei's Ascend chip roadmap includes the launch of the 950PR and 950DT chips in 2026, followed by the 960 in 2027 and the 970 in 2028, with significant upgrades in specifications aimed at competing with Nvidia's Blackwell [5] - Baidu's Kunlun chip has secured a high market share in AI inference device procurement for China Mobile, demonstrating strong performance in various sectors [5] - Alibaba's T-head PPU chip has surpassed Nvidia's A800 in memory and bandwidth, winning a major contract with China Unicom [5] Group 3 - Guoxin Technology has been surveyed 23 times this year, focusing on its AI chip business, including AIMCU and AI cloud security chips based on RISC-V CPU technology [6] - Chipone has been surveyed 19 times, offering a range of custom chip solutions for AI applications across various devices, with nearly 200 million AI chips shipped globally [6] - Fudan Microelectronics has been surveyed 16 times, developing a product line of chips with computing power ranging from 4 TOPS to 128 TOPS, with a focus on high-reliability markets [6] Group 4 - As of October 14, 13 AI chip concept stocks have seen a more than 13% increase in average daily trading volume compared to the previous month, with Hengshuo Technology leading with a 116.61% increase [7] - Among these stocks, 8 have recorded net financing purchases exceeding 10 million yuan, with Beijing Junzheng leading at 207 million yuan in net purchases [7]

Market Overview - The advanced packaging concept index declined by 3.97%, ranking among the top declines in the concept sector as of October 14 [1] - Major stocks within this sector, such as Wentech Technology and *ST Yuancheng, hit the daily limit down, while stocks like Shanzi Gaoke, Huazheng New Materials, and Yishitong saw increases of 9.98%, 2.48%, and 1.97% respectively [1] Capital Flow - The advanced packaging sector experienced a net outflow of 8.549 billion yuan, with 111 stocks seeing net outflows, and 28 stocks exceeding 100 million yuan in outflows [2] - The stock with the highest net outflow was Tongfu Microelectronics, with a net outflow of 1.192 billion yuan, followed by Changdian Technology and Huagong Technology with net outflows of 755.6 million yuan and 541.9 million yuan respectively [2][3] Top Gainers and Losers - Among the advanced packaging stocks, the top gainers included Shanzi Gaoke with a rise of 9.98%, while the largest losers included Tongfu Microelectronics with a drop of 9.99% [2][3] - Other notable declines included Changdian Technology (-6.47%), Huagong Technology (-4.80%), and Xinyuan Technology (-9.79%) [3][4] Sector Performance - The advanced packaging sector was one of the worst-performing sectors today, alongside AI PC and storage chips, which also saw declines of 3.94% and 3.89% respectively [2] - In contrast, the cultivated diamond sector saw a gain of 3.74%, indicating a divergence in sector performance [2]

Core Viewpoint - The technology sector experienced a widespread pullback on October 14, with the Sci-Tech 50 Index leading the decline, falling over 4% as of the report, particularly affecting the semiconductor industry chain [1] Group 1: Market Performance - The semiconductor industry chain saw a significant drop, with all sub-sectors including wafer foundries, semiconductor equipment, GPUs, and AI chips experiencing substantial declines [1] - SMIC (Semiconductor Manufacturing International Corporation) fell by over 6%, while other major stocks in the Sci-Tech 50 Index, such as Huahai Qingshi, Shengmei Shanghai, Haiguang Information, and Chipone, also saw significant declines [1] - The stock prices of these key Sci-Tech 50 Index constituents have retreated over 15% from their recent highs [1]