Core Viewpoint - The 2025 TrendBank Lithography Industry Conference aims to address the challenges and advancements in lithography technology, materials, and equipment, promoting collaboration among experts and industry representatives to enhance the domestic semiconductor industry's capabilities [36][35][34]. Group 1: Conference Overview - The conference will take place on July 9-10, 2025, at the Sheraton Hotel in Hefei, Anhui [30][5]. - It will feature over 20 speakers from the lithography industry, covering advanced lithography technologies, photoresists, and wet electronic chemicals [27][26]. - The event aims to foster deep interaction between upstream and downstream sectors of the industry, providing a platform for resource integration and collaboration [29][35]. Group 2: Key Topics and Discussions - Discussions will include the latest research and application prospects of extreme ultraviolet lithography (EUV), electron beam lithography, and nanoimprint technologies [26]. - The conference will analyze the current state of domestic photoresist production, technical bottlenecks, and the need for innovation to improve self-sufficiency and quality [34][35]. - Key issues regarding the localization of lithography equipment and the challenges faced in the domestic semiconductor manufacturing process will be highlighted [34][35]. Group 3: Featured Speakers and Sessions - Wei Ran, head of the semiconductor product line at Hefei Chip Microelectronics Equipment Co., will present on the industrialization of laser direct-write lithography equipment [7][1]. - The agenda includes specialized forums on advanced lithography technology and the development trends of photoresists and wet electronic chemicals [14][11]. - A roundtable discussion will feature industry leaders discussing the integration of scientific data-driven innovations in new materials [17][26]. Group 4: Company and Industry Background - Hefei Chip Microelectronics Equipment Co., established in June 2015, specializes in the research and production of direct imaging equipment based on micro-nano direct-write lithography technology [7]. - The company has over 200 intellectual property rights and has received multiple awards, including the "National High-tech Enterprise" designation [7]. - The lithography technology is crucial for semiconductor manufacturing, directly impacting chip performance, integration, and production costs [34].

Core Viewpoint - Chipone Microelectronics (芯碁微装) plans to initiate the process for issuing H-shares and listing on the Hong Kong Stock Exchange to enhance its international strategy and brand recognition [1][2]. Group 1: H-Share Listing Plans - The company's board approved the proposal to start preparations for the H-share issuance and listing on June 27, 2025, with a 12-month authorization period [1]. - The H-share listing aims to strengthen the company's capital strength and overall competitiveness [1]. - Specific details regarding the H-share listing are yet to be finalized, and the company will consult with relevant intermediaries [1]. Group 2: Previous Fundraising Activities - Chipone Microelectronics was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on April 1, 2021, raising a total of 460 million yuan, with a net amount of 416 million yuan after expenses [2][3]. - The company initially planned to raise 473 million yuan, with allocations for various projects including high-end PCB laser imaging equipment and wafer-level packaging [3]. - The total fundraising from the IPO and subsequent private placement amounts to 1.258 billion yuan [5]. Group 3: Recent Capital Increases - As of July 25, 2023, the company issued 10,497,245 shares at a price of 75.99 yuan per share, raising approximately 797.69 million yuan, with a net amount of about 789.36 million yuan after expenses [4].

Core Viewpoint - The lithography machine concept sector has shown a positive performance with a 2.34% increase, ranking 8th among concept sectors, driven by significant gains in several stocks [1][2]. Group 1: Stock Performance - Within the lithography machine sector, 29 stocks experienced gains, with notable performers including: - Kaimeite Gases and Haili Shares both hitting the daily limit up, with increases of 10.00% and 9.99% respectively [1][3]. - Xuguang Electronics rose by 9.97% [3]. - Other significant gainers included Blue Ying Equipment (up 14.60%), Jiuri New Materials (up 5.93%), and Zhongci Electronics (up 4.55%) [1][2]. - Conversely, the sector also saw declines in stocks such as Tengjing Technology (down 3.29%), Electronic Science and Technology Digital (down 1.20%), and Fuchuang Precision (down 1.11%) [1]. Group 2: Capital Flow - The lithography machine sector attracted a net inflow of 825 million yuan from main funds, with 23 stocks receiving net inflows [2]. - Xuguang Electronics led the net inflow with 312 million yuan, followed by Haili Shares (290 million yuan) and Kaimeite Gases (58.84 million yuan) [2][3]. - The net inflow ratios for key stocks were as follows: - *ST and Ke, Xuguang Electronics, and Haili Shares had net inflow ratios of 41.92%, 20.54%, and 18.75% respectively [3].

Core Viewpoint - The stock of Chipbond Technology (688630) shows strong performance indicators with a comprehensive score of 64.27, indicating a robust investment opportunity in the semiconductor sector [1]. Group 1: Stock Performance - The stock has a current main cost of 82.00 yuan, with a 5-day main cost of 79.56 yuan, a 20-day main cost of 76.41 yuan, and a 60-day main cost of 72.94 yuan, suggesting a positive trend in pricing [1]. - Over the past year, the stock has experienced no limit-up days and one limit-down day, indicating relatively stable performance [1]. Group 2: Capital Flow Analysis - On July 1, 2025, the net inflow of main funds was 38.19 million yuan, accounting for 8% of the total transaction volume, which reflects strong buying interest [2]. - The data shows a net inflow of 20.04 million yuan from large orders and 18.16 million yuan from major orders, while retail investors experienced a net outflow of 191,400 yuan [2]. Group 3: Technical Analysis - The short-term resistance level is at 79.45 yuan, while the short-term support level is at 78.10 yuan, indicating potential upward movement if these levels are breached [2]. - The stock has formed a "Bullish Engulfing" pattern, suggesting a possible upward trend from the bottom, with further confirmation needed for sustained growth [2]. Group 4: Industry Context - The stock is associated with several sectors, including specialized equipment (0.52%), photolithography machines (1.59%), semiconductor concepts (0.67%), and PCB (0.76%), highlighting its relevance in the broader technology landscape [2].

长江商报消息 ●长江商报记者 徐佳 作为直写光刻龙头设备厂商，芯碁微装（688630.SH）将借港股市场加速国际化布局。 6月27日晚间，芯碁微装宣布，为加快公司的国际化战略及海外业务布局，打造国际化资本运作平台， 进一步提升公司品牌形象及知名度，提高公司的资本实力和综合竞争力，根据公司总体发展战略及运营 需要，公司拟在境外发行股份（H股）并在香港联合交易所有限公司（以下简称"香港联交所"）上市。 长江商报记者注意到，近两年来，芯碁微装的国际化布局提速。2024年，芯碁微装来自海外市场的收入 为1.88亿元，同比增长212.32%。特别是随着泰国子公司完成设立，带动公司东南亚地区营收占比提升 至近20%。 今年第一季度，芯碁微装实现营业收入2.42亿元，同比增长22.31%；归属于上市公司股东的净利润（净 利润，下同）5186.68万元，同比增长30.45%。 截至6月27日收盘，芯碁微装二级市场股价79.2元/股，年内累计上涨超31%。 A股上市4年拟赴港IPO 6月27日晚间，芯碁微装发布公告称，公司拟在境外发行股份（H股）并在香港联交所上市。公司董事 会同意授权公司管理层启动本次H股上市的前期筹备工作， ...

Core Viewpoint - The recent trend of A-share companies planning to list in Hong Kong continues, with 14 companies disclosing their intentions to issue H-shares and list on the Hong Kong Stock Exchange in June 2023 [1][2]. Group 1: Companies Planning to List - Chipone Microelectronics announced on June 27 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Daikin Heavy Industries disclosed on June 24 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Lattice Semiconductor announced on June 20 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Shanjin International authorized its management on June 19 to initiate preparations for issuing H-shares and listing in Hong Kong [2]. - Wolong Electric Drive announced on June 18 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Lakala disclosed on June 16 its plan to list on the Hong Kong Stock Exchange [2]. - Sandam Membrane announced on June 16 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Kute Intelligent disclosed on June 10 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - EVE Energy announced on June 9 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Chaohongji disclosed on June 9 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - BlueFocus Communication Group announced on June 6 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Stone Technology disclosed on June 6 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Jinjiang Hotels announced on June 4 its plan to issue H-shares and list on the Hong Kong Stock Exchange [2]. - Estun Automation disclosed on June 4 its intention to issue H-shares and list on the Hong Kong Stock Exchange [2].

Core Viewpoint - The company plans to issue H-shares and list on the Hong Kong Stock Exchange to accelerate its international strategy and enhance its brand image and competitiveness [1] Group 1: Company Actions - The company's board approved the proposal to authorize management to initiate preparations for the overseas issuance of H-shares [1] - The authorization period for the management to start the H-share listing preparations is set for 12 months from the board's approval date [1] - The company intends to discuss specific progress with relevant intermediaries regarding the H-share listing [1] Group 2: Regulatory and Approval Process - The H-share listing plan requires approval from the company's board and shareholders, as well as regulatory approvals from the China Securities Regulatory Commission, Hong Kong Stock Exchange, and the Securities and Futures Commission of Hong Kong [1] - There is significant uncertainty regarding the final implementation of the H-share listing [1]

为加快公司的国际化战略及海外业务布局，打造国际化资本运作 平台，进一步提升公司品牌形象及知名度，提高公司的资本实力和综 合竞争力，根据公司总体发展战略及运营需要，公司拟在境外发行股 份（H 股）并在香港联合交易所有限公司（以下简称"香港联交所"） 上市（以下简称"本次 H 股上市"）。公司董事会同意授权公司管理层 启动本次 H 股上市的前期筹备工作，授权期限为自董事会审议通过之 日起 12 个月内。公司计划与相关中介机构就本次 H 股上市的具体推 进工作进行商讨，关于本次 H 股上市的具体细节尚未最终确定。 根据《中华人民共和国公司法》《中华人民共和国证券法》《上海 1 证券代码：688630 证券简称：芯碁微装 公告编号：2025-023 合肥芯碁微电子装备股份有限公司 关于授权公司管理层启动公司境外发行股份（H 股） 并在香港联合交易所有限公司上市相关筹备工作的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假 记载、误导性陈述或者重大遗漏，并对其内容的真实性、准确性 和完整性依法承担法律责任。 合肥芯碁微电子装备股份有限公司（以下简称"公司"）第二届 董事会第二十次会议于 2025 年 6 月 2 ...

Investment Rating - The report maintains a "Buy" rating for the company, with a market price of RMB 79.15 and a sector rating of "Outperform" [1][3]. Core Views - The company has signed a significant new contract worth RMB 146 million, which is expected to boost its revenue for 2024 by approximately 15% [3][7]. - The AI infrastructure boom is driving investment in PCB, and the company is likely to benefit from the expansion efforts of PCB manufacturers [3][7]. - The report adjusts the company's earnings forecasts for 2025 and 2026, with EPS estimates revised to RMB 2.09 and RMB 2.75 respectively, while projecting an EPS of RMB 3.37 for 2027 [7]. Financial Summary - The company's projected revenue for 2023 is RMB 829 million, increasing to RMB 1,377 million by 2025, reflecting a growth rate of 44.3% [6]. - EBITDA is expected to rise from RMB 155 million in 2023 to RMB 277 million in 2025 [6]. - The net profit attributable to the parent company is forecasted to grow from RMB 179 million in 2023 to RMB 276 million in 2025, with a growth rate of 71.7% [6]. - The company’s P/E ratios for 2025, 2026, and 2027 are projected to be 37.8, 28.8, and 23.5 respectively [7].

Investment Rating - The report maintains an "Outperform" rating for the company [2] Core Views - The company signed seven significant sales contracts totaling RMB 146 million, which is expected to positively impact future operating performance [7] - The demand for AI computing power is driving the need for high-end equipment, leading to full order backlogs and an optimistic business outlook [7] - The company has advanced packaging equipment with technological advantages across multiple products in the semiconductor field [7] - The profit forecasts for 2025-2027 are maintained, with expected net profits of RMB 285 million, RMB 411 million, and RMB 503 million respectively [7] Financial Data and Profit Forecast - Total revenue projections for 2025 are RMB 1,411 million, with a year-on-year growth rate of 47.9% [6] - The net profit for 2025 is projected at RMB 285 million, reflecting a year-on-year increase of 77.4% [6] - The earnings per share for 2025 is estimated at RMB 2.16, with a projected PE ratio of 37 [6] - The gross margin is expected to be 39.9% in 2025, with a return on equity (ROE) of 12.1% [6]