Core Viewpoint - The company has commenced production of its second phase, focusing on high-end PCB exposure equipment and the development of semiconductor products, which is expected to significantly support revenue growth [1] Group 1 - The second phase project is aimed at enhancing the industrialization of high-end PCB exposure equipment, independent research and development of key subsystems and core components, and the manufacturing of new products like laser drilling machines [1] - The company reported that its production and operations for the third quarter are proceeding in an orderly manner, with specific data to be disclosed in upcoming regular reports [1]

Core Viewpoint - The company, Chipbond Technology, has a full order book and is operating at a high capacity, indicating strong demand for its high-end equipment [1] Group 1 - The company is currently experiencing a robust order backlog, suggesting strong market demand [1] - The production capacity is at a high level, reflecting the company's ability to meet customer needs [1] - The company is optimizing production scheduling and accelerating equipment commissioning to enhance capacity release [1]

Investment Rating - The report maintains a "Recommended" investment rating for the mechanical equipment industry [3] Core Viewpoints - The mechanical equipment industry is entering the "AI Era," which will create significant investment opportunities centered around AI infrastructure and AI empowerment [4][15] - The report highlights the historical performance of the mechanical equipment sector during previous five-year plans, indicating that each era has distinct characteristics that influence investment opportunities [6][10] Summary by Sections 1. Review of Five-Year Plans - The mechanical equipment industry has shown varying performance across the past four five-year plans, with significant growth during the Eleventh Five-Year Plan (642% increase) and a decline during the Thirteenth Five-Year Plan (-21% decrease) [6][7] - The industry ranked second among 28 sectors during the Eleventh Five-Year Plan and seventh during the Fourteenth Five-Year Plan, reflecting its evolving significance [7][8] 2. AI Infrastructure: Driving Demand for PCB Equipment, AIDC, Liquid Cooling, and Semiconductor Equipment - The AI computing revolution is expected to drive structural growth in PCB demand, with a projected annual growth rate of 16.3% for AI server-related HDI from 2023 to 2028 [19] - The report anticipates that the global PCB market will reach $73.565 billion in 2024, with a 5.8% year-on-year increase, and $94.661 billion by 2029 [19] - AI servers significantly increase the unit value of PCBs, with a single AI server PCB valued at $500-$800, compared to $200-$300 for traditional servers [20] - The report identifies challenges in capacity expansion, including long delivery times for high-end equipment and complex process validations [21] 3. AI Empowerment: The Rise of Embodied Intelligent Robots - The report discusses the practical applications of embodied intelligent robots in industrial logistics, elderly care, and specialized environments, emphasizing their potential to improve efficiency and safety [4][15] - It highlights the importance of technical feasibility and cost-effectiveness in the deployment of these robots [4] 4. Investment Recommendations - The report suggests focusing on AI infrastructure and AI empowerment as key investment directions for the mechanical equipment industry during the Fifteenth Five-Year Plan [4][15] - Specific recommendations include AI PCB equipment, AIDC power generation equipment, liquid cooling solutions, and semiconductor equipment [4][15] 5. Related Listed Companies - The report provides insights into key companies in the PCB equipment sector, such as Dazhu CNC, Chipbond Technology, and Dongwei Technology, highlighting their market performance and technological advancements [40][41]

Group 1 - The core point of the news is that the controlling shareholder and actual controller of Chipbond Microelectronics, Cheng Zhuo, plans to reduce his shareholding by up to 2,634,814 shares, which is no more than 2.00% of the total shares, due to personal funding needs [1] - As of the announcement date, Cheng Zhuo directly holds 36,787,490 shares, accounting for 27.92% of the company's total share capital [1] - The planned reduction will be executed through a combination of centralized bidding and block trading within three months after the announcement, with specific limits on the number of shares that can be sold in any 90-day period [1] Group 2 - Chipbond Microelectronics was listed on the Sci-Tech Innovation Board on April 1, 2021, with an issuance of 30,202,400 shares at a price of 15.23 yuan per share, raising a total of 460 million yuan [2] - The net amount raised after deducting issuance costs was 416 million yuan, which was 57.08 million yuan less than the original plan [2] - The funds raised were allocated to various projects, including 208 million yuan for upgrading high-end PCB laser direct imaging equipment and 108 million yuan for research and development of flat panel display lithography equipment [2] Group 3 - On August 8, 2023, Chipbond Microelectronics disclosed that it issued 10,497,245 shares at a price of 75.99 yuan per share, raising a total of approximately 797.69 million yuan [3] - After deducting issuance costs, the net amount raised was approximately 789.36 million yuan [3] - The main underwriter for this issuance was Haitong Securities [3] Group 4 - The total fundraising from both the IPO and the private placement amounts to 1.258 billion yuan [4] - On September 16, 2025, Chipbond Microelectronics announced that it had submitted application materials for issuing overseas listed shares (H shares) to the China Securities Regulatory Commission [4] - The company applied for listing H shares on the Hong Kong Stock Exchange on August 31, 2025 [4]

Core Viewpoint - Chip Microelectronics (芯碁微装) announced a share reduction plan by its controlling shareholder and chairman, Cheng Zhuo, due to personal funding needs, intending to sell up to 2,634,814 shares, representing no more than 2.00% of the total shares [1][2]. Summary by Sections Share Reduction Plan - Cheng Zhuo currently holds 36,787,490 shares, accounting for 27.92% of the total share capital [1]. - The planned reduction will occur through a combination of centralized bidding and block trading within three months after the announcement, starting 15 trading days post-announcement [1]. - The maximum number of shares to be sold via centralized bidding is limited to 1% of the total shares over any 90-day period, while block trading is capped at 2% [1]. Financial Implications - Based on the closing price of 141.34 yuan on September 30, the total cash raised from the share reduction could reach up to 372 million yuan [2]. - The company raised a total of 460 million yuan during its IPO, with a net amount of 416 million yuan after deducting issuance costs [3]. - The total fundraising from both the IPO and subsequent private placements amounts to 1.258 billion yuan [5]. Recent Developments - On September 16, 2025, Chip Microelectronics announced that its application for issuing overseas listed shares (H-shares) was accepted by the China Securities Regulatory Commission [6]. - The company submitted its application for H-share listing on the Hong Kong Stock Exchange on August 31, 2025 [6].

Core Viewpoint - The report highlights that the evolution of AI computing hardware is driving structural growth opportunities in the PCB (Printed Circuit Board) industry, with significant demand for high-layer and HDI boards due to the increasing requirements of AI applications and high-performance computing [1][27]. Industry Overview - The global PCB market size is projected to grow from $62 billion in 2020 to $75 billion in 2024, with a compound annual growth rate (CAGR) of 4.9%. By 2029, the market is expected to reach $93.7 billion, with a CAGR of 4.6% from 2024 to 2029 [1][27]. - The AI and high-performance computing sectors are anticipated to see substantial growth, with the market size expected to reach $15 billion by 2029, reflecting a CAGR of 20.1% from 2024 to 2029 [1][27]. Demand Drivers - The demand for high-layer PCBs and HDI boards is rapidly increasing, driven by the need for high-frequency, low-signal loss, and high-heat dissipation performance in AI servers. The value of a single AI server PCB is significantly higher than that of traditional servers [1][27]. - The market for high-layer PCBs is projected to reach $171 billion by 2029, while the share of high-end HDI boards in the global HDI market is expected to rise from 47% in 2024 to 57% in 2029, with a market size of $9.6 billion [1][27]. Technological Advancements - AI server requirements are pushing PCB technology upgrades, necessitating the use of high-layer (14-30 layers) and low-loss materials. This includes the adoption of low roughness reverse (RTF) copper foil and very low loss materials to minimize signal distortion [1][27]. - The report emphasizes the importance of material upgrades, such as the transition from traditional fiberglass cloth to low dielectric constant Q cloth, to meet the evolving demands of high-frequency applications [1][27]. Company Strategies - Companies in the PCB sector are actively expanding their capabilities. For instance, companies like Huadian Co. are advancing high-end PCB production, while Shenghong Technology has the capacity for mass production of high-layer boards and HDI boards [1][27]. - Equipment manufacturers like Chip Microelectronics and Dazhu CNC are introducing laser equipment tailored for high-end PCB processing, while material suppliers like Honghe Technology and Feilihua are developing low-dielectric electronic fabrics and high-end copper foils [1][27].

Core Viewpoint - The company announced that its controlling shareholder, chairman Cheng Zhuo, plans to reduce his stake in the company due to personal financial needs, starting from October 30, 2025, to January 29, 2026, by up to 2% of the total share capital [1] Group 1 - The planned reduction involves a maximum of 2.6348 million shares [1] - The reduction will be executed through centralized bidding and block trading methods [1]

Core Viewpoint - Chip equipment company, Chip Microelectronics, announced a share reduction plan by its controlling shareholder, Cheng Zhuo, due to personal funding needs [1] Group 1: Shareholding Information - Cheng Zhuo directly holds approximately 36.79 million shares, accounting for 27.92% of the company's total share capital [1] - The shares held by Cheng Zhuo were acquired before the company's initial public offering and are already listed and tradable [1] Group 2: Share Reduction Plan - Cheng Zhuo plans to reduce her holdings by no more than approximately 2% of the total shares, which equates to about 2.63 million shares [1] - The reduction will be executed through a combination of centralized bidding and block trading within three months after the announcement, starting 15 trading days post-announcement [1] - The plan specifies that in any consecutive 90-day period, the total shares reduced through centralized bidding cannot exceed 1% of the total shares, while block trading cannot exceed 2% [1] - Any changes in share capital due to dividends, stock splits, or new share issuance during the reduction period will lead to adjustments in the reduction quantity [1]

芯碁微装(688630.SH)发布公告，因自身资金需求，公司控股股东、实际控制人、董事长程卓女士拟通 过集中竞价和大宗交易相结合的方式减持不超过263.48万股公司股份，占公司股份总数比例不超过 2.00%，将于本减持计划公告披露之日起15个交易日后的3个月内进行。 ...

智通财经APP讯，芯碁微装(688630.SH)发布公告，因自身资金需求，公司控股股东、实际控制人、董 事长程卓女士拟通过集中竞价和大宗交易相结合的方式减持不超过263.48万股公司股份，占公司股份总 数比例不超过2.00%，将于本减持计划公告披露之日起15个交易日后的3个月内进行。 ...